阅读说明：本技术 基于梯度硅铝合金的内置流道电子封装模块及其成形方法 (Built-in flow channel electronic packaging module based on gradient silicon-aluminum alloy and forming method thereof ) 是由 李斐 邢大伟 于 2019-11-12 设计创作，主要内容包括：本发明公开了一种基于梯度硅铝合金的内置流道电子封装模块及其成形方法,所述内置流道电子封装模块包括封装盒体和盖板,其中：所述封装盒体的材料为梯度硅铝合金；所述梯度硅铝合金是沿某一方向硅含量呈梯度变化的高硅铝合金,沿该方向硅的体积分数由低到高呈现梯度变化；所述封装盒体具有内腔结构和蛇形流道结构；所述内腔结构在高硅层处加工；所述蛇形流道在低硅层处加工。该封装模块拥有优异的散热能力,同时该模块梯度硅铝的高硅层还具有与芯片良好的热匹配性,适用于提高电子信息领域封装模块的散热能力。(The invention discloses a built-in runner electronic packaging module based on gradient silicon-aluminum alloy and a forming method thereof, wherein the built-in runner electronic packaging module comprises a packaging box body and a cover plate, wherein: the packaging box body is made of gradient silicon-aluminum alloy; the gradient silicon-aluminum alloy is a high-silicon-aluminum alloy with silicon content changing in a gradient manner along a certain direction, and the volume fraction of silicon changes in a gradient manner from low to high along the direction; the packaging box body is provided with an inner cavity structure and a snake-shaped flow passage structure; the inner cavity structure is processed at the high silicon layer; the serpentine flow channel is machined at the low silicon layer. The packaging module has excellent heat dissipation capacity, and meanwhile, the gradient silicon-aluminum high silicon layer of the module also has good heat matching performance with a chip, so that the packaging module is suitable for improving the heat dissipation capacity of the packaging module in the field of electronic information.)

1. The utility model provides a built-in runner electronic packaging module based on gradient silicon-aluminum alloy which characterized in that built-in runner electronic packaging module is including encapsulation box body and apron, wherein:

the packaging box body is made of gradient silicon-aluminum alloy;

the gradient silicon-aluminum alloy is a high-silicon-aluminum alloy with silicon content changing in a gradient manner along a certain direction, and the volume fraction of silicon changes in a gradient manner from low to high along the direction;

the packaging box body is provided with an inner cavity structure and a snake-shaped flow passage structure;

the inner cavity structure is processed at the high silicon layer;

the serpentine flow channel is machined at the low silicon layer.

2. The gradient silicon aluminum alloy-based built-in flow channel electronic package module as claimed in claim 1, wherein the thickness of the low silicon layer is 3 ~ 4mm, and the total thickness of the high silicon layer and the transition layer is 11 ~ 12 mm.

3. The gradient silicon-aluminum alloy based built-in flow channel electronic packaging module as claimed in claim 1, wherein the external dimension of the packaging box body is 65 x 48 mm.

4. The gradient silicon aluminum alloy-based built-in flow channel electronic packaging module as claimed in claim 1, wherein the serpentine flow channel has a square cross section with a cross-sectional dimension of 1 ~ 1.5.5 x 1 ~ 1.5.5 mm and a dimension of 5 ~ 8mm from the edge of the box body.

5. The gradient silicon-aluminum alloy based built-in flow channel electronic packaging module as claimed in claim 1, wherein the cover plate is made of aluminum alloy, the size of the cover plate is consistent with that of the packaging box body, and the thickness of the cover plate is 3 ~ 5 mm.

6. The method for forming the electronic packaging module with the built-in flow channel based on the gradient silicon-aluminum alloy according to any one of claims 1 to 5, characterized by comprising the following steps:

step one, preparing a packaging box body and a cover plate blank:

preparing a gradient silicon-aluminum packaging box body blank and a cover plate blank by adopting wire cut electrical discharge machining;

step two, processing a snake-shaped flow passage and finely processing the connecting surface of the packaging box body and the cover plate:

primarily processing a snake-shaped flow channel on the low silicon layer of the packaging box body by adopting a numerical control milling machine, and finely processing the connecting surface of the packaging box body and the cover plate;

step three, sample surface treatment before welding:

placing the surfaces to be welded of the packaging box body and the cover plate into an acetone solution for ultrasonic treatment to remove oil stains and oxidation films on the surfaces to be welded;

step four, diffusion welding:

placing the box body to be welded and the cover plate after surface treatment in a vacuum diffusion welding furnace, vacuumizing, welding, forming and preserving heat, and taking out for air cooling when the temperature is reduced to 60 ~ 80 ℃;

step five, testing the pressure resistance value of the flow channel:

carrying out pressure resistance test on the welded serpentine flow channel;

step six, processing an inner cavity of the packaging module:

and processing the inner cavity of the welded blank by adopting a processing center, and thus, processing the packaging module with the built-in runner structure.

7. The method for forming the built-in runner electronic packaging module based on the gradient Si-Al alloy of claim 6, wherein the surface roughness Ra of the connecting surface is less than or equal to 1.6.

8. The method for forming the gradient silicon-aluminum alloy based built-in flow channel electronic packaging module according to claim 6, wherein the ultrasonic treatment time is 5 ~ 15 min.

9. The method for forming an electronic packaging module with built-in flow channel based on gradient Si-Al alloy as claimed in claim 6, wherein the vacuum pumping is performed to 1.0 x 10^-3Welding and forming at the welding temperature of 530 ~ 550 ℃ and the welding pressure of 10 ~ 15MPa under the condition of below Pa, keeping the temperature for 60 ~ 90min and cooling at the cooling rate of 5 ~ 15 ℃/min.

10. The method for forming a gradient Si-Al alloy based built-in flow channel electronic packaging module according to claim 6, wherein the pressure resistance value of the pressure resistance test is 4MPa, the pressure holding time is 20 ~ 40min, and the module has no leakage and deformation.

Technical Field

The invention relates to a packaging module and a forming method thereof, in particular to a built-in runner type gradient silicon-aluminum electronic packaging module and a forming method thereof.

Background

In the field of electronic information, the integration level of chips in a package module is higher and higher, and the power of the chips is higher and higher, so that higher requirements are put forward on the heat dissipation performance of the package module. Meanwhile, the packaging material is required to have good thermal matching property with the electronic chip, can meet the requirement of light weight, has certain strong plasticity index and is convenient to process.

In the conventional packaging module, heat generated by the chip during working is radiated only by the heat conduction mode of the chip and packaging materials, and the heat conduction capability of the conventional packaging materials such as copper, aluminum, kovar alloy, molybdenum copper, high-silicon aluminum and the like cannot meet the heat radiation requirement of the modern high-power packaging module; meanwhile, the thermal expansion coefficient of packaging materials such as copper and aluminum is large, and the thermal matching with the chip is poor.

Disclosure of Invention

Aiming at the high heat dissipation requirement of the packaging module in the field of electronic information at present, the invention provides a built-in runner electronic packaging module based on gradient silicon-aluminum alloy and a forming method thereof. The packaging module has excellent heat dissipation capacity, and meanwhile, the gradient silicon-aluminum high silicon layer of the module also has good heat matching performance with a chip, so that the packaging module is suitable for improving the heat dissipation capacity of the packaging module in the field of electronic information.

The purpose of the invention is realized by the following technical scheme:

the utility model provides a built-in runner electronic packaging module based on gradient silicon-aluminum alloy, includes encapsulation box body and apron, wherein:

the packaging box body is made of gradient silicon-aluminum alloy;

the gradient silicon-aluminum alloy is a high-silicon-aluminum alloy with silicon content changing in a gradient manner along a certain direction, and the volume fraction of silicon changes in a gradient manner from low to high along the direction;

the packaging box body is provided with an inner cavity structure and a snake-shaped flow passage structure;

the inner cavity structure is processed at the high silicon layer;

the serpentine flow channel is machined at the low silicon layer.

A forming method of the electronic packaging module structure with the built-in flow channel comprises the following steps:

step one, preparing a packaging box body and a cover plate blank:

preparing a gradient silicon-aluminum packaging box body blank and a cover plate blank by adopting wire cut electrical discharge machining;

step two, processing a snake-shaped flow passage and finely processing the connecting surface of the packaging box body and the cover plate:

a snakelike flow channel is primarily processed on the low silicon layer of the packaging box body by a numerical control milling machine, and the connecting surface of the packaging box body and the cover plate is finely processed, so that the surface roughness Ra of the connecting surface is less than or equal to 1.6;

step three, sample surface treatment before welding:

placing the surfaces to be welded of the packaging box body and the cover plate in an acetone solution for 5 ~ 15min by ultrasonic treatment to remove oil stains and oxidation films on the surfaces to be welded;

step four, diffusion welding:

placing the box body to be welded and the cover plate after surface treatment in a vacuum diffusion welding furnace, and vacuumizing to 1.0 multiplied by 10^-3Setting the welding temperature below Pa to 530 ~ 550 ℃, welding and forming by adopting the welding pressure of 10 ~ 15MPa, and preserving the heat for 60 ~ 90min, setting the cooling rate to 5 ~ 15 ℃/min after preserving the heat, taking out and air cooling when the temperature is reduced to 60 ~ 80 ℃;

step five, testing the pressure resistance value of the flow channel:

carrying out pressure resistance test on the welded serpentine flow channel, wherein the pressure resistance value is required to be 4MPa, the pressure maintaining time is required to be 20 ~ 40min, and no leakage or deformation exists;

step six, processing an inner cavity of the packaging module:

and processing the inner cavity of the welded blank by adopting a processing center, and thus, processing the packaging module with the built-in runner structure.

Compared with the prior art, the invention has the following advantages:

(1) the heat dissipation mode of the traditional packaging module is changed, the liquid cooling heat dissipation mode of the packaging module is realized, and the heat dissipation capacity of the packaging module is greatly improved.

(2) The gradient silicon-aluminum alloy is adopted as the packaging box body, and the advantages of the silicon-aluminum alloy low silicon layer and the high silicon layer can be simultaneously exerted: the excellent solderability of the low silicon layer and the thermal matching of the high silicon layer and the chip are exerted.

(3) The volume fraction of the reinforcing phase (Si particles) in the silicon-aluminum layer can be adjusted within a certain range so as to meet the requirements of different electronic packaging materials.

Drawings

Fig. 1 is a schematic model diagram of an electronic package module with a built-in flow channel based on gradient silicon-aluminum according to the present invention;

fig. 2 is a schematic structural diagram of a gradient si-ai based electronic package module with built-in flow channel according to the present invention, (a) a front view, (b) a side view, and (c) a top view;

FIG. 3 is a schematic structural diagram of the cover plate of the present invention, (a) a front view, (b) a side view, and (c) a top view;

FIG. 4 is a schematic structural diagram of a package box of the present invention, (a) a front view, (b) a side view, and (c) a top view;

the device comprises a base, a cover plate, a serpentine flow channel and a packaging box body, wherein the cover plate is 1, the serpentine flow channel is 2, and the packaging box body is 3.

Detailed Description

The technical solution of the present invention is further described below with reference to the accompanying drawings, but not limited thereto, and any modification or equivalent replacement of the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention shall be covered by the protection scope of the present invention.