阅读说明：本技术 一种光模块及光网络装置 (Optical module and optical network device ) 是由 李福宾 于 2019-10-21 设计创作，主要内容包括：本申请提供的光模块及光网络装置,通过集成电路芯片的至少一个通信接口连接到印制电路板表面上的焊盘,便于在外部通信工装连接到焊盘时,通过焊盘间接连接到集成电路芯片的至少一个通信接口,通过焊盘对集成电路芯片的内容进行读写,进而完成对集成电路芯片的测试。同时,焊盘与微控制芯片的至少一个通信接口连接,在外部通信工装连接到焊盘时,可以通过焊盘间接的连接到微控制芯片的至少一个通信接口,通过焊盘对微控制芯片的内容进行读写。可见,本申请实施例中用户只需在集成电路芯片的表面上设置与通信接口相连接的焊盘的方式便可以实现集成电路芯片测试或对微控制单元的测试。(The optical module and the optical network device provided by the application are connected to the bonding pad on the surface of the printed circuit board through at least one communication interface of the integrated circuit chip, when an external communication tool is connected to the bonding pad, the bonding pad is indirectly connected to the at least one communication interface of the integrated circuit chip, the content of the integrated circuit chip is read and written through the bonding pad, and then the test of the integrated circuit chip is completed. Meanwhile, the bonding pad is connected with at least one communication interface of the micro control chip, when the external communication tool is connected to the bonding pad, the bonding pad can be indirectly connected to the at least one communication interface of the micro control chip, and the content of the micro control chip is read and written through the bonding pad. Therefore, in the embodiment of the application, the user can realize the test of the integrated circuit chip or the test of the micro control unit only by arranging the bonding pad connected with the communication interface on the surface of the integrated circuit chip.)

1. A light module, comprising: the system comprises a printed circuit board, an integrated circuit chip and a micro control unit;

the surface of the printed circuit board is provided with an independent pad for communicating with an external communication tool;

at least one communication interface of the integrated circuit chip is electrically connected with the bonding pad, so that an external communication tool can read and write the content of the integrated circuit chip through the bonding pad;

at least one communication interface of the micro control unit is electrically connected with the bonding pad, so that an external communication tool can read and write the content of the micro control unit through the bonding pad; and the communication interface of the integrated circuit chip and the communication interface of the micro control unit are of the same type.

2. The optical module of claim 1, wherein at least one firmware writing interface of the MCU is electrically connected to the pads such that an external communication tool writes MCU firmware to the MCU through the pads.

3. The light module of claim 2, wherein the pad is in a chopped state with the communication interface of the micro control unit in response to the communication interface of the micro control unit being configured in a high impedance state.

4. The optical module of claim 1, wherein the communication interface of the integrated circuit chip is an IIC communication interface and the micro control unit communication interface is an IIC communication interface.

5. The optical module of claim 1, wherein the communication interface of the integrated circuit chip is an MDIO communication interface, and the micro control unit communication interface is an MDIO communication interface.

6. A light module as claimed in any one of claims 1 to 5, characterized in that the surface of the printed circuit board is provided with separate data pads and clock pads;

the data pad is connected to a data communication interface of the integrated circuit chip, and the clock pad is connected to a clock communication interface of the integrated circuit chip.

7. A light module as claimed in any one of claims 1 to 5, characterized in that the surface of the printed circuit board is provided with separate data pads and clock pads;

the data pad is connected to a data communication interface of the micro control unit, and the clock pad is connected to a clock communication interface of the micro control unit.

8. An optical network device, comprising: the light module of any one of claims 1-7.

Technical Field

The embodiment of the application relates to the optical communication technology. And more particularly, to an optical module and an optical network device.

Background

An optical module generally refers to an integrated module for photoelectric conversion. Usually, an integrated circuit chip such as a laser chip and an amplifier chip is packaged in the optical module, and photoelectric conversion is realized by each integrated circuit chip.

The packaged optical module is an essential step for testing the performance of each integrated circuit chip. In the optical module shown in the prior art, an external communication tool is connected with a communication interface of an integrated circuit chip, and the performance of the integrated circuit chip is tested by reading or writing information in the integrated circuit chip.

With the trend of the optical module towards integration and miniaturization, a communication interface for an integrated circuit chip in the optical module is smaller and smaller, and a user cannot directly complete testing through the communication interface of the integrated circuit chip. Therefore, how to reasonably arrange the communication interfaces of the devices to be connected is an urgent problem to be solved.

Disclosure of Invention

The first optical module and the optical network device in the embodiments of the present application solve technical problems in the prior art.

A first aspect of an embodiment of the present application shows an optical module, including: the system comprises a printed circuit board, an integrated circuit chip and a micro control unit;

the surface of the printed circuit board is also provided with an independent pad for communicating with an external communication tool;

at least one communication interface of the integrated circuit chip is electrically connected with the bonding pad, so that an external communication tool can read and write the content of the integrated circuit chip through the bonding pad.

At least one communication interface of the micro control unit is electrically connected with the bonding pad, so that an external communication tool can read and write the content of the micro control unit through the bonding pad;

the communication interface of the integrated circuit chip and the communication interface of the micro control unit are of the same type.

A second aspect of the embodiments of the present application shows an optical network device, including: the embodiment of the application shows an optical module.

The optical module and the optical network device provided by the application are connected to the bonding pad on the surface of the printed circuit board through at least one communication interface of the integrated circuit chip, and are convenient to be indirectly connected to the at least one communication interface of the integrated circuit chip through the bonding pad when an external communication tool is connected to the bonding pad, so that a user can read and write the content of the integrated circuit chip through the bonding pad, and then the test of the integrated circuit chip is completed. Meanwhile, the bonding pad is connected with at least one communication interface of the micro control chip, and when the external communication tool is connected to the bonding pad, the bonding pad can be indirectly connected to the at least one communication interface of the micro control chip, so that a user can read and write the content of the micro control chip through the bonding pad. Furthermore, when the micro control chip is communicated with the integrated circuit chip, the micro control chip can be bypassed by an external communication tool to directly communicate with the integrated circuit chip, and the internal information can be read or written. Therefore, in the embodiment of the application, the user can realize the test of the integrated circuit chip or the test of the micro control unit only by arranging the bonding pad connected with the communication interface on the surface of the integrated circuit chip.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present invention;

fig. 4 is an exploded schematic view of an optical module structure according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a circuit board provided by an embodiment of the invention;

FIG. 6 is a simplified diagram of a printed circuit board according to a preferred embodiment;

FIG. 7 is a simplified diagram of a printed circuit board according to a preferred embodiment;

FIG. 8 is a simplified diagram of a printed circuit board according to a preferred embodiment;

fig. 9 is a simplified diagram of a printed circuit board according to a preferred embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

To make the objects, technical solutions and advantages of the exemplary embodiments of the present application clearer, the technical solutions in the exemplary embodiments of the present application will be clearly and completely described below with reference to the drawings in the exemplary embodiments of the present application, and it is obvious that the described exemplary embodiments are only a part of the embodiments of the present application, but not all the embodiments.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Optical communication enables signals to be transmitted using two different carriers, electrical and optical. Optical signals carrying information are transmitted in the optical waveguide for optical fiber communication, and the information transmission with low cost and low loss can be realized by utilizing the passive transmission characteristic of light in the optical waveguide such as the optical fiber; the information processing devices such as computers use electrical signals, which requires the interconversion between electrical signals and optical signals in the optical fiber communication system.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.

An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit is provided with an optical module pin 102 and is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable pin 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical fiber terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector pin is arranged in the cage 106 and used for being connected with an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic diagram of an optical module structure according to an embodiment of the present invention, and fig. 4 is an exploded schematic diagram of an optical module structure according to an embodiment of the present invention, as shown in fig. 3 and fig. 4, an optical module 200 according to an embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a light emission sub-module 500, a light reception sub-module 400, and an optical fiber socket 600.

The upper shell 201 and the lower shell 202 form a package cavity with two openings, specifically, two ends of the package cavity are opened (204, 205) in the same direction, or two openings in different directions are opened; one of the openings is an electrical port 204 for inserting into an upper computer such as an optical network Unit, the other opening is an optical port 205 for external optical fiber access to connect with an internal optical fiber, and the circuit board 300, the optical receiving sub-module 400, the transmitting sub-module 500, and a Micro Control Unit (MCU) and other optoelectronic devices are located in the package cavity.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper casing, lower casing to combine is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

The unlocking handle 203 is positioned on the outer wall of the cavity/lower shell 202, and the tail end of the unlocking handle can be pulled to enable the unlocking handle to relatively move on the surface of the outer wall; when the optical module is inserted into the upper computer, the unlocking handle fixes the optical module in the cage of the upper computer, and the clamping relation between the optical module and the upper computer is released by pulling the unlocking handle, so that the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is located in the cavity formed by the upper and the housing, and the circuit board 300 is electrically connected to the tosa 500 and the rosa 400 respectively.

The transimpedance amplifier chip is closely associated with the light receiving chip, the short-distance wiring design can ensure good received signal quality, and in one packaging form of the optical module, the transimpedance amplifier chip and the light receiving chip are packaged together in an independent packaging body, such as the same coaxial tube shell TO or the same square cavity; the independent packaging body is independent of the circuit board, and the light receiving chip and the foot-spanning amplifying chip are electrically connected with the circuit board through the independent packaging body; in another package form of the optical module, the light receiving chip and the transimpedance amplifier chip may be disposed on a surface of the circuit board without using a separate package. Of course, the light receiving chip can be packaged independently, and the transimpedance amplification chip is arranged on the circuit board, so that the received signal quality can meet certain relatively low requirements.

The chip on the circuit board 300 may be an all-in-one chip, for example, a laser driver chip and a micro control unit chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and a micro control unit chip are integrated into one chip, and the chip is an integration of a circuit, but the functions of each circuit do not disappear due to aggregation, and only the circuit form is integrated. Therefore, when the circuit board is provided with three independent chips, namely the micro control unit, the laser driving chip and the amplitude limiting amplifying chip, the scheme is equivalent to that of arranging a single chip with three functions in one on the circuit.

The circuit board 300 has a golden finger on the surface of its end, the golden finger is composed of a pin independent from each other, the circuit board is inserted into the electric connector in the cage, and the golden finger is electrically connected with the upper computer.

The circuit board 300 is a carrier of main electrical components of the optical module, and the electrical components not disposed on the circuit board are finally electrically connected to the circuit board, and the electrical connectors on the circuit board realize the electrical connection between the optical module and the host computer thereof. The electrical connector typically used by the optical module is a gold finger.

The optical module further includes a transmitter optical subassembly and a receiver optical subassembly, which may be collectively referred to as an optical subassembly. Fig. 4 is an exploded view of an optical module according to an embodiment of the present invention, and as shown in fig. 4, the optical module according to the embodiment of the present invention includes a tosa 500 and a rosa 400, and the tosa and the rosa are arranged on the surface of a circuit board in a staggered manner, which is beneficial to achieve a better electromagnetic shielding effect.

The rosa 400 is disposed on the surface of the circuit board 300, and in a common packaging method (such as a coaxial TO package), the rosa is packaged separately and physically separated from the circuit board, and is electrically connected through a flexible board.

The tosa 500 is disposed on a surface of the circuit board 300. in another common packaging (e.g., a coaxial TO package), the tosa is packaged separately and physically separated from the circuit board and electrically connected TO the pcb.

The tosa 500 is located in a package cavity formed by the upper and lower shells, as shown in fig. 4, the circuit board 300 is provided with a notch (not shown) for placing the tosa; the notch can be arranged in the middle of the circuit board and also can be arranged at the edge of the circuit board; the transmitter optical subassembly is arranged in the gap of the circuit board in an embedding mode, so that the circuit board can conveniently extend into the transmitter optical subassembly, and the transmitter optical subassembly and the circuit board can be conveniently fixed together.

The tosa 500, in turn, is connected to the fiber optic receptacle 600 via fiber optic adapters (not shown in fig. 4) and optical fibers. One end of the optical fiber (labeled in the figure) is connected with the optical fiber adapter, and the other end is connected with the optical fiber socket 600.

The circuit board 300 is provided with chips, capacitors, resistors and other electrical components. The method includes selecting a corresponding chip according to a product requirement, where the common chip includes a Microcontroller (Microcontroller Unit) and a control chip (which may also be referred to as an integrated circuit chip in the technical solution shown in this application), where the control chip may be a clock data recovery chip CDR, a laser driver chip, a transimpedance amplifier TIA chip, a limiting amplifier LA chip, a power management chip, and the like.

The receiving end of the optical module comprises an optical receiving chip, a transimpedance amplifier chip TIA, an amplitude limiting amplifier chip LA, a first low-pass filter circuit, a second low-pass filter circuit, a comparison circuit and a microprocessor. The transmitting end of the optical module comprises a driving chip and the like.

The micro control Unit is a computer with a chip level formed by appropriately reducing the frequency and specification of a Central Processing Unit (CPU) and integrating peripheral ports such as a memory, a counter, a USB, an a/D conversion, a UART, a PLC, a DMA, and the like on a single chip. Different chips are controlled in different combinations through the connection of the ports of the micro control unit and the control chip.

Fig. 5 is a schematic structural diagram of a circuit board (which may also be referred to as a printed circuit board in the embodiments of the present application) according to an embodiment of the present invention, and fig. 6 is a schematic structural diagram of the circuit board shown in fig. 5. As shown in fig. 6, an integrated circuit chip 12 is integrally provided on the printed circuit board 11.

An integrated circuit chip 12 is disposed on a surface of the printed circuit board 11. The surface of the printed circuit board 11 is also provided with a separate pad 11A. At least one communication interface 12A of the integrated circuit chip 12 is connected to a pad 11A on the printed circuit board 11, wherein the pad 11A is convenient for being connected to an external communication tool, so that a user can read and write the content of the integrated circuit chip through the pad 11A, and then the test of the integrated circuit chip is completed.

It is contemplated that the addition of one or more pads will have minimal impact on the overall printed circuit board 11 layout. In the embodiment of the present application, the individual pads 11A are provided on the surface of the printed circuit board 11. At least one communication interface 12A of the integrated circuit chip 12 is electrically connected to the pad 11A on the printed circuit board 11, so that when an external communication tool (not shown in fig. 6) is connected to the pad 11A, the communication interface 12A is indirectly connected to the integrated circuit chip 12 through the pad 11A, and a user can read and write the content of the integrated circuit chip 12 through the pad 11A, thereby completing a test on the signal of the integrated circuit chip.

The optical module shown in this embodiment is connected to the pad on the surface of the printed circuit board through at least one communication interface of the integrated circuit chip, so that when the external communication tool is connected to the pad, the optical module is indirectly connected to the at least one communication interface of the integrated circuit chip through the pad, so that a user can read and write the content of the integrated circuit chip through the pad, and then the test on the integrated circuit chip is completed. Therefore, in the embodiment of the application, the testing of the integrated circuit chip can be realized only by arranging the bonding pad connected with the firmware writing interface on the surface of the printed circuit board.

This embodiment ends by this.

In a feasible embodiment, the pads in the printed circuit board shown in fig. 6 may also be connected to the micro-control chip communication interface 13 of the optical module, so as to enable the external communication tool to read or write the content of the micro-control chip through the pads. A specific printed circuit board structure can be seen in fig. 7.

Fig. 7 is a schematic structural diagram of a printed circuit board according to a preferred embodiment, and an integrated circuit chip 12 and a micro control chip 13 are disposed on the printed circuit board 11 shown in fig. 7. At least one communication interface 13A of the micro control chip 13 is connected to a pad 11A on the printed circuit board 11, so that when an external communication tool (not shown in fig. 7) is connected to the pad 11A, the at least one communication interface 13A of the micro control chip 13 is indirectly connected through the pad 11A, and a user can read and write the content of the micro control chip 13 through the pad 11A, thereby completing a test on a signal of the micro control chip.

With continued reference to fig. 7, the communication interface 13A of the mcu 13 is electrically connected to the communication interface 12A of the ic 12, so that the mcu 13 can communicate with the ic 12. Furthermore, because the communication interface 12A of the integrated circuit chip 12 can be directly communicated with the external communication tool through the bonding pad 11A, the micro control chip 13 can communicate with the integrated circuit chip 12, and simultaneously, the external communication tool can bypass the micro control chip 13 to directly communicate with the integrated circuit chip 12, so as to read or write the internal information. The communication interface of the integrated circuit chip and the communication interface of the micro control unit are of the same type, and are both IIC communication interfaces or MDIO communication interfaces.

The optical module shown in this embodiment is connected to the pad on the surface of the printed circuit board through at least one communication interface of the integrated circuit chip, so that when the external communication tool is connected to the pad, the optical module is indirectly connected to the at least one communication interface of the integrated circuit chip through the pad, so that a user can read and write the content of the integrated circuit chip through the pad, and then the test on the integrated circuit chip is completed. Meanwhile, the bonding pad is connected with at least one communication interface of the micro control chip, and when the external communication tool is connected to the bonding pad, the bonding pad can be indirectly connected to the at least one communication interface of the micro control chip, so that a user can read and write the content of the micro control chip through the bonding pad. Furthermore, when the micro control chip is communicated with the integrated circuit chip, the micro control chip can be bypassed by an external communication tool to directly communicate with the integrated circuit chip, and the internal information can be read or written.

This embodiment ends by this.

In a feasible embodiment, the bonding pad of the printed circuit board shown in fig. 7 may also be connected to the firmware writing interface of the optical module micro control chip, so that the external communication tool writes the MCU firmware into the micro control chip through the bonding pad. In particular, the printed circuit board can be seen in fig. 8.

Fig. 8 is a schematic structural diagram of a printed circuit board according to a preferred embodiment, and fig. 8 shows a scheme in which an integrated circuit chip 12 and a micro control chip 13 are integrated on a surface of a printed circuit board 11. The surface of the printed circuit board is provided with individual pads 11A.

At least one communication interface 12A of the integrated circuit chip 12 is connected to the pads 11A on the printed circuit board 11, so that when an external communication tool (not shown in fig. 8) is connected to the pads, the at least one communication interface of the integrated circuit chip can be indirectly connected to the pads through the pads, so that a user can read and write the contents of the integrated circuit chip through the pads.

At least one communication interface 13A of the micro control chip 13 is connected to a pad 11A on the printed circuit board 11, so that when the external communication tool is connected to the pad, the external communication tool can be indirectly connected to the at least one communication interface of the micro control chip through the pad, so that a user can read and write the content of the micro control chip through the pad.

At least one firmware writing interface 13B of the micro control chip 13 is connected to a pad 11A on the printed circuit board 11, so that when the external communication tool is connected to the pad 11A, a user can write MCU firmware into the micro control chip 13 through the pad 11A by indirectly connecting to the at least one firmware writing interface 13B of the micro control chip 13 through the pad 11A.

At least one communication interface 13A of the micro control chip 13 is electrically connected with at least one communication interface 12A of the integrated circuit chip 12 so that the micro control chip 13 can communicate with the integrated circuit chip.

Alternatively, when the external communication tool is connected to the mcu 13 through the pads at the same time, it is determined whether the external communication tool is in communication with the communication interface of the mcu 13 or the firmware writing interface by detecting the communication interface 13A of the mcu 13 and the signal state of the interface. If the communication interface 13A of the micro control chip 13 and the signal state of the interface both satisfy a preset condition, the micro control chip 13 determines to enter a firmware programming mode; otherwise, the micro control chip 13 determines that the firmware programming mode is not entered.

For example, the communication interface 13A of the microchip 13 is configured in a high impedance state, the pad and the communication interface of the microchip 13 are in a chopping state, and the microchip 13 determines to enter a firmware programming mode. Of course, the micro control chip 13 may also determine whether the micro control chip 13 enters the firmware programming mode in other manners, which is not described in this embodiment.

The optical module that this application provided is connected to the pad on the printed circuit board surface through at least one firmware write interface in the little control chip, when being convenient for when external communication frock is connected to the pad, is indirectly connected to at least one firmware write interface in the little control chip through the pad to so that the user can write in the MCU firmware to little control chip through the pad. Therefore, in the embodiment of the application, the writing of the MCU firmware into the micro control chip of the optical module can be realized only by arranging the bonding pad connected with the firmware writing interface on the surface of the printed circuit board.

Further, the optical module provided by the embodiment of the application can support external communication tools such as a writer to write the MCU firmware into the micro control chip, so that the firmware writing efficiency of the micro control chip in the optical module provided by the embodiment of the application is high.

This completes the description of the present embodiment.

In specific application, the communication interface of the integrated circuit chip can support a single wire system or a2 wire system; if the communication interface of the integrated circuit chip supports a single wire system, the clock signal and the data signal multiplex a bus (that is, the clock line and the data line correspond to a bus), and one communication interface of the corresponding integrated circuit chip is connected with one pad. If the communication interface of the integrated circuit chip supports a 2-wire system, the clock type signal corresponds to one clock wire, and the data type signal corresponds to one data wire. Correspondingly, the communication interface of the integrated circuit chip comprises: a data communication interface and a clock communication interface. Correspondingly, the surface of the printed circuit board is provided with two mutually independent bonding pads which are divided into a data bonding pad and a clock bonding pad. The data communication interface and the data pad form a data channel, and the data channel is used for transmitting a data type signal; the clock communication interface and the clock pad form a clock channel, and the clock channel is used for transmitting clock type signals. The clock communication interface may be an MDC interface or an SCL interface. The data communication interface can be an MDIO interface and also can be an SDA interface. However, it is ensured that the communication interface of the integrated circuit chip is of the same type as the communication interface of the microcontroller unit.

Fig. 9 is a schematic diagram of a printed circuit board according to a preferred embodiment, on which an integrated circuit chip 12 and a micro control chip 13 are integrally disposed on a printed circuit board 11; wherein, printed circuit board surface is provided with two independent pads and is respectively: a clock pad 11a1 and a data pad 11a 2; the clock pad 11A1 is connected to the clock communication interface 12A1 of the integrated circuit chip 12 via a clock line, and the data pad 11A2 is connected to the data communication interface 12A2 of the integrated circuit chip 12 via a data line. When the external communication tool is connected to the clock pad 11a1 and the data pad 11a2, the external communication tool is indirectly connected to the clock communication interface 12a1 of the integrated circuit chip 12 through the clock pad 11a1 to read and write the clock signal of the integrated circuit chip. Meanwhile, the external communication tool is indirectly connected to the data communication interface 12a2 of the integrated circuit chip 12 through the data pad 11a2 to read and write data signals of the integrated circuit chip.

The clock pad 11a1 is also connected to the clock communication interface 13a1 of the microchip 13, and the data pad 11a2 is also connected to the data communication interface 13a2 of the microchip 13. When the external communication tool is connected to the clock pad 11a1 and the data pad 11a2, the external communication tool is indirectly connected to the clock communication interface 13a1 of the microchip through the clock pad 11a1 to read and write the clock signal of the microchip. Meanwhile, the external communication tool is indirectly connected to the data communication interface 13a2 of the micro control chip through the data pad 11a2 so as to read and write the data signals of the integrated circuit chip.

The clock communication interface 13a1 of the microchip 13 is connected to the clock communication interface 12a1 of the ic chip, and the data communication interface 13a2 of the microchip 13 is connected to the data communication interface 12a2 of the ic chip, so as to realize communication between the microchip 13 and the ic chip 12.

The clock pad 11a1 is further connected to a clock firmware write interface 13B1 of the microchip 13, the data pad 11a2 is further connected to a data firmware write interface 13B2 of the microchip 13, and a user can write MCU firmware into the microchip 13 through the clock pad 11a1 and the data pad 11a 2.

So far, the description of the optical module is completed.

An embodiment of the present application further provides an optical network device, including: the optical module may adopt the structure in the above-mentioned optical module embodiments of the present application, and the implementation principle thereof is similar, and is not described herein again.

The optical network device provided by the embodiment of the application is connected to the bonding pad on the surface of the printed circuit board of the optical module through at least one firmware writing interface in the micro control chip of the optical module in the optical network device, so that when an external communication tool is connected to the bonding pad, the bonding pad is indirectly connected to at least one communication interface in the integrated circuit chip of the optical module, and therefore a user can read and write the content of the integrated circuit chip through the bonding pad. Therefore, in the embodiment of the application, a user can read and write the content of the integrated circuit chip only by arranging the bonding pad connected with the communication interface on the surface of the printed circuit board of the optical module, and then the test of the integrated circuit chip is completed. Therefore, in the embodiment of the application, the testing of the integrated circuit chip can be realized only by arranging the bonding pad connected with the firmware writing interface on the surface of the printed circuit board.

Further, the optical module in the optical network device provided in the embodiment of the present application may support an external communication tool such as a writer to write MCU firmware into a micro control chip of the optical module, so that the firmware writing efficiency of the micro control chip of the optical module in the optical network device provided in the embodiment of the present application is high.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.

It is obvious to those skilled in the art that, for convenience and simplicity of description, the foregoing division of the functional modules is merely used as an example, and in practical applications, the above function distribution may be performed by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to perform all or part of the above described functions.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.