阅读说明：本技术 显示面板、电子设备以及检测方法 (Display panel, electronic device and detection method ) 是由 吴蕴泽 于 2019-08-30 设计创作，主要内容包括：本发明提供一种显示面板、电子设备以及检测方法,显示面板包括：显示膜层,所述显示膜层包括依次堆叠的基板、驱动器件层以及发光功能层,所述显示膜层内具有通孔,位于所述通孔周围的所述显示膜层作为待检测区；裂纹检测电路,所述裂纹检测电路包括位于所述待检测区的显示膜层内且位于所述通孔周边的至少一条导电线路,所述导电线路包括相对的第一端以及第二端。本发明实施例能够及时有效的将通孔周围的显示膜层内的裂纹检出。(The invention provides a display panel, an electronic device and a detection method, wherein the display panel comprises: the display film layer comprises a substrate, a driving device layer and a light-emitting function layer which are sequentially stacked, a through hole is formed in the display film layer, and the display film layer positioned around the through hole is used as a region to be detected; the crack detection circuit comprises at least one conductive line which is positioned in the display film layer of the area to be detected and positioned on the periphery of the through hole, and the conductive line comprises a first end and a second end which are opposite. The embodiment of the invention can effectively detect the cracks in the display film layer around the through hole in time.)

1. A display panel, comprising:

the display film layer comprises a substrate, a driving device layer and a light-emitting function layer which are sequentially stacked, a through hole is formed in the display film layer, and the display film layer positioned around the through hole is used as a region to be detected;

the crack detection circuit comprises at least one conductive line which is positioned in the display film layer of the area to be detected and positioned on the periphery of the through hole, and the conductive line comprises a first end and a second end which are opposite.

2. The display panel of claim 1, wherein the crack detection circuit further comprises: a first outgoing line connected with the first end; a second outgoing line connected with the second end; preferably, the width of the conductive circuit is 2-200 microns; the thickness of the conducting circuit is 500-5000 angstroms.

3. The display panel according to claim 1, wherein the number of the conductive lines is one; preferably, the distance between the first end and the second end is greater than or equal to 2 μm and less than or equal to 20 μm.

4. The display panel according to claim 1, wherein the number of the conductive circuits is N, N is greater than or equal to 2, and the N conductive circuits are sequentially arranged around the periphery of the through hole; preferably, the distance between adjacent conductive traces is not less than 2 μm and not more than 20 μm.

5. The display panel according to any one of claims 1 to 4, wherein a minimum distance between the conductive line and the sidewall of the through hole is 10 μm or more and 1000 μm or less.

6. The display panel according to any one of claims 1 to 4, wherein the number of the crack detection circuits is plural, and each of the crack detection circuits is disposed at a different layer position of the display film layer of the area to be detected; preferably, the display film layer includes a metal layer and an inorganic layer, and the crack detection circuit is disposed on the metal layer and/or the inorganic layer.

7. The display panel according to any one of claims 1 to 5, wherein a data line is provided in the display film layer, and the crack detection circuit is made of the same material as the data line; and/or a gate line is arranged in the display film layer, and the crack detection circuit is made of the same material as the gate line; and/or an anode is arranged in the display film layer, and the material of the crack detection circuit is the same as that of the anode; and/or a cathode is arranged in the display film layer, and the material of the crack detection circuit is the same as that of the cathode; and/or an array circuit layer is arranged in the display film layer, and the material of the conductive detection circuit is the same as that of the array circuit layer; and/or a touch control circuit is arranged in the display film layer, and the material of the conductive detection circuit is the same as that of the touch control circuit.

8. An electronic device, comprising: the display panel of any one of claims 1-7; the auxiliary component is arranged corresponding to the through hole.

9. A detection method applied to the display panel according to any one of claims 1 to 7, comprising:

detecting the crack detection circuit to obtain the electrical characteristics of the conductive circuit;

and judging whether the display film layer of the area to be detected has cracks or not based on the detected electrical characteristics.

10. The inspection method of claim 9, wherein said inspecting the crack detection circuit comprises: providing an input electrical signal to the first terminal and/or the second terminal; detecting an output electrical signal of the first terminal and/or the second terminal.

Technical Field

The embodiment of the invention relates to the technical field of display, in particular to a display panel, electronic equipment and a detection method.

Background

The terminal devices such as mobile phones and tablet computers generally have functional devices such as cameras, speakers and earphones besides the display screen. With the continuous intellectualization and the mobility of the terminal equipment, the functions of the terminal equipment are rich continuously, and more functional devices are arranged in the terminal equipment.

In order to increase the display screen ratio of the terminal device, a hole is usually formed in the display area for a built-in functional device. However, the reliability problem still exists in the current terminal equipment.

Disclosure of Invention

The invention provides a display panel, an electronic device and a detection method, which can improve the reliability of the electronic device.

To solve the above problem, an embodiment of the present invention provides a display panel, including: the display film layer comprises a substrate, a driving device layer and a light-emitting function layer which are sequentially stacked, a through hole is formed in the display film layer, and the display film layer located around the through hole is used as a detection area to be detected; the crack detection circuit comprises at least one conductive line which is positioned in the display film layer of the area to be detected and positioned on the periphery of the through hole, and the conductive line comprises a first end and a second end which are opposite.

Thus, the crack detection circuit can detect whether a crack exists in the detection area around the through hole. Particularly, as the detection area is provided with the conductive circuit surrounding the through hole, whether the conductive circuit is broken can be known by inputting a detection electric signal to the first end and/or the second end, and if the conductive circuit is broken, a crack is formed in the display film layer of the detection area; or, whether the resistance of the conductive circuit changes or not can be acquired according to the electrical characteristics of the conductive circuit between the first end and the second end, so that whether cracks exist in the conductive circuit or not is known, and if cracks exist in the conductive circuit, the fact that cracks exist in the display film layer of the area to be detected is indicated.

In addition, the crack detection circuit further includes: a first outgoing line connected to the first end; a second outgoing line connected with the second end; preferably, the width of the conductive circuit is 2-200 microns; the thickness of the conducting circuit is 500-5000 angstroms. Therefore, the mechanical strength of the conducting circuit is moderate, the probability that the conducting circuit cracks along with other films on the periphery of the through hole is higher, and the detection accuracy of the cracks on the periphery of the through hole is further improved.

In addition, the number of the conducting circuits is one; preferably, the distance between the first end and the second end is not less than 2 μm and not more than 20 μm. The distance between the first end and the second end is moderate, so that the problem of signal interference caused by the fact that the first end and the second end are too close to each other is avoided, and the influence of the signal interference on the crack detection effect is prevented; and the distance between the first end and the second end is moderate, so that the display film layer of the region to be detected between the first end and the second end can be detected in time when cracks appear, and the probability of missed detection of the cracks is reduced.

In addition, the number of the conducting circuits is N, N is more than or equal to 2, and the N conducting circuits are sequentially arranged around the periphery of the through hole in a surrounding manner; preferably, the distance between adjacent conductive traces is not less than 2 μm and not more than 20 μm.

In addition, the minimum distance between the conductive circuit and the side wall of the through hole is more than or equal to 10 μm and less than or equal to 1000 μm.

In addition, the number of the crack detection circuits is multiple, and each crack detection circuit is arranged at different layer positions of the display film layer of the area to be detected; preferably, the display film layer includes a metal layer and an inorganic layer, and the crack detection circuit is disposed on the metal layer and/or the inorganic layer.

In addition, the display film layer is internally provided with a data wire, and the crack detection circuit is made of the same material as the data wire; and/or a gate line is arranged in the display film layer, and the crack detection circuit is made of the same material as the gate line; and/or an anode is arranged in the display film layer, and the material of the crack detection circuit is the same as that of the anode; and/or a cathode is arranged in the display film layer, and the material of the crack detection circuit is the same as that of the cathode; and/or an array circuit layer is arranged in the display film layer, and the material of the conductive detection circuit is the same as that of the array circuit layer; and/or a touch control circuit is arranged in the display film layer, and the material of the conductive detection circuit is the same as that of the touch control circuit.

Correspondingly, the embodiment of the invention also provides an electronic device, which comprises the display panel; the auxiliary component is arranged corresponding to the through hole.

Correspondingly, an embodiment of the present invention further provides a detection method, applied to the display panel, including: detecting the crack detection circuit to obtain the electrical characteristics of the conductive circuit; and judging whether the display film layer of the area to be detected has cracks or not based on the detected electrical characteristics.

In addition, the detecting the crack detection circuit includes: providing an input electrical signal to the first terminal and/or the second terminal; detecting an output electrical signal of the first terminal and/or the second terminal.

Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following advantages:

according to the technical scheme, the conducting circuit is arranged in the display film layer around the through hole and used for forming the crack detection circuit, and the crack detection circuit can timely and effectively detect the cracks in the display film layer around the through hole, so that electronic equipment with cracks is prevented from being delivered to customers, and the reliability of the electronic equipment is improved.

Drawings

One or more embodiments are illustrated by the accompanying drawings, which correspond to the figures in the drawings, which are not to be construed as limiting the embodiments, unless expressly stated otherwise, and which are not to be construed as limiting the scope of the invention.

Fig. 1 is a schematic top view of a display panel according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view taken along line CC1 in FIG. 1;

FIG. 3 is an enlarged schematic view of the area aa in FIG. 1;

fig. 4 is a schematic top view of a display panel according to an embodiment of the present invention;

fig. 5 is a schematic top view of a display panel according to an embodiment of the present invention;

fig. 6 is a schematic top view of a display panel according to an embodiment of the present invention;

fig. 7 is a schematic flow chart of a detection method according to an embodiment of the present invention.

Detailed Description

As can be seen from the background art, the reliability of the current terminal devices is problematic.

Analysis shows that after a through hole is formed in a display area of the terminal device, a film layer around the through hole has a crack, and the crack is difficult to detect; and after the terminal equipment with the crack problem is delivered to the hands of a user, the reliability problem occurs, and the performance of the terminal equipment is influenced. In addition, the above-mentioned cracking problem is found to be particularly significant when the display screen of the terminal device is a flexible display screen.

In order to solve the above problem, an embodiment of the present invention provides a display panel, in which a through hole for placing an auxiliary component is formed in a display film layer, the display film layer around the through hole is used as a region to be detected, and the display panel includes a crack detection circuit for detecting whether the display film layer in the region to be detected has cracks, the crack detection circuit includes at least one conductive circuit, and the conductive circuit is located in the display film layer in the region to be detected and around the through hole. Whether cracks exist in the display film layer of the to-be-detected area around the through hole or not is judged by detecting the electrical characteristics of the conducting circuit in the crack detection circuit.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.

Fig. 1 is a schematic top view of a display panel according to an embodiment of the invention, and fig. 2 is a schematic cross-sectional view taken along a direction CC1 in fig. 1.

Referring to fig. 1 and 2, the display panel includes: the display film layer 101 comprises a substrate 111, a driving device layer 121 and a light-emitting function layer 131 which are sequentially stacked, a through hole 10 is formed in the display film layer 101, and the display film layer around the through hole 10 serves as a region I to be detected; the crack detection circuit 102 includes at least one conductive line 112 located in the display film layer 101 of the region to be detected I and located at the periphery of the through hole 10, and the conductive line 112 includes a first end a and a second end B opposite to each other.

The display panel provided in the present embodiment will be described in detail below with reference to the accompanying drawings. For ease of illustration and explanation, the boundary of the area to be detected I is indicated by a dashed line in fig. 1.

The display panel may be an OLED display panel, an LCD display panel, an LED display panel, or a Micro-LED display panel. Taking the display panel as an OLED display panel as an example, the OLED display panel may be a top emission display panel or a bottom emission display panel.

In this embodiment, the display panel is applied to a flexible display device, the corresponding substrate 111 is a flexible substrate, and the material of the flexible substrate is Polyethylene (PE), polypropylene (PP), Polystyrene (PS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or Polyimide (PI). The substrate 111 may also be an ultra-thin glass substrate having a thickness of less than 50 μm.

It is to be understood that the substrate may be a rigid substrate such as a glass substrate.

The driving device layer 121 supplies a driving signal to the light emitting function layer 131.

In this embodiment, the driving device layer 121 has a Thin Film Transistor (TFT) therein. The driving device layer 121 includes a multi-layer film structure, and specifically, the driving device layer 121 includes: an active layer; the grid structure is positioned on the active layer and comprises a grid dielectric layer and a grid electrode layer positioned on the grid dielectric layer; a source region (source) in the active layer at one side of the gate structure, and a drain region (drain) in the active layer at the other side of the gate structure; a dielectric layer covering the gate structure and the active layer; the source electrode penetrates through the dielectric layer and is electrically connected with the source region; and the drain electrode penetrates through the dielectric layer and is electrically connected with the drain region.

It is understood that the driving device layer 121 may also include other film layer structures, and the above is only an example of the most common driving device layer structure.

In the present embodiment, taking the display panel as a top emission display panel as an example, the light emitting function layer 131 includes an anode, a light emitting unit, and a cathode stacked in this order.

The material of the anode includes ITO (indium tin oxide), IZO (zinc tin oxide), or Ag. In this embodiment, the anode has a stacked structure, specifically, a stacked structure of ITO layer/Ag layer/ITO layer.

The light emitting unit includes: a Hole Injection Layer (HIL), a Hole Transport Layer (HTL) on the Hole injection Layer, an emission Layer (EML) on the Hole Transport Layer, an Electron Transport Layer (ETL) on the emission Layer, and an Electron Injection Layer (EIL) on the Electron Transport Layer.

In other embodiments, the light emitting unit may have a three-layer structure of a hole transport layer, a light emitting layer, and an electron transport layer, or may have a single-layer structure of a light emitting layer, or may have a double-layer structure.

In this embodiment, the cathode is made of Ag/Mg alloy. In other embodiments, the material of the cathode may also be Al, Li, Ca, In, ITO, or IZO.

In this embodiment, the through hole 10 penetrates through the light emitting functional layer 131 and the driving device layer 121, and the bottom of the through hole 10 is located in the substrate 111. In other embodiments, the bottom of the via hole may also be located inside the driving device layer; alternatively, the bottom of the through hole can also be the interface between the driving device layer and the substrate; alternatively, the through-hole may also penetrate the substrate.

The display panel may further include: a thin film encapsulation layer (TFE) for providing a sealing protection effect to the light emitting functional layer 131; protective covers (cover lenses).

In the present embodiment, the cross-sectional shape of the through-hole 10 is exemplified as a circle. In other embodiments, the cross-sectional shape of the through-hole may be square, hexagonal, or elliptical, among other suitable shapes.

Due to the through hole 10 in the display film layer 101, cracks are prone to occur in the display film layer 101 of the region I to be detected under the influence of the manufacturing process of the through hole 10, the cracks may be located in any film layer of the substrate 111, the driving device layer 121 or the light emitting functional layer 131, and the cracks are not easy to be found. The size of the region I to be detected can be flexibly set, for example, when the process of forming the through hole 10 is relatively easy to crack, the size of the region I to be detected is larger, and when the process of forming the through hole 10 is relatively mild, the size of the region I to be detected is smaller.

The crack detection circuit 102 is used for detecting whether cracks exist in the display film layer 101 of the area to be detected I. Specifically, before the through hole 10 is formed, the crack detection circuit 101 is formed; in the process step of manufacturing the through hole 10, if the display film layer 101 of the area I to be detected has a crack, the corresponding conductive line 112 located in the area I to be detected is affected by the crack to cause an open circuit, or when the display film layer 101 of the area I to be detected has a crack, the conductive line 112 located in the area I to be detected also has a crack; whether the display film layer 101 of the region I to be detected has cracks is judged by detecting whether the conductive circuit 112 shows difference in electrical performance before and after the through hole 10 is manufactured, so that the cracks in the display film layer 101 can be timely and effectively detected.

Specifically, when the crack in the conductive line 112 completely breaks the conductive line 112, the conductive line 112 exhibits an open circuit characteristic in electrical performance, and thus, by detecting whether the conductive line 112 is open circuit, it is effectively detected that the crack in the film layer 101 is present.

When cracks occur in the conductive circuit 112 but the conductive circuit 112 is not completely broken, the electrical characteristics exhibited by the conductive circuit 112 before the through hole 10 is manufactured are different from the electrical characteristics exhibited by the conductive circuit 112 after the through hole 10 is manufactured, and whether cracks exist in the conductive circuit 112 is judged according to the electrical characteristic difference before and after the through hole 10 is manufactured, so that the cracks in the display film layer 101 can be timely and effectively detected.

Fig. 3 is an enlarged schematic view of the area aa in fig. 1.

The width W of the conductive traces 112 is 2-200 microns, such as 10, 20, 70, 100, 130, 160 μm. In this embodiment, the width W of the conductive line 112 is 5 μm to 50 μm, so that the conductive line 112 has a moderate width, and when a crack occurs in the display film layer 101 around the conductive line 112, the crack can easily cause the conductive line 112 to break, so that the conductive line 112 shows a difference in electrical properties, and thus the crack is more easily detected; moreover, since the width W of the conductive circuit 112 is moderate, the process difficulty of manufacturing the conductive circuit 112 is low.

The thickness D of the conductive traces 112 should not be too thin nor too thick. If the thickness D of the conductive circuit 112 is too thin and the mechanical strength of the conductive circuit 112 is too weak, the conductive circuit 112 is prone to generate cracks before other film layers in the process of manufacturing the through hole 10, that is, there is a risk that cracks do not occur in other film layers but the cracks are generated in the conductive circuit 112 to break the circuit, which affects the accuracy of detection; if the thickness D of the conductive line 112 is too thick, and the mechanical strength of the corresponding conductive line 112 is high, there is a risk that cracks do not occur in the conductive line 112 even if cracks occur in other film layers during the process of manufacturing the through-hole 10. Therefore, in the present embodiment, the thickness D of the conductive line 112 is 500 angstroms to 5000 angstroms, such as 1000 angstroms, 1500 angstroms, 2600 angstroms, and 4000 angstroms. It is understood that, in the present embodiment, the cross-sectional shape of the conductive line 112 is a square as an example to illustrate the width W and the thickness D of the conductive line 112, and the cross-sectional shape of the conductive line 112 refers to a cross-sectional pattern of the conductive line 112 on a cross section along a direction parallel to the stacking direction of the display film layers 101. The conductive line 112 may also have a circular cross-sectional shape, that is, the conductive line 112 is a cylindrical conductive line, and in order to improve the accuracy of detecting cracks by the crack detection circuit 102, the cross-sectional diameter of the conductive line 112 is 400 angstroms to 5000 angstroms, such as 1000 angstroms, 1500 angstroms, 2600 angstroms, and 4000 angstroms. In other embodiments, the cross-sectional shape of the conductive line may be other regular shapes or irregular shapes.

More specifically, each conductive line 112 has a first end a and a second end B opposite to each other, and by supplying an input electrical signal to the first end a and collecting an output electrical signal from the second end B, it is determined whether the conductive line 112 is open-circuited based on the input electrical signal and the output electrical signal. The input electrical signal and the output electrical signal may be both voltage signals, or the input electrical signal and the output electrical signal may be both current signals. Or, providing a first voltage signal to the first terminal a and a second voltage signal to the second terminal B, so as to make a voltage difference between the first terminal a and the second terminal B of the conductive trace 112, and acquiring a current of the first terminal a or the second terminal B of the conductive trace 112, and determining whether the conductive trace 112 is open circuit based on the voltage difference and the current.

To facilitate providing the detection electrical signal to the conductive line 112 or collecting the detection electrical signal, the crack detection circuit 102 may further include: a first outgoing line 122, the first outgoing line 122 being connected to the first end a; and a second outgoing line 132, the second outgoing line 132 being connected to the second terminal B.

One end of the first outgoing line 122 is connected to the first end a, and the other end is connected to the first port 21; the second outgoing line 132 has one end connected to the second port B and the other end connected to the second port 22. Wherein the first port 21 and the second port 22 are used for providing input electrical signals or collecting output electrical signals.

In this embodiment, the materials of the first outgoing line 122 and the second outgoing line 132 are the same as the material of the conductive line 112, and the first outgoing line 122, the second outgoing line 132 and the conductive line 112 are fabricated in the same process step.

The first outgoing line 122 and the second outgoing line 132 may be linear wires. Thus, the short lengths of the first lead line 122 and the second lead line 132 are beneficial to reducing the electrical loss of the detection electrical signal through the first lead line 122 and the second lead line 132 and reducing the interference on the judgment of whether the conductive circuit 112 is open-circuited.

In this embodiment, as shown in fig. 1, the number of the conductive traces 112 is one, and taking the conductive trace 112 to surround the through hole 10 once as an example, it can be understood that the conductive trace 112 has a first end a and a second end B opposite to each other, and therefore the conductive trace 112 surrounding the through hole 10 once does not form a sealing ring.

The distance between the first end A and the second end B is not too small or too large. If the distance between the first end A and the second end B is too small, the first end A and the second end B have a signal interference problem; if the distance between the first end a and the second end B is too large, the display film layer 101 in the region to be detected I between the first end a and the second end B is difficult to detect when cracks occur, and the problem of crack omission is likely to occur. Therefore, in the present embodiment, when the conductive trace 112 surrounds the through hole 10 for one turn, the distance between the first end a and the second end B is greater than or equal to 2 μm and less than or equal to 20 μm, for example, the distance between the first end a and the second end B is 5 μm, 8 μm, or 12 μm. Fig. 3 is another schematic top view of the display panel, and as shown in fig. 3, when the number of the conductive traces 112 is one, the number of the conductive traces 112 surrounding the through hole 10 may be more than 1 turn. Because the number of turns of the conducting circuit 112 around the through hole 10 is greater than 1 turn, the conducting circuit 112 can detect cracks of the display film layer 101 at different distances from the central axis of the through hole 10, and the accuracy of the detection result of whether the display film layer 101 in the region I to be detected has cracks is improved.

It can be understood that, as shown in fig. 4, in order to facilitate the arrangement of the first outgoing line 122 and the second outgoing line 132, the conductive trace 112 has a connection portion a opposite to the first end a and in the same turn as the first end a, the conductive trace 112 pointing to the connection portion a from the first end a encloses a first turn and is arranged around a first direction, the conductive trace 112 of a second turn adjacent to the first turn is arranged around a second direction from the connection portion a, and the second direction is opposite to the first direction, the first direction is clockwise or counterclockwise, and the second direction is clockwise or counterclockwise.

Fig. 5 is a schematic diagram of another top view structure of the display panel, and fig. 6 is a schematic diagram of another top view structure of the display panel, as shown in fig. 5, the number of the conductive traces 112 is 2, and the 2 conductive traces 112 are sequentially disposed around the through holes 10. Alternatively, as shown in fig. 6, the number of the conductive traces 112 is N, N is greater than or equal to 2, and the N conductive traces 112 are sequentially disposed around the periphery of the through hole 10.

Since the number of the conductive traces 112 is greater than or equal to 2, whether cracks exist in the display film layer 101 of the to-be-detected area I corresponding to each conductive trace 112 can be determined according to whether each conductive trace 112 is open-circuited, so that the detection of the approximate position of the display film layer 101 with cracks is facilitated. It will be appreciated that the greater the number of conductive traces 112, the more accurate the location at which a crack in the conductive trace 112 can be detected.

For the scheme with the number of the conductive traces 112 being N, the distance between adjacent conductive traces 112 should not be too small, nor too large. If the distance between adjacent conductive traces 112 is too small, an electrical signal interference problem occurs between the adjacent conductive traces 112; if the distance between adjacent conductive traces 112 is too large, a crack in the display film layer 101 in the detection area I is likely to cause a missing detection. Therefore, the distance between adjacent conductive traces 112 is 2 μm or more and 20 μm or less.

In addition, the closer to the sidewall of the through-hole 10, the higher the probability of occurrence of cracks in the display film layer 101, and therefore, in order to improve the accuracy of detecting cracks in the display film layer 101, the minimum distance between the conductive line 112 and the sidewall of the through-hole 10 is 1000 μm or less, for example, 800 μm, 600 μm, 400 μm, 200 μm, 80 μm, or 50 μm. It is understood that the minimum distance before the conductive line 112 and the sidewall of the through-hole 10 refers to the distance between the conductive line closest to the central axis of the through-hole 10 and the sidewall of the through-hole 10.

In addition, if the minimum distance between the conductive line 112 and the sidewall of the through hole 10 is too large, the process of forming the through hole 10 may directly damage the conductive line 112, so that the reason for the open circuit in the conductive line 112 is directly caused by the process of forming the through hole 10, not caused by the crack in the display film layer 101, in this case, there may be a case where the conductive line 112 is open but there is actually no crack in the display film layer 101 of the region I to be detected. Therefore, in order to avoid direct damage to the conductive line 112 caused by the forming process of the through hole 10 and improve the crack detection accuracy, the minimum distance between the conductive line 112 and the sidewall of the through hole 10 should not be too small. In the present embodiment, the minimum distance between the conductive line 112 and the sidewall of the through hole 10 is greater than or equal to 10 μm.

That is, the minimum distance between the conductive line 11 and the sidewall of the via hole 10 is 10 μm or more and 1000 μm or less.

Because different layer membrane layer regions in the display membrane layer 101 of the detection area I are all likely to have cracks, a plurality of crack detection circuits 102 can be arranged, and each crack detection circuit 102 is arranged at different layer positions of the display membrane layer 101 of the detection area I, so that the cracks of the display membrane layer 101 in different layer membrane layers can be detected timely and effectively. For example, the display film layer 101 includes a metal layer and an inorganic layer, and accordingly, the crack detection circuit 102 is disposed on the metal layer and/or the inorganic layer, and specifically, the crack detection circuit may be disposed on the metal layer, or disposed on the inorganic layer, or disposed on both the metal layer and the inorganic layer. For example, the metal layer may be a conductive film layer of the driving device layer 121; the inorganic layer may be an inorganic film layer within the driving device layer 121, such as an interlayer dielectric layer or a planarization layer; the inorganic layer may also be a pixel defining layer or an encapsulation layer, etc.

The display film layer 101 has a plurality of conductive layers for implementing different conductive functions, and the conductive layers include data lines, gate lines, anodes, cathodes, and the like, so that the crack detection circuit 102 can be simultaneously manufactured by using a manufacturing process of a metal layer without adding additional process steps.

For example, the display film layer 101 has a data line (data line) therein, which is used to supply a data signal, the crack detection circuit 102 is made of the same material as the data line, and the data line is used to supply a driving signal to the display panel.

For example, the display film layer 101 has therein a gate line for supplying a scan signal, the crack detection circuit 102 is made of the same material as the gate line, and the gate line is used for supplying a gate control signal to the gate.

For example, the display film layer 101 has an anode therein, which is the anode of the light-emitting functional layer 131, and the crack detection circuit 102 is made of the same material as the anode. For example, the display film layer 101 has a cathode, which is a cathode of the light-emitting functional layer 131, and the crack detection circuit 102 is made of the same material as the cathode.

For example, the film layer 101 is shown having an array wiring layer therein, and the crack detection circuit 102 is made of the same material as the array wiring layer. For example, the display film layer 101 has a touch line therein, and the crack detection circuit 102 is made of the same material as the touch line.

It is to be understood that when there are a plurality of crack detection circuits 102, the plurality of crack detection circuits 102 may be one or a combination of any of the above enumerated cases.

The embodiment provides a display panel with excellent structural performance, and the cracks can be effectively and timely detected by arranging the crack detection circuit in the display film layer of the to-be-detected area around the through hole, so that the display panel with the cracks is prevented from being shipped to a client. More specifically, when the display film layer of the to-be-detected area around the through hole has cracks, the electrical characteristics of the corresponding conductive circuit located in the to-be-detected area will change, such as open circuit, and whether the display film layer has cracks is judged by detecting whether the conductive circuit has the electrical characteristic change.

Accordingly, an embodiment of the present invention further provides an electronic device, which includes the display panel and an auxiliary component, where a position of the auxiliary component corresponds to a position of the through hole, and specifically, external light can reach the auxiliary component through the through hole. For example, when the through-hole is a blind hole in the display film layer, the auxiliary member may be placed at the bottom of the through-hole. The auxiliary component can be a camera, an earphone, an ultrasonic sensor or an infrared sensor and the like.

The electronic device can be a product or a component with a display function, such as a mobile phone, a tablet computer, a television, a display, a digital photo frame or a navigator.

Correspondingly, the embodiment of the invention also provides a detection method which is applied to the display panel.

Fig. 7 is a schematic flow chart of a detection method according to an embodiment of the present invention.

Referring to fig. 7, the detection method includes: and detecting the crack detection circuit to obtain the electrical characteristics of the conductive circuit. Specifically, the method comprises the following steps:

and step S1, providing the input electric signal to the first terminal and/or the second terminal.

And step S2, detecting the output electric signal of the first end and/or the second end.

Specifically, in one embodiment, an input electrical signal is provided to the first terminal, and the input electrical signal may be a voltage signal or a current signal; and acquiring an output electric signal of the second end, wherein the type of the output electric signal is the same as that of the input electric signal, namely the output electric signal and the input electric signal are both voltage signals or both current signals.

In another embodiment, an input electrical signal is provided at both the first terminal and the second terminal, the input electrical signal is a voltage signal, and a voltage difference exists between the first terminal and the second terminal; and acquiring an output electric signal of the first end or the second end, wherein the output electric signal is a current signal.

Taking the electrical characteristic of the conductive circuit as an example of open circuit, when the conductive circuit is open circuit, the characterization shows that there is a crack in the film layer.

The input voltage is provided to the first terminal, the output voltage of the second terminal is detected, and when the output voltage is less than or equal to a voltage threshold value, the crack detection circuit is considered to be open, and the voltage threshold value can be reasonably set. And providing input current to the first end, detecting the output current of the second end, and when the output current is less than or equal to a current threshold value, considering that the crack detection circuit is broken, wherein the current threshold value can be reasonably set.

Providing an input voltage to a first terminal and a second terminal, and having a voltage difference between the first terminal and the second terminal; detecting the output current of the first end or the second end; calculating a resistance value of the crack detection circuit based on the voltage difference and the output current; when the resistance value is equal to or greater than the resistance threshold value, the crack detection circuit is considered to be open.

And step S3, judging whether the display film layer in the area to be detected has cracks or not based on the detected electrical characteristics.

And when the crack detection circuit is broken, judging that the display film layer in the detection area has cracks.

Whether the conductive circuit is broken or not is used as a standard for judging whether cracks exist in the display film layer, namely, the electric characteristics are detected only after the through hole is manufactured, and whether the cracks exist in the display film layer or not is judged based on the detection result.

In other embodiments, the detection may be performed before the through hole is fabricated, so as to obtain a first detection result, where the first detection result represents electrical characteristics of the conductive line, such as resistance; detecting after the through hole is manufactured to obtain a second detection result, wherein the second detection result represents the electrical characteristics of the conducting circuit, such as resistance, after the through hole is manufactured; and analyzing the change of the electrical characteristics of the conductive circuit based on the second detection result and the first detection result, and judging whether the film layer has cracks or not.

For example, the first detection result represents that the conductive circuit has a first resistance value, and the second detection result represents that the conductive circuit has a second resistance value; when the difference between the second resistance value and the first resistance value is greater than or equal to the resistance threshold value, it is considered that the conductive line has a crack therein. It is understood that the resistance threshold may be set reasonably according to the detection accuracy and the material shape of the conductive circuit, for example, the resistance threshold may be 0, 0.5 Ω, 5 Ω, and the like.

According to the detection method provided by the embodiment of the invention, whether cracks exist in the display film layer around the through hole is detected by detecting the electrical characteristics of the lead line, so that the cracks in the display film layer can be timely and effectively detected, and the reliability of the display panel or the electronic equipment comprising the display panel is improved.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.