阅读说明：本技术 一种便于安装固定的半导体结构 (Semiconductor structure convenient to installation is fixed ) 是由 吴顺利 王后宝 王姗姗 于 2019-10-10 设计创作，主要内容包括：本发明公开了一种便于安装固定的半导体结构,包括半导体结构主体、连接滑动条、减震基座、连接板、连接机构和防震机构,所述连接机构位于半导体结构主体的一侧中部外表面与被连接物的一侧外表面,所述连接机构包括连接滑槽,所述连接滑槽的内表面开设有卡槽,所述卡槽的内表面设置有防滑纹；本发明通过设置的连接滑槽、连接滑动条、卡槽、安装孔、按钮、卡柱,便于半导体结构主体与物体的连接,也便于后期半导体结构主体的更换与拆卸,结构简单,易于推广；设置的防震底板、连接板、连接块、缓冲弹簧、压杆,提高了半导体结构主体的稳定性能,延长了半导体结构主体的使用寿命,提高了半导体结构主体的工作效率,带来更好的使用前景。(The invention discloses a semiconductor structure convenient to install and fix, which comprises a semiconductor structure main body, a connecting sliding strip, a damping base, a connecting plate, a connecting mechanism and a shockproof mechanism, wherein the connecting mechanism is positioned on the outer surface of the middle part of one side of the semiconductor structure main body and the outer surface of one side of a connected object and comprises a connecting sliding groove, the inner surface of the connecting sliding groove is provided with a clamping groove, and the inner surface of the clamping groove is provided with anti-skidding lines; according to the invention, the connecting sliding chute, the connecting sliding strip, the clamping groove, the mounting hole, the button and the clamping column are arranged, so that the semiconductor structure main body is convenient to connect with an object, and the semiconductor structure main body is convenient to replace and disassemble in the later period, and the semiconductor structure is simple in structure and easy to popularize; the shock-proof bottom plate, the connecting block, the buffer spring and the pressing rod are arranged, so that the stability of the semiconductor structure main body is improved, the service life of the semiconductor structure main body is prolonged, the working efficiency of the semiconductor structure main body is improved, and better use prospect is brought.)

1. The utility model provides a semiconductor structure convenient to installation is fixed, includes semiconductor structure main part (1), connects slide bar (3), shock attenuation base (14), connecting plate (11), coupling mechanism and shockproof mechanism, its characterized in that: the connecting mechanism is located on the outer surface of the middle portion of one side of the semiconductor structure main body (1) and the outer surface of one side of the connected object, the connecting mechanism comprises a connecting sliding groove (2), a clamping groove (6) is formed in the inner surface of the connecting sliding groove (2), and anti-skidding lines are arranged on the inner surface of the clamping groove (6).

2. A semiconductor structure for facilitating mounting and securing according to claim 1, wherein: the shockproof mechanism is located on the outer surface of the bottom of the semiconductor structure main body (1), the dismounting mechanism comprises a shockproof bottom plate (4), a flange plate (18) is fixedly connected to the outer surface of the top end of the shockproof bottom plate (4), a connecting screw (17) is connected to the outer surface of the top end of the flange plate (18) in a threaded mode, a pressing rod (16) is fixedly connected to the outer surface of the middle of the top end of the flange plate (18), and a buffer spring (15) is fixedly connected to the outer surface of the pressing rod (16).

3. A semiconductor structure for facilitating mounting and securing according to claim 1, wherein: the outer fixed surface of one side of connecting slide bar (3) is connected with card post (9), card post (9) are equipped with two sets ofly.

4. A semiconductor structure for facilitating mounting and securing according to claim 1, wherein: the outer surface of the other side of the connecting sliding strip (3) is provided with a mounting hole (7), and the middle inner surface of the side end of the connecting sliding strip (3) is fixedly connected with a button (8).

5. A semiconductor structure for facilitating mounting and securing according to claim 1, wherein: the shock absorption device is characterized in that a shock absorption spring (10) is fixedly connected to the outer surface of the top end of the shock absorption base (14), and a layer of lubricating oil layer is coated on the outer surface of the shock absorption spring (10).

6. A semiconductor structure for facilitating mounting and securing according to claim 1, wherein: the outer fixed surface in top of connecting plate (11) is connected with connecting block (12), connecting block (12) are provided with four groups, the surface of connecting block (12) scribbles one deck conductivity type anticorrosive coating layer.

7. A semiconductor structure for facilitating mounting and securing according to claim 6, wherein: connecting hole (13) have been seted up on the top middle part surface of connecting block (12), the interior surface native language one deck epoxy antiskid type coating layer of connecting hole (13).

8. A semiconductor structure for facilitating mounting and securing according to claim 1, wherein: the semiconductor structure is characterized in that the outer surfaces of the periphery of the semiconductor structure main body (1) are fixedly connected with connecting chips (5), and conductive anti-corrosion coating layers are arranged on the outer surfaces of the semiconductor structure main body (1) and the connecting chips (5).

9. A semiconductor structure for facilitating mounting and securing according to claim 2, wherein: four groups of flange plates (18) are arranged, and the outer surface of the shockproof bottom plate (4) is coated with a layer of acrylic waterproof coating.

Technical Field

The invention belongs to the technical field of semiconductors, and particularly relates to a semiconductor structure convenient to mount and fix.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are widely used in the fields of consumer electronics, communication systems, medical instruments, and the like. Such as diodes, are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most significant of various semiconductor materials for commercial applications, but various problems still exist in the existing semiconductor structure.

Although the display with a plurality of semiconductor chips and the application of the semiconductor chips or the display disclosed in the invention with the publication number of CN103597620B achieve the effect of preventing severe wavelength shift, when the semiconductor structure is connected with an object, the semiconductor structure is inconvenient, and is not convenient to be disassembled and replaced in the later period, and the semiconductor structure has poor stability, is easily affected by external factors, and reduces the working efficiency, so we propose a semiconductor structure which is convenient to mount and fix.

Disclosure of Invention

The present invention is directed to a semiconductor structure that is easy to mount and fix, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor structure convenient to installation is fixed, includes semiconductor structure main part, connects sliding strip, shock attenuation base, connecting plate, coupling mechanism and shockproof mechanism, coupling mechanism is located one side middle part surface of semiconductor structure main part and is connected one side surface of thing, coupling mechanism is including connecting the spout, the draw-in groove has been seted up to the internal surface of connecting the spout, the internal surface of draw-in groove is provided with anti-skidding line.

Preferably, the shockproof mechanism is located on the outer surface of the bottom of the semiconductor structure main body, the disassembling mechanism comprises a shockproof bottom plate, a flange plate is fixedly connected to the outer surface of the top end of the shockproof bottom plate, a connecting screw is connected to the outer surface of the top end of the flange plate in a threaded manner, a pressing rod is fixedly connected to the outer surface of the middle portion of the top end of the flange plate, and a buffer spring is fixedly connected to the outer surface of the pressing rod.

Preferably, the outer surface of one side of the connecting sliding strip is fixedly connected with clamping columns, and the clamping columns are provided with two groups.

Preferably, the outer surface of the other side of the connecting sliding strip is provided with a mounting hole, and the inner surface of the middle part of the side end of the connecting sliding strip is fixedly connected with a button.

Preferably, the outer surface of the top end of the shock absorption base is fixedly connected with a shock absorption spring, and the outer surface of the shock absorption spring is coated with a layer of lubricating oil layer.

Preferably, the outer fixed surface in top of connecting plate is connected with the connecting block, the connecting block is provided with four groups, the surface of connecting block scribbles one deck conduction type anticorrosive coating layer.

Preferably, the surface of the middle part of the top end of the connecting block is provided with a connecting hole, and the inner surface of the connecting hole is provided with a native layer of epoxy anti-skid coating layer.

Preferably, the outer surface all around of semiconductor structure main part is fixedly connected with the connection chip, the surface of semiconductor structure main part and connection chip all is provided with the anticorrosive coating of conduction type.

Preferably, the four groups of the flange plates are arranged, and the outer surface of the shockproof bottom plate is coated with a layer of acrylic waterproof coating layer.

Compared with the prior art, the invention has the beneficial effects that:

1. the connecting sliding groove, the connecting sliding strip, the clamping groove, the mounting hole, the button and the clamping column are arranged, so that when the semiconductor structure main body is connected with an object, the connecting sliding groove, the clamping groove, the mounting hole, the button and the clamping column are not convenient, the semiconductor structure main body is not convenient to disassemble and replace in the later period, the semiconductor structure main body is convenient to connect with the object, the semiconductor structure main body is convenient to replace and disassemble in the later period, the structure is simple.

2. The shockproof bottom plate, the connecting block, the buffer spring and the pressing rod are arranged, the problem that the semiconductor structure is poor in stability is solved, the semiconductor structure is easily influenced by external factors, the stability of the semiconductor structure main body is improved, the service life of the semiconductor structure main body is prolonged, and the working efficiency of the semiconductor structure main body is improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a block diagram of the connecting chute of FIG. 1 in accordance with the present invention;

FIG. 3 is a block diagram of the connecting slide of FIG. 1 according to the present invention;

FIG. 4 is a view of the vibration damping base of FIG. 1 in accordance with the present invention;

FIG. 5 is an enlarged view of A of FIG. 4 in accordance with the present invention;

in the figure: 1. a semiconductor structure body; 2. connecting the sliding chute; 3. connecting a sliding strip; 4. a shock-proof base plate; 5. connecting the chip; 6. a card slot; 7. mounting holes; 8. a button; 9. clamping the column; 10. a shock-proof spring; 11. a connecting plate; 12. connecting blocks; 13. connecting holes; 14. a shock-absorbing base; 15. a buffer spring; 16. a pressure lever; 17. a connecting screw; 18. a flange plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides the following technical solutions: the utility model provides a semiconductor construction convenient to installation is fixed, includes semiconductor construction subject 1, connects slide bar 3, vibration damping mount 14, connecting plate 11, coupling mechanism and shockproof mechanism, and coupling mechanism is located one side middle part surface of semiconductor construction subject 1 and is connected one side surface of thing, and coupling mechanism is including connecting spout 2, and draw-in groove 6 has been seted up to the internal surface of connecting spout 2, and the internal surface of draw-in groove 6 is provided with anti-skidding line.

The stability of the semiconductor structure main body 1 is improved, the service life of the semiconductor structure main body 1 is prolonged, and the work efficiency of the semiconductor structure main body 1 is improved, in this embodiment, preferably, the shockproof mechanism is located on the outer surface of the bottom of the semiconductor structure main body 1, the dismounting mechanism comprises a shockproof bottom plate 4, a flange plate 18 is fixedly connected to the outer surface of the top end of the shockproof bottom plate 4, a connecting screw 17 is connected to the outer surface of the top end of the flange plate 18 in a threaded manner, a compression bar 16 is fixedly connected to the outer surface of the middle portion of the top end of the flange plate 18, and a buffer spring.

Through the card post 9 that is equipped with, can be with connecting spout 2 and the fixed chucking of connecting the sliding strip 3, this embodiment, it is preferred, connect one side outer fixed surface of sliding strip 3 and be connected with card post 9, card post 9 is equipped with two sets ofly.

Through the button 8 that is equipped with, can control the chucking and the slip of connecting spout 2 and connecting slide bar 3 and open, this embodiment, preferably, the opposite side surface of connecting slide bar 3 has seted up mounting hole 7, and the side middle part internal surface fixed connection of connecting slide bar 3 has button 8.

The shock absorption performance of the shock absorption device can be improved by the shock absorption base 14, in this embodiment, preferably, the shock absorption spring 10 is fixedly connected to the outer surface of the top end of the shock absorption base 14, and the outer surface of the shock absorption spring 10 is coated with a lubricating oil layer.

Through the connecting hole 13, the anti-vibration device can be installed on the outer surface of the bottom of the semiconductor structure body 1, in this embodiment, preferably, the outer surface of the top end of the connecting plate 11 is fixedly connected with the connecting blocks 12, four groups of the connecting blocks 12 are arranged, and the outer surface of the connecting blocks 12 is coated with a conductive anti-corrosion coating layer.

Through the connecting block 12 that is equipped with, damping device's installation can be convenient for, this embodiment, and is preferred, and connecting hole 13 has been seted up to the top middle part surface of connecting block 12, and the interior surface native language one deck epoxy antiskid type dope layer of connecting hole 13.

In the present embodiment, it is preferable that the connection chip 5 is fixedly connected to the outer surface of the periphery of the semiconductor structure body 1, and the conductive anti-corrosion coating layer is disposed on the outer surfaces of the semiconductor structure body 1 and the connection chip 5.

The buffer performance of the anti-vibration device can be improved by the flange plates 18, in the embodiment, preferably, four groups of flange plates 18 are arranged, and the outer surface of the anti-vibration bottom plate 4 is coated with a layer of acrylic waterproof coating.

The working principle and the using process of the invention are as follows: when the device is used, firstly, the outer surface of one side of the connecting sliding strip 3 is arranged on the outer surface of the middle part of one side of the semiconductor structure main body 1, then the inner surface of the connecting sliding groove 2 is provided with the clamping groove 6, then the outer surface of one side of the connecting sliding strip 3 is fixedly connected with the outer surface of one side of the clamping column 9, then the inner surface of the side end of the connecting sliding strip 3 is fixedly connected with the button 8, the outer surface of the other side of the connecting sliding strip 3 is provided with the mounting hole 7, then the outer surface of the other side of the connecting sliding strip 3 is arranged on the outer surface of an object connected with the connecting sliding strip through the inner surface of the mounting hole 7, and then the connecting sliding groove 2 and the connecting sliding strip 3 are fixedly clamped through extruding the outer surface of the button 8, so that the; firstly, the outer surface of the top end of the connecting sliding strip 3 is in threaded connection with the outer surface of one side of the bottom of the flange plate 18 through a connecting screw 17, then the outer surface of the middle part of the top end of the flange plate 18 is fixedly connected with the outer surface of the bottom of the compression bar 16, then the outer surface of the top end of the buffer spring 15 is fixedly connected with the outer surface of the bottom of the shock absorbing base 14, then the outer surface of the top end of the shock absorbing base 14 is fixedly connected with the outer surface of the bottom of the shock absorbing spring 10, the outer surface of the top end of the shock absorbing spring 10 is fixedly connected with the outer surface of the bottom of the connecting plate 11, then the outer surface of the bottom of the connecting block 12 is fixedly connected with the outer surface of one side of the top end of the connecting plate 11, and, the working efficiency of the semiconductor construction body 1 is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.