阅读说明：本技术 一种栅格阵列封装模块及终端 (grid array package module and terminal ) 是由 郑美玲 刘洋 于 2017-08-03 设计创作，主要内容包括：本申请提供了一种栅格阵列封装模块及终端,该封装模块包括：芯片,设置在芯片表面的接地焊盘组及功能焊盘组,其中,接地焊盘组设置在芯片的中心位置,功能焊盘组设置在芯片的周边区域且环绕接地焊盘组；功能焊盘组包括多个功能焊盘,每个功能焊盘的形状为圆形,且每个功能焊盘的直径介于第一设定阈值内,相邻功能焊盘的中心距介于第二设定阈值内。在上述实施方案中,功能焊盘采用圆形焊盘,相对于现有技术中的方形焊盘,圆形焊盘的焊盘可以做的更小,由焊盘与信号辐射的对应关系：焊盘越小,辐射越小,可以看出,功能焊盘采用圆形焊盘可以有效的改善焊盘的辐射情况,并且圆形焊盘相比与方形焊盘来说,辐射效果更小。(The application provides grid array package modules and terminals, the package modules include a chip, a ground pad group and a functional pad group, wherein the ground pad group is arranged at the center of the chip, the functional pad group is arranged in the peripheral area of the chip and surrounds the ground pad group, the functional pad group includes a plurality of functional pads, each functional pad is circular, the diameter of each functional pad is within a set threshold, and the center distance between adjacent functional pads is within a second set threshold.)