阅读说明：本技术 密封用片和电子元件装置的制造方法 (Sealing sheet and method for manufacturing electronic component device ) 是由 大原康路 土生刚志 清水祐作 饭野智绘 于 2019-06-24 设计创作，主要内容包括：一种密封用片,被用于形成密封层,所述密封层将被安装于基板的厚度方向的一个面的电子元件密封。所述密封用片的90℃的粘度为5kPa以上。由密封试验测定的最大长度L为150μm以下。(A sealing sheet is used for forming a sealing layer for sealing an electronic element mounted on one surface in a thickness direction of a substrate. The sealing sheet has a viscosity of 5kPa or higher at 90 ℃. The maximum length L measured by the sealing test is 150 μm or less.)

1. A sealing sheet for forming a sealing layer for sealing an electronic element mounted on one surface in a thickness direction of a substrate,

the sealing sheet has a viscosity of 5kPa or higher at 90 ℃,

the maximum length L of the sealing sheet measured by the sealing test described below is 150 μm or less,

sealing test:

a test element is arranged on one surface of a test substrate made of glass in the thickness direction, the test element is a rectangle having a length of 10mm and a thickness of 400 [ mu ] m in a first direction orthogonal to the thickness direction and in a second direction orthogonal to the thickness direction and the first direction,

the test element was closely attached to the rectangular sealing sheet having a length of 20 μm and a thickness of 260 μm in the first direction and the second direction so as to overlap the test element in the thickness direction at 25 ℃ and 1330Pa by pressing the test element at 2MPa for 60 seconds,

thereafter, the sealing sheet was heated at 150 ℃ for 1 hour to form the sealing layer,

a test gap is formed by dividing at least 1 end surface in at least either one of the first direction and the second direction of the test element, one surface in the thickness direction of the test substrate, and the other surface in the thickness direction of the seal layer facing the end surface and the one surface in the thickness direction, and the maximum length L in the one direction of the test gap is measured.

2. The sealing sheet according to claim 1, wherein the viscosity at 90 ℃ is 200kPa or less.

3. The sealing sheet according to claim 1, wherein the linear expansion coefficient of the sealing layer is 20ppm or less.

4. The sealing sheet according to claim 1, wherein the inorganic filler is contained in an amount of 80% by mass or more.

5. The sealing sheet according to claim 1, wherein at least one 2-functional epoxy resin selected from the group consisting of bisphenol A epoxy resins and bisphenol F epoxy resins is contained in an amount of 2% by mass or more.

6. A method for manufacturing an electronic component device, comprising: and a step of pressing the sealing sheet according to claim 1 against the electronic component and heating the same to form the sealing layer for sealing the electronic component.

Technical Field

The present invention relates to a sealing sheet and a method for manufacturing an electronic component device, and more particularly, to a sealing sheet and a method for manufacturing an electronic component device using the sealing sheet.

Background

Conventionally, it has been known that an electronic component device is manufactured by forming a sealing layer for embedding and sealing an electronic component by pressure-bonding a sealing sheet to a substrate and the electronic component mounted thereon (see, for example, japanese patent application laid-open No. 2016-089091).

Disclosure of Invention

However, the electronic component mounted on the substrate protrudes upward, and the peripheral side surface of the electronic component is orthogonal to the surface of the substrate on which the electronic component is mounted.

Therefore, when the electronic component is embedded in the sealing sheet, the gap between the peripheral side surface of the electronic component and the surface of the substrate around the electronic component cannot be completely sealed by the sealing sheet, and the sealing sheet floats, so that a large gap defined by the peripheral side surface of the electronic component, the surface of the substrate, and the back surface of the floating sealing sheet is easily generated. Therefore, there is a problem that the reliability of the electronic component device having a large void is lowered.

On the other hand, although the sealing sheet softens when sealing the electronic component, if the sealing sheet is softened further, the voids can be made smaller, but if the sealing sheet flows excessively, the material of the sealing sheet is exposed to the outside of the substrate, and the periphery thereof is contaminated.

The invention provides a sealing sheet and a method for manufacturing an electronic element device, wherein the sealing sheet can reliably seal an electronic element while inhibiting the exposure of the sealing sheet to the outside, thereby manufacturing the electronic element device with excellent reliability.

The present invention (1) includes a sealing sheet for forming a sealing layer for sealing an electronic component mounted on one surface in a thickness direction of a substrate, the sealing sheet having a viscosity of 5kPa or more at 90 ℃, and the sealing sheet having a maximum length L of 150 μm or less as measured by a sealing test described below.

< sealing test >

A test element having a rectangular shape with a thickness of 400 μm and a length of 10mm in a first direction orthogonal to the thickness direction and in a second direction orthogonal to the thickness direction and the first direction is arranged on one surface in the thickness direction of a test substrate made of glass, the test element is closely attached to the rectangular sealing sheet with a length of 20 μm and a thickness of 260 μm in the first direction and the second direction by pressing the rectangular sealing sheet with 2MPa for 60 seconds so as to overlap the test element in the thickness direction at 25 ℃ and 1330Pa, and then the sealing layer is formed by heating the sealing sheet at 150 ℃ for 1 hour. A test gap is formed by dividing at least 1 end surface in at least either one of the first direction and the second direction of the test element, one surface in the thickness direction of the test substrate, and the other surface in the thickness direction of the seal layer facing the end surface and the one surface in the thickness direction, and the maximum length L in the one direction of the test gap is measured.

Since the sealing sheet has a viscosity of 5kPa or more at 90 ℃, when the sealing sheet is heated to seal an electronic component, the sealing sheet softens and suppresses excessive flow, and the electronic component can be embedded reliably while suppressing exposure of the material of the sealing sheet. Therefore, the sealing sheet has excellent sealing properties against electronic components, and can suppress contamination to the surroundings.

On the other hand, the sealing sheet has a maximum length L as measured in a sealing test as short as 150 μm or less, and therefore can follow a fine uneven structure without voids, and is excellent in water resistance and weather resistance, and therefore, an electronic component device having excellent reliability can be manufactured.

Therefore, according to the sealing sheet, the electronic element can be reliably sealed while exposure of the material of the sealing sheet is suppressed, and an electronic element device having excellent reliability can be manufactured.

The invention (2) comprises the sealing sheet according to (1), wherein the viscosity at 90 ℃ is 200kPa or less.

The invention (3) is a sealing sheet according to the item (1) or (2), wherein the sealing layer has a linear expansion coefficient of 20ppm or less.

The invention (4) comprises the sealing sheet according to any one of (1) to (3), which contains 80% by mass or more of an inorganic filler.

The invention (5) comprises the sealing sheet according to any one of (1) to (4), which contains 2% by mass or more of at least one 2-functional epoxy resin selected from the group consisting of bisphenol A-type epoxy resins and bisphenol F-type epoxy resins.

The present invention (6) includes a method for manufacturing an electronic component device, including: a step of pressing the sealing sheet according to any one of (1) to (5) against the electronic component and heating the same to form the sealing layer for sealing the electronic component.

In the method for manufacturing an electronic component device, the viscosity of the sealing sheet at 90 ℃ is 5kPa or more, and therefore, when the sealing sheet is heated to seal the electronic component, the sealing sheet is softened and at the same time excessive flow is suppressed, and the electronic component can be reliably embedded while exposure of the material of the sealing sheet is suppressed. Therefore, the sealing sheet has excellent sealing properties against electronic components, and can suppress contamination to the surroundings.

On the other hand, the maximum length L of the sealing sheet measured in the sealing test is as short as 150 μm or less, and therefore, the sealing sheet can follow a fine uneven structure without voids, and is excellent in water resistance and weather resistance, and thus, an electronic component device excellent in reliability can be manufactured.

Therefore, according to the method for manufacturing an electronic component device, the electronic component can be reliably sealed while suppressing exposure of the material of the sealing sheet, and an electronic component device having excellent reliability can be manufactured.

According to the sealing sheet and the method for manufacturing an electronic component device of the present invention, the electronic component can be reliably sealed while exposure of the material of the sealing sheet is suppressed, and an electronic component device with excellent reliability can be manufactured.

Drawings

Fig. 1A to 1C are process diagrams for manufacturing an electronic component device using an electronic component sealing sheet as one embodiment of the sealing sheet of the present invention, fig. 1A shows a process for preparing the electronic component sealing sheet and an electronic component mounting substrate, fig. 1B shows a pressing process for closely bonding the electronic component sealing sheet and the electronic component, and fig. 1C shows a heating process for heating the electronic component sealing sheet.

Fig. 2A and 2B are views for explaining a process of preparing an electronic component sealing sheet and an electronic component mounting substrate in a sealing test, in which fig. 2A shows a plan view and fig. 2B shows a cross-sectional view.

Fig. 3A and 3B are views for explaining a press test process in the seal test, following fig. 2A and 2B, and fig. 3A shows a plan view and fig. 3B shows a cross-sectional view.

Fig. 4A and 4B are views for explaining a heating test process in the sealing test, which are shown after fig. 3A and 3B, and fig. 4A shows a plan view and fig. 4B shows a cross-sectional view.

Fig. 5 is a plan view showing a modification of the heat test step shown in fig. 4A.

Detailed Description

An electronic component sealing sheet as one embodiment of the sealing sheet of the present invention will be described with reference to fig. 1A to 4B.

In fig. 3A and 4A, although the electronic component 4 described later is not visible in a plan view, in order to clearly show the shape and arrangement thereof, the contact surface of the electronic component 4 with the substrate 2 is hatched so as to penetrate through the electronic component sealing sheet 1 and the sealing layer 5.

As shown in fig. 1A to 1C, the electronic component sealing sheet 1 is used for manufacturing an electronic component device (electronic component package) 8. As shown in fig. 1C, the electronic component device 8 includes a substrate 2, an electronic component 4, and a sealing layer 5, which will be described below.

The electronic component sealing sheet 1 shown in fig. 1A is not the sealing layer 5 (see fig. 1C) after sealing the electronic component 4, that is, is a precursor sheet for forming the sealing layer 5 before sealing the electronic component 4.

As shown in fig. 1A, the electronic element sealing sheet 1 has a substantially plate shape (film shape) extending in a direction (surface direction) orthogonal to the thickness direction. The electronic component sealing sheet 1 has a first surface 6 as the other surface in the thickness direction and a second surface 7 as one surface in the thickness direction. The first face 6 and the second face 7 are planes (flat faces) parallel to each other.

The second surface 7 is described later, and when the electronic component sealing sheet 1 seals the electronic component 4, the second surface 7 is a component contact surface that is in contact with at least one surface 9 (described later) of the electronic component 4 in the thickness direction. When the electronic component sealing sheet 1 seals the electronic component 4, the second surface 7 is also a substrate contact surface that is in contact with the one surface 3 of the substrate 2 in the thickness direction that is not opposed to the electronic component 4.

When the electronic component sealing sheet 1 seals the electronic component 4 (see fig. 1B), the first surface 6 is provided with a predetermined thickness while maintaining, for example, a flat (planar) shape and ensuring a distance in the thickness direction from the second surface 7.

The material of the electronic component sealing sheet 1 is not particularly limited as long as the viscosity and the maximum length L measured in the sealing test described below are within the ranges described below. As a material of the electronic component sealing sheet 1, for example, a sealing composition can be cited.

The sealing composition contains, for example, a thermosetting component.

The thermosetting component is a component that is temporarily softened by heating at the time of sealing the electronic component 4, further melted and fluidized, and further cured by further heating.

The thermosetting component is B-stage, not C-stage (i.e., in a state before complete curing) in the electronic component sealing sheet 1. The B stage is a state between the a stage in which the thermosetting component is in a liquid state and the C stage in which the thermosetting component is completely cured, and is a state in which the curing is slightly advanced and the compression elastic modulus is smaller than that of the C stage.

The thermosetting component contains, for example, a main agent, a curing agent, and a curing accelerator.

Examples of the main agent include epoxy resins, phenol resins, melamine resins, vinyl ester resins, cyanoester resins, maleimide resins, and silicone resins. The main agent is preferably an epoxy resin from the viewpoint of heat resistance and the like. When the main agent is an epoxy resin, the thermosetting component constitutes an epoxy thermosetting component together with a curing agent (epoxy curing agent) and a curing accelerator (epoxy curing accelerator) which will be described later.

Examples of the epoxy resin include: 2-functional epoxy resins such as bisphenol a type epoxy resin, bisphenol F type epoxy resin, modified bisphenol a type epoxy resin, modified bisphenol F type epoxy resin, biphenyl type epoxy resin, and the like; for example, a multifunctional epoxy resin having 3 or more functions such as a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a trishydroxyphenylmethane type epoxy resin, a tetrakis (hydroxyphenyl) ethane type epoxy resin, a dicyclopentadiene type epoxy resin, and the like. These epoxy resins may be used alone or in combination of 2 or more.

The 2-functional epoxy resin is preferably used alone, and bisphenol a type epoxy resin and bisphenol F type epoxy resin are more preferably used.

The epoxy equivalent of the epoxy resin is, for example, 10 g/eq.or more, preferably 100 g/eq.or more, and is, for example, 300 g/eq.or less, preferably 250 g/eq.or less.

The softening point of the main agent (preferably, epoxy resin) is, for example, 50 ℃ or higher, preferably 70 ℃ or higher, and is, for example, 110 ℃ or lower, preferably 90 ℃ or lower.

In the sealing composition, the proportion of the main agent (preferably, epoxy resin) is, for example, 1 mass% or more, preferably 2 mass% or more, and is, for example, 30 mass% or less, preferably 10 mass% or less. In the thermosetting component, the proportion of the main agent (preferably, epoxy resin) is, for example, 50 mass% or more, preferably 60 mass% or more, and is, for example, 90 mass% or less, preferably 10 mass% or less.

In the sealing composition, the proportion of the 2-functional epoxy resin (specifically, at least one 2-functional epoxy resin selected from the bisphenol a type epoxy resin and the bisphenol F type epoxy resin) is, for example, 1 mass% or more, preferably 2 mass% or more, more preferably 3 mass% or more, and, for example, 5 mass% or less. When the ratio of the 2-functional epoxy resin is not less than the lower limit, the fluidity of the sealing composition can be improved, and the electronic component 4 can be reliably buried.

The curing agent is a component (preferably, an epoxy resin curing agent) for curing the main agent by heating. Examples of the curing agent include phenol resins such as phenol novolac resins.

The proportion of the curing agent is adjusted so that the total amount of hydroxyl groups in the phenolic resin is, for example, 0.7 equivalents or more, preferably 0.9 equivalents or more, and, for example, 1.5 equivalents or less, preferably 1.2 equivalents or less, relative to 1 equivalent of epoxy groups in the epoxy resin, when the main agent is an epoxy resin and the curing agent is a phenolic resin. Specifically, the blending amount of the curing agent is, for example, 30 parts by mass or more, preferably 50 parts by mass or more, and is, for example, 75 parts by mass or less, preferably 60 parts by mass or less, based on 100 parts by mass of the main agent.

The curing accelerator is a catalyst (heat curing catalyst) for accelerating the curing of the main component by heating (preferably, an epoxy resin curing accelerator), and examples thereof include organic phosphorus compounds, for example, imidazole compounds such as 2-phenyl-4, 5-dihydroxymethylimidazole (2 PHZ-PW). Preferably, an imidazole compound is used. The compounding amount of the curing accelerator is, for example, 0.05 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the base compound.

The sealing composition may further contain additives such as an inorganic filler, a thermoplastic component, a pigment, and a silane coupling agent in addition to the thermosetting component.

The inorganic filler is an inorganic particle that improves the strength of the sealing layer 5 (described later) and imparts excellent toughness to the sealing layer 5. Examples of the material of the inorganic filler include inorganic compounds such as quartz glass, talc, silica, alumina, aluminum nitride, silicon nitride, and boron nitride. These may be used alone or in combination of 2 or more. Preferably, silicon dioxide is used.

The shape of the inorganic filler is not particularly limited, and examples thereof include substantially spherical, substantially plate-shaped, substantially needle-shaped, and amorphous. Preferably, it is substantially spherical.

The average value (average particle diameter if the inorganic filler is substantially spherical) M of the maximum length of the inorganic filler is, for example, 50 μ M or less, preferably 20 μ M or less, more preferably 10 μ M or less, and is, for example, 0.1 μ M or more, preferably 0.5 μ M or more. The average particle diameter M is determined as a D50 value (cumulative 50% median diameter) based on a particle size distribution obtained by a particle size distribution measurement method in the laser light scattering method, for example.

In addition, the inorganic filler may include a first filler, and a second filler having an average value of maximum length M2 that is less than the average value of maximum length M1 of the first filler.

The average value (average particle diameter if substantially spherical) M1 of the maximum length of the first filler is, for example, 1 μ M or more, preferably 3 μ M or more, and is, for example, 50 μ M or less, preferably 30 μ M or less.

The average value (average particle diameter if substantially spherical) M2 of the maximum length of the second filler is, for example, less than 1 μ M, preferably 0.8 μ M or less, and is, for example, 0.01 μ M or more, preferably 0.1 μ M or more.

The ratio (M1/M2) of the average of the maximum lengths of the first filler to the average of the maximum lengths of the second filler is, for example, 2 or more, preferably 5 or more, and is, for example, 50 or less, preferably 20 or less.

The materials of the first filler and the second filler may be the same or different.

Further, as for the inorganic filler, the surface thereof may be partially or entirely surface-treated with a silane coupling agent or the like.

When the inorganic filler contains the first filler and the second filler, the proportion of the first filler in the sealing composition is, for example, 40 mass% or more, preferably more than 50 mass%, and, for example, 80 mass% or less, preferably 70 mass% or less. The blending proportion of the second filler is, for example, 40 parts by mass or more, preferably 50 parts by mass or more, and is, for example, 70 parts by mass or less, preferably 60 parts by mass or less, with respect to 100 parts by mass of the first filler.

The proportion of the inorganic filler in the sealing composition is, for example, 50 mass% or more, preferably 65 mass% or more, more preferably 80 mass% or more, and, for example, 95 mass% or less, preferably 90 mass% or less. When the content ratio of the inorganic filler is not less than the lower limit, the reliability of the obtained sealing layer 5 can be improved.

The thermoplastic component is a component that improves the flexibility of the electronic component sealing sheet 1 when the electronic component 4 is sealed. The thermoplastic component is, for example, a thermoplastic resin.

Examples of the thermoplastic resin include: natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid ester copolymer, a polybutadiene resin, a polycarbonate resin, a thermoplastic polyimide resin, a polyamide resin (6-nylon, 6-nylon, etc.), a phenoxy resin, an acrylic resin, a saturated polyester resin (PET, etc.), a polyamideimide resin, a fluororesin, a styrene-isobutylene-styrene block copolymer, and the like. These thermoplastic resins may be used alone or in combination of 2 or more.

The thermoplastic resin is preferably an acrylic resin from the viewpoint of improving dispersibility with a main agent (preferably, an epoxy resin).

Examples of the acrylic resin include: a carboxyl group-containing (meth) acrylate copolymer (preferably a carboxyl group-containing acrylate copolymer) obtained by polymerizing monomer components including an alkyl (meth) acrylate having a linear or branched alkyl group and another monomer (copolymerizable monomer).

Examples of the alkyl group include alkyl groups having 1 to 6 carbon atoms such as a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, an isobutyl group, a pentyl group, and a hexyl group.

Examples of the other monomer include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.

The weight average molecular weight of the thermoplastic component is, for example, 10 ten thousand or more, preferably 30 ten thousand or more, and is, for example, 100 ten thousand or less, preferably 90 ten thousand or less. The weight average molecular weight is measured by Gel Permeation Chromatography (GPC) based on a standard polystyrene conversion value.

The proportion of the thermoplastic component (solid content proportion) is adjusted so as not to inhibit thermosetting of the sealing composition, and specifically, is, for example, 1 mass% or more, preferably 2 mass% or more, and is, for example, 10 mass% or less, preferably 5 mass% or less, relative to the sealing composition. The thermoplastic component may be prepared by diluting with a suitable solvent.

The ratio of the mass of the thermoplastic component to the mass of the inorganic filler (mass of the thermoplastic component/mass of the inorganic filler) is, for example, 0.175 or more, preferably 0.18 or more, and is, for example, 0.33 or less, preferably 0.30 or less, and more preferably 0.25 or less. If the ratio is not less than the lower limit, the viscosity of the electronic component sealing sheet 1, which will be described later, can be set to a desired range. If the above ratio is not more than the above upper limit, the length L of the electronic component sealing sheet 1, which will be described later, can be set to a desired range.

Examples of the pigment include black pigments such as carbon black. The average particle diameter of the pigment is, for example, 0.001 μm or more, for example, 1 μm or less. The proportion of the pigment with respect to the sealing composition is, for example, 0.1% by mass or more, and is, for example, 2% by mass or less.

Examples of the silane coupling agent include silane coupling agents containing an epoxy group. Examples of the epoxy group-containing silane coupling agent include: 3-glycidoxypropyldialkyldialkoxysilanes such as 3-glycidoxypropylmethyldimethoxysilane and 3-glycidoxypropylmethyldiethoxysilane; for example, 3-glycidoxyalkyltrialkoxysilanes such as 3-glycidoxypropyltrimethoxysilane and 3-glycidoxypropyltriethoxysilane. Preferred examples are 3-glycidoxyalkyltrialkoxysilanes. The blending ratio of the silane coupling agent is, for example, 0.1 part by mass or more, preferably 1 part by mass or more, and is, for example, 10 parts by mass or less, preferably 5 parts by mass or less, with respect to 100 parts by mass of the inorganic filler.

The thickness of the electronic component sealing sheet 1 is not particularly limited, and is, for example, 50 μm or more, and 2000 μm or less.

The shape of the electronic component sealing sheet 1 in the orthogonal direction (surface direction) is not particularly limited, and the size thereof is set so that two or more electronic components 4 can be embedded (sealed) and can be brought into contact with one surface 3 in the thickness direction of the substrate 2 exposed from the two or more electronic components 4. Specifically, the maximum length of the electronic component sealing sheet 1 in the surface direction is, for example, 1mm or more, and is, for example, 100mm or less.

The electronic component sealing sheet 1 has a viscosity at 90 ℃ of 5kPa or more, preferably 10kPa or more, more preferably 15kPa or more, still more preferably 25kPa or more, particularly preferably 40kPa or more, yet more preferably 50kPa or more, yet more preferably 75kPa or more, and yet more preferably 100kPa or more. If the viscosity of the electronic component sealing sheet 1 at 90 ℃ does not satisfy the above lower limit, the material of the electronic component sealing sheet 1 is excessively softened, that is, excessive flow cannot be suppressed, and the material of the electronic component sealing sheet 1 is exposed to the outside when the electronic component 4 is sealed by heating the electronic component sealing sheet 1. Then, the periphery of the electronic component sealing sheet 1 is contaminated.

On the other hand, the viscosity of the electronic component sealing sheet 1 at 90 ℃ is, for example, 500kPa or less, preferably 200kPa or less, and more preferably 100kPa or less. When the viscosity of the electronic component sealing sheet 1 is not more than the upper limit, the maximum length L measured in the sealing test described later can be reliably set to the range described later.

The temperature of 90 ℃ that determines the viscosity of the electronic component sealing sheet 1 is a temperature that indicates the lowest melt viscosity during heating and is a temperature at which the fluctuation in viscosity is reduced when measurement is repeatedly performed for each of the various electronic component sealing sheets 1.

The method for measuring the viscosity of the electronic component sealing sheet 1 is described in detail in the examples below.

The maximum length L of the second test gap 72 measured in the sealing test described below is 150 μm or less for the electronic component sealing sheet 1. The maximum length L is preferably 125 μm or less, more preferably 100 μm or less, further preferably less than 85 μm, particularly preferably 80 μm or less, further preferably 70 μm or less, 60 μm or less, 50 μm or less, 25 μm or less, and further, for example, 1 μm or more.

< sealing test >

In the sealing test, the following press test step (see fig. 2A to 3B) and heat test step (see fig. 4A and 4B) are performed in this order.

In the press test step, as shown in fig. 2A and 2B, first, 1 test element 54 is arranged on one surface 53 in the thickness direction of a test substrate 52 made of glass, and the test element 54 is a rectangle having a length L1 of 10mm and a thickness T1 of 400 μm in a first direction (the left-right direction in fig. 2A and 2B) orthogonal to the thickness direction and a second direction (the up-down direction in fig. 2A and the depth direction in fig. 2B) orthogonal to the thickness direction and the first direction.

Next, after a rectangular sealing test piece 51 having a length L2 of 20mm and a thickness T2 of 260 μm in the first direction and the second direction was arranged so as to overlap the test element 54 in the thickness direction, the test piece was left at 25 ℃ and 1330Pa for 10 seconds, and then the sealing test piece 51 was pressed by a flat press 55 at 2MPa under the same conditions (reduced pressure condition of 1330 Pa) against the test element 54 for 60 seconds to be tightly bonded as shown in fig. 3B.

In the press test step, the sealing test piece 51 is obtained by cutting the electronic component sealing sheet 1 (see fig. 1A and 1B) to the above size (the length L2 in each of the first direction and the second direction is 20 mm). The sealing test piece 51 was an electronic component sealing sheet 1 whose thickness was adjusted in advance so that the thickness T2 became 260 μm.

The press test process is performed in a pressure reducing device (vacuum device) 60. The conditions of the pressure reducing device (vacuum device) 60 were 25 ℃ and 1330Pa as described above.

As shown in fig. 3A and 3B, in this press test step, a first test gap 71 is formed, and the first test gap 71 is defined by the end surface 61 (the peripheral side surface 62) of the test element 54 in both the first direction and the second direction, one surface 53 in the thickness direction of the test substrate 52, and the other surface 63 in the thickness direction of the seal layer 5 facing the end surface 61 and the one surface 53 in the thickness direction. The first test gap 71 faces, for example, any 1 of 4 surfaces (4 end surfaces 61) of the peripheral side surface 62 of the test element 54.

Of these, the 4 first test voids 71 do not face the 4 corner portions 65 corresponding to the 4 end faces 61. The 4 first test gaps 71 are separated (not connected to each other) by 4 corners 65.

In the heat test step, as shown in fig. 4A and 4B, first, the test substrate 52 and the sealing test piece 51 are taken out from the pressure reducing device 60. Then, the first test gap 71 (see fig. 3A and 3B) is in a reduced pressure (vacuum) state, and the outside of the sealing test piece 51 is at atmospheric pressure, so that the sealing test piece 51 is pushed by the atmospheric pressure so that the first test gap 71 approaches the atmospheric pressure. That is, the portion of the sealing sheet facing the first test gap 71 is pressed, and the volume of the first test gap 71 is reduced (the first test gap 71 is reduced). Subsequently, the resultant was heated at 150 ℃ for 1 hour to form a sealing layer 5. Specifically, when the sealing test piece 51 is a B-stage containing a thermosetting component, the sealing test piece 51 is heated to thermally cure (completely cure, C-stage) the sealing test piece 51.

Then, the sealing test piece 51 is temporarily softened and has fluidity. Then, the second test void 72 having a volume smaller than that of the first test void 71 is formed by the above-described pressing.

The second test gap 72 is also defined by the peripheral side surface 61(4 end surfaces 62) of the test element 54, one surface 53 in the thickness direction of the test substrate 52, and the other surface 63 in the thickness direction of the sealant 5. Similarly to the first test gap 71, the second test gap 72 is also partitioned (not communicated with) by 4 corner portions 65.

Thus, the length (maximum length) from the test element 54 to the farthest position in the second test gap 72 is obtained as the width L. When the sizes of two or more second test gaps 72 are different from each other, the width L of the largest second test gap 72 is defined.

The second test voids 72 are formed in 4 corresponding to the 4 end faces 61. The 4 end faces 61 are: one end surface 81 of the first direction (e.g., the left surface in fig. 4A) and the other end surface 82 of the first direction (e.g., the right surface in fig. 4A) which are opposed to each other in the first direction, and one end surface 83 of the second direction (e.g., the upper surface in fig. 4A) and the other end surface 84 of the second direction (e.g., the lower surface in fig. 4A) which are opposed to each other in the second direction.

The maximum length in the first direction facing the one end surface 81 in the first direction and spaced therefrom is a width L3, and the maximum length in the first direction facing the other end surface 82 in the first direction and spaced therefrom is a width L4. The maximum length in the second direction facing the one end surface 83 in the second direction and spaced therefrom is a width L5, and the maximum length in the second direction facing the other end surface 84 in the second direction and spaced therefrom is a width L6.

The second trial space 72 corresponding to the one end surface 81 in the first direction and/or the other end surface 82 in the first direction has a width that increases from the second direction end portion of the one end surface 81 in the first direction and/or the other end surface 82 in the first direction toward the second direction center portion, and has a width L3 and/or a width L4 in the second direction center portion. The second trial space 72 corresponding to the one end surface 83 in the second direction and/or the other end surface 84 in the second direction has a width L5 and/or a width L6 in a first direction center portion, which is wider from the first direction end portion of the one end surface 83 in the second direction and/or the other end surface 84 in the second direction toward the first direction center portion.

Then, the maximum value among the widths L3 to L6 was taken as L. Specifically, when the width L3 and the width L4 are compared, and the width L3 is the same as or longer than the width L4, the width L3 is taken as the maximum length of the second trial gap, i.e., the width L. When the width L3 and the width L5 are compared and the width L3 is the same as or longer than the width L5, the width L3 is taken as the width L, which is the maximum length of the second test gap. Comparison of the width L3 and the width L6, the width L4 and the width L5, and the width L4 and the width L6 is performed in the same manner as described above, and details thereof are omitted.

If the maximum length (width) L of the second test gap 72 exceeds the upper limit, the size of the second gap 17 described later becomes large, and therefore, the electronic component device 8 cannot be buried uniformly (homogeneously) (beautifully) following the fine irregularities, and the reliability of the obtained electronic component device 8 is lowered.

In producing the electronic component sealing sheet 1, first, a sealing composition is prepared. Specifically, the above components are mixed and mixed to prepare a sealing composition. The varnish is preferably prepared by blending and mixing the above components (and a solvent used as necessary). After that, a varnish was applied to a release sheet not shown, and dried to obtain an electronic component sealing sheet 1. In this case, the electronic component sealing sheet 1 is obtained in a state of being supported by a release sheet (not shown).

On the other hand, the electronic component sealing sheet 1 may be formed from the sealing composition by kneading and extrusion without preparing a varnish.

In the electronic component sealing sheet 1, when the electronic component sealing sheet 1 contains a thermosetting component, for example, the B-stage is used.

(method of manufacturing electronic component device)

Next, a method for manufacturing the electronic component device 8 using the electronic component sealing sheet 1 will be described with reference to fig. 1A to 1C.

The method comprises: a preparation step of preparing the electronic component sealing sheet 1 and the electronic component 4 (see fig. 1A); and a sealing step of sealing the electronic component 4 with the electronic component sealing sheet 1 to form a sealing layer 5 (see fig. 1B and 1C).

(preparation Process)

As shown in fig. 1A, in the preparation step, the above-described electronic component sealing sheet 1 (preferably, B-stage electronic component sealing sheet 1) is prepared. In the preparation step, the electronic component 4 mounted on the substrate 2 is prepared.

Two or more electronic components 4 are disposed on one surface of the substrate 2 at a distance from each other. The two or more electronic components 4 each have a substantially flat plate shape extending in the planar direction. Specifically, the electronic component 4 includes one surface 9 in the thickness direction, the other surface 10 in the thickness direction, and a peripheral side surface 11 as an end surface in the orthogonal direction in succession.

One surface 9 in the thickness direction and the other surface 10 in the thickness direction are planes parallel to each other. The peripheral side surface 11 connects peripheral end edges of one surface 9 in the thickness direction and the other surface 10 in the thickness direction.

The electronic element 4 is not particularly limited, and various electronic elements such as a hollow electronic element and a semiconductor element can be given. Two or more electronic components 4 are mounted so as to face one surface 3 in the thickness direction of the substrate 2. Two or more electronic components 4 are flip-chip mounted on the substrate 2, for example. Two or more electronic components 4 are disposed on one surface 3 of the substrate 2 in the thickness direction with a gap therebetween.

The thickness of the electronic element 4 is, for example, 50 μm or more and, for example, 500 μm or less. Note that the thicknesses of two or more electronic components 4 may be the same as or different from each other.

When the thicknesses of two or more electronic components 4 are different from each other, the position of the first surface 9 of the electronic component 4 in the thickness direction is deviated. In this case, the distance in the thickness direction between one surface 9 in the thickness direction located on the other side in the thickness direction and one surface 9 in the thickness direction located on the one side in the thickness direction, among the two or more one surfaces 9 in the thickness direction, is, for example, 20 μm or more, further 50 μm or more, and further 5000 μm or less, further 1000 μm or less.

The maximum length of the electronic component 4 in the plane direction is, for example, 1000 μm or more and, for example, 3000 μm or less. The distance D2 between the electronic components 4 adjacent to each other (the distance between the peripheral side surfaces 11) is, for example, 5000 μm or less, preferably 2000 μm or less, and is, for example, 100 μm or more, preferably 500 μm or more.

The substrate 2 and the electronic component 4 are provided on an electronic component mounting substrate 12. That is, the electronic component mounting substrate 12 includes the electronic component 4 and the substrate 2 on which the electronic component 4 is mounted.

The substrate 2 has a substantially flat plate shape extending in the plane direction. The substrate 2 has a size surrounding two or more electronic components 4 in a plan view. The substrate 2 includes one surface 3 in the thickness direction and the other surface 13 in the thickness direction.

One surface 3 in the thickness direction is a flat surface exposed on one side in the thickness direction. The other surface 13 in the thickness direction is a plane parallel to the one surface 3 in the thickness direction. The material of the substrate 2 is not particularly limited, and examples thereof include resin, ceramic, and metal. The thickness of the substrate 2 is not particularly limited, but is, for example, 10 μm or more, preferably 1000 μm or less.

(sealing Process)

In the sealing step, as shown in fig. 1B and 1C, the electronic component 4 is sealed using the electronic component sealing sheet 1. Specifically, the sealing step includes a pressing step (see fig. 1B) and a heating step (see fig. 1C). The pressing process and the heating process are sequentially performed.

The conditions of the pressing step and the heating step may include the conditions (temperature, time, pressure, and the like) of the pressing test step and the heating test step in the sealing test described above. The pressing step and the heating step are explained below in this order.

(pressing step)

As shown by the arrows in fig. 1A and fig. 1B, in the pressing step, first, the electronic component sealing sheet 1 is pressed toward the other side in the thickness direction, for example, in a pressure reducing device (specifically, in the vacuum device 60) using a press (not shown) so that the second surface 7 of the electronic component sealing sheet 1 is brought into contact with one surface 9 in the thickness direction of the two or more electronic components 4. The electronic component sealing sheet 1 is simultaneously heated as necessary. At this time, the electronic component sealing sheet 1 is plastically deformed in accordance with the outer shape of the electronic component 4. The degree of vacuum, pressure, temperature, and the like are not particularly limited.

Thereby, the electronic component sealing sheet 1 covers two or more electronic components 4. In other words, two or more electronic components 4 are partially embedded in 1 electronic component sealing sheet 1. At the same time, the second surface 7 of the electronic component sealing sheet 1 is in contact with the one surface 3 in the thickness direction of the substrate 2 around the electronic component 4.

Then, the first voids 14 having the same (or similar) shape and configuration as the first test voids 71 in the sealing test as shown in fig. 3A and 3B are formed. The first gap 14 is defined by the peripheral side surface 11 of the electronic component 4, the one surface 3 in the thickness direction of the substrate 2, and the second surface 7 of the electronic component sealing sheet 1 facing the peripheral side surface 11 and the one surface 3 in the thickness direction.

The first gap 14 and the outside thereof (i.e., the atmosphere in the vacuum apparatus 60) are blocked by the electronic component sealing sheet 1, i.e., do not communicate with each other.

When the electronic component sealing sheet 1 contains a thermosetting component, it is still B-staged, for example.

(heating step)

Thereafter, as shown in fig. 1C, the electronic component mounting substrate 12 and the electronic component sealing sheet 1 are taken out of the vacuum apparatus 60, and they are placed under atmospheric pressure and heated. Specifically, when the electronic component sealing sheet 1 is a B-stage containing a thermosetting component, the heating is performed to perform thermosetting (C-stage formation and complete curing). Thereby, the sealing layer 5 is formed. That is, the sealing layer 5 is prepared from the electronic component sealing sheet 1.

The sealing layer 5 has one surface 15 in the thickness direction and the other surface 16 in the thickness direction. One surface 15 in the thickness direction is formed by the first surface 6 (see fig. 1A) of the electronic component sealing sheet 1. The other surface 16 in the thickness direction is formed by the second surface 7 (see fig. 1A) of the electronic component sealing sheet 1.

In this heating step, the second voids 17 in which the first voids 14 are reduced are formed.

Specifically, the fluidity of the electronic component sealing sheet 1 is increased by the heating, and the air pressure in the first voids 14 is lower than the air pressure outside the first voids (i.e., negative pressure), so that the second voids 17 in which the first voids 14 are reduced are formed.

The second gap 17 is defined by the peripheral side surface 11 of the electronic component 4, one surface 3 in the thickness direction of the substrate 2, and the other surface 13 in the thickness direction of the sealing layer 5 facing the peripheral side surface 11 and the one surface 3 in the thickness direction.

The material of the sealing layer 5 is, for example, a cured product (C-step) of the material of the electronic component sealing sheet 1.

The linear expansion coefficient α of the seal layer 5 is, for example, 100ppm or less, preferably 20ppm or less, more preferably 15ppm or less, and, for example, 1ppm or more. When the linear expansion coefficient α of the sealing layer 5 is equal to or less than the upper limit, the difference between the linear expansion coefficient α of the sealing layer 5 and the linear expansion coefficient α of the electronic element 4 is small, and the difference between the volume change of the sealing layer 5 and the volume change of the electronic element 4 with respect to the thermal history is small, so that the electronic element device 8 having excellent reliability can be obtained.

Thereby, the electronic component device 8 including the electronic component mounting substrate 12 and the cured layer 5 was obtained. The electronic component device 8 has the second gap 17.

The maximum value of the separation distance L6 of the second air gap 17 from the peripheral side surface 11 of the electronic component 4 is, for example, 150 μm or less, preferably 100 μm or less, more preferably 50 μm or less, and still more preferably 1 μm or less. The method of determining the maximum value of the separation distance L6 of the second gap 17 is the same as the method of determining the maximum length L of the second test gap 72 described above.

Since the viscosity of the electronic component sealing sheet 1 at 90 ℃ is 5kPa or more, the electronic component sealing sheet 1 can be softened and prevent excessive flow when the electronic component 4 is sealed by heating the electronic component sealing sheet 1, and the electronic component 4 can be reliably embedded while preventing the material of the electronic component sealing sheet 1 from being exposed. Therefore, the electronic component sealing sheet 1 is excellent in sealing property against the electronic component 4 and can suppress contamination to the surroundings.

On the other hand, since the maximum length L measured in the sealing test is as short as 150 μm or less, the electronic component sealing sheet 1 can follow a fine uneven structure without voids, and is excellent in water resistance and weather resistance, and thus an electronic component device 8 having excellent reliability can be manufactured.

Therefore, according to the electronic component sealing sheet 1, the electronic component 4 can be reliably sealed while exposure of the material of the electronic component sealing sheet 1 is suppressed, and the electronic component device 8 having excellent reliability can be manufactured.

In the method of manufacturing the electronic component device 8, since the viscosity of the electronic component sealing sheet 1 at 90 ℃ is 5kPa or more, when the electronic component sealing sheet 1 is heated to seal the electronic component 4, the electronic component sealing sheet 1 is softened and excessive flow is suppressed, and the electronic component 4 can be embedded reliably while exposure of the material of the electronic component sealing sheet 1 is suppressed. Therefore, the electronic component sealing sheet 1 is excellent in sealing property against the electronic component 4 and can suppress contamination to the surroundings.

On the other hand, in the electronic component sealing sheet 1, the maximum length L, i.e., the width L measured in the sealing test is as short as 150 μm or less, and therefore, even with a fine uneven structure, it is possible to follow without voids, and the electronic component device 8 having excellent water resistance and weather resistance can be manufactured.

Therefore, according to the method for manufacturing the electronic component device 8, the electronic component 4 can be reliably sealed while exposure of the material of the electronic component sealing sheet 1 is suppressed, and the electronic component device 8 having excellent reliability can be manufactured.

The method for manufacturing the electronic component device 8 may further include: and a screening step of sorting the electronic component sealing sheet 1 satisfying the criterion that the maximum length L measured in the sealing test is 150 μm or less into good products.

Modification example

In the following modifications, the same components and steps as those of the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. Each modification can exhibit the same operational advantages as the one embodiment, except for the special explanation. Further, one embodiment and its modified examples can be combined as appropriate.

In the above description, the pressing step is performed under vacuum (reduced pressure), but the pressing step is not limited thereto, and may be performed under atmospheric pressure, for example. The pressing process is preferably performed under vacuum. If the pressing step is performed under vacuum, the separation distance L6 of the second voids 17 can be made further smaller than the volume of the second voids 17 based on the negative pressure when the electronic component sealing sheet 1 is placed under atmospheric pressure (the atmosphere of the electronic component sealing sheet 1 is returned to atmospheric pressure) in the heating step after the pressing step. Further, since the sealing test includes the press test step of performing pressing in a vacuum, the electronic component device 8 as a good product can be reliably obtained (sorted) based on (referring to) the result of the sealing test.

As shown by the broken line in fig. 1C, this method may include a step of dicing the substrate 2 and the sealing layer 5 around the electronic component 4 in the electronic component device 8. For example, the substrate 2 and the sealing layer 5 are cut in the first direction and the second direction by a dicing saw (not shown) while a dicing tape 70 indicated by a broken line is disposed on the other surface 13 in the thickness direction of the substrate 2. This reduces the size of the electronic component device 8.

In the seal test, the first test gap 71 and the second test gap 72 are formed for each of the 4 end faces 62, but for example, although not shown, any of 1, 2, and 3 may be used.

Further, as shown in fig. 5, the 4 first test gaps 71 may be connected to each other, and may have a substantially circular shape in a large 1-piece plan view including the 4 corner portions 65. The 4 second test voids 72 may communicate with each other, and have a substantially circular shape in plan view, which is 1 large but smaller than the first test void 71 so as to include 4 corners 65.

In one embodiment, the electronic component sealing sheet 1 and the electronic component mounting substrate 12 are taken out of the vacuum apparatus 60 in the heating step, but for example, air may be injected (drawn) into the vacuum apparatus 60 without being taken out of the vacuum apparatus 60.

In one embodiment, the pressing step and the heating step are performed sequentially, but may be performed simultaneously, for example.

The electronic element sealing sheet 1 and the sealing layer 5 are each formed of a single layer, but may be formed of two or more layers, for example, although not shown.