阅读说明：本技术 微发光二极管显示基板、装置及制备方法 (Micro light-emitting diode display substrate, device and preparation method ) 是由 张立震 于 2019-09-26 设计创作，主要内容包括：本发明提供一种微发光二极管显示基板、装置及制备方法,属于显示技术领域。本发明的一种微发光二极管显示基板,包括：第一基底、位于第一基底上的多个微发光二极管；微发光二极管包括第一电极和第二电极；微发光二极管显示基板还包括：公共电极层,设置在第一电极和第二电极所在层背离第一基底的一侧；其中,公共电极层与各个微发光二极管的第二电极连接,且与第一电极断开设置；层间绝缘层,设置在公共电极层背离第一基底的一侧,且在层间绝缘层与微发光二极管的第一电极对应的位置设置有过孔；第一连接电极,设置在层间绝缘层背离第一基底的一侧,且与过孔一一对应设置,并通过与之对应的过孔与第一电极连接。(The invention provides a micro light-emitting diode display substrate, a device and a preparation method, and belongs to the technical field of display. The invention discloses a micro light-emitting diode display substrate, which comprises: the light emitting diode device comprises a first substrate and a plurality of micro light emitting diodes positioned on the first substrate; the micro light-emitting diode comprises a first electrode and a second electrode; the micro light emitting diode display substrate further includes: the common electrode layer is arranged on one side, away from the first substrate, of the layer where the first electrode and the second electrode are arranged; the common electrode layer is connected with the second electrode of each micro light-emitting diode and is disconnected from the first electrode; the interlayer insulating layer is arranged on one side of the common electrode layer, which is far away from the first substrate, and a through hole is formed in the position, corresponding to the first electrode of the micro light-emitting diode, of the interlayer insulating layer; and the first connecting electrodes are arranged on one side of the interlayer insulating layer, which is deviated from the first substrate, are in one-to-one correspondence with the via holes, and are connected with the first electrodes through the via holes corresponding to the via holes.)

1. A micro light emitting diode display substrate, comprising: the light emitting diode device comprises a first substrate and a plurality of micro light emitting diodes positioned on the first substrate; the micro light-emitting diode comprises a first electrode and a second electrode; characterized in that, the micro light emitting diode display substrate further comprises:

the common electrode layer is arranged on one side, away from the first substrate, of the layer where the first electrode and the second electrode are arranged; the common electrode layer is connected with the second electrode of each micro light-emitting diode and is disconnected from the first electrode;

the interlayer insulating layer is arranged on one side, away from the first substrate, of the common electrode layer, and a through hole is formed in the position, corresponding to the first electrode of the micro light-emitting diode, of the interlayer insulating layer;

and the first connecting electrodes are arranged on one side of the interlayer insulating layer, which is deviated from the first substrate, are in one-to-one correspondence with the via holes, and are connected with the first electrodes through the via holes corresponding to the first connecting electrodes.

2. A micro led display substrate according to claim 1, wherein the micro leds are the same color or at least some of the micro leds are different colors.

3. The micro light-emitting diode display substrate of claim 1, further comprising:

an adhesive layer disposed between the first substrate and the micro light emitting diode.

4. The micro light-emitting diode display substrate of claim 1, further comprising:

and the conductive adhesive layer is arranged on one side of the first connecting electrode, which is deviated from the first substrate.

5. The micro light-emitting diode display substrate of claim 4, wherein the material of the conductive glue layer comprises anisotropic conductive glue.

6. A micro light emitting diode display device comprising the micro light emitting diode display substrate according to any one of claims 1 to 5.

7. The micro-led display device of claim 6, further comprising: the array substrate is arranged opposite to the micro light-emitting diode display substrate;

the array substrate includes: the driving circuit comprises a second substrate, a plurality of driving devices positioned on the second substrate, and a plurality of second connecting electrodes positioned on a layer where the driving devices are positioned and connected with the driving devices;

the second connecting electrodes are connected with the first connecting electrodes in a one-to-one correspondence manner.

8. A micro-led display device according to claim 7, wherein the driving means comprises: a drive transistor;

the drain of the driving transistor is connected to the second connection electrode.

9. A method for preparing a micro light-emitting diode display substrate is characterized by comprising the following steps:

forming a plurality of micro light emitting diodes on a first substrate; the micro light-emitting diode comprises a first electrode and a second electrode;

covering the first electrode of each micro light-emitting diode with photoresist;

forming a common electrode layer on one side, away from the first substrate, of the layer where the first electrode and the second electrode of the micro light-emitting diode are located, and removing the photoresist to enable the common electrode layer to be connected with the second electrode of each micro light-emitting diode and disconnected from the first electrode;

forming an interlayer insulating layer on one side of the common electrode layer, which is far away from the first substrate, and arranging a through hole at a position, corresponding to the first electrode of the light-emitting diode, of the interlayer insulating layer;

and forming a plurality of first connecting electrodes on one side of the interlayer insulating layer, which is deviated from the first substrate, so that the first connecting electrodes correspond to the via holes one to one and are connected with the first electrodes through the via holes.

10. The method for manufacturing a micro light-emitting diode display substrate according to claim 9, wherein forming a common electrode layer on a side of the layer where the first electrode and the second electrode of the micro light-emitting diode are located, the side being away from the first substrate, comprises:

depositing and forming an initial common electrode layer on one side of the layer where the first electrode and the second electrode of the micro light-emitting diode are located, which is far away from the first substrate;

and photoetching the position corresponding to the first electrode in the initial common electrode layer to form the common electrode layer.

11. The method for manufacturing a micro light emitting diode display substrate according to claim 9, wherein the forming a plurality of first connection electrodes on a side of the interlayer insulating layer facing away from the first base comprises:

depositing and forming a first connecting electrode layer connected with the first electrode on one side of the interlayer insulating layer, which is far away from the first substrate;

and photoetching the position, corresponding to the gap between two adjacent micro light-emitting diodes, in the first connecting electrode layer to form a plurality of first connecting electrodes.

12. A method for manufacturing a micro light emitting diode display device, comprising the method for manufacturing a micro light emitting diode display substrate according to any one of claims 9 to 11.

13. The method of manufacturing a micro-led display device according to claim 12, further comprising:

forming a driving device on a second substrate;

forming a plurality of second connection electrodes connected with the driving device on the layer where the driving device is located;

and correspondingly connecting the second connecting electrodes with the first connecting electrodes in the micro light-emitting diode display substrate one by one.

Technical Field

The invention belongs to the technical field of display, and particularly relates to a micro light-emitting diode display substrate, a device and a preparation method.

Background

The Micro Light Emitting Diode (LED) display technology is to shrink the size of the existing LED to be less than 100 micrometers (μm), the size of the existing LED can be 1% of the size of the existing LED, and the Micro LED with micron size can be transferred and bound to a driving substrate through a huge transfer technology, so that various Micro LED display panels with different sizes can be formed.

The inventor finds that at least the following problems exist in the prior art: in the prior art, the Micro LED is directly and directly transferred in a huge amount and bound on the array substrate, the Micro LED needs to be accurately positioned, two electrodes of a P pole and an N pole of the Micro LED are respectively connected with two connecting electrodes on the array substrate in an alignment mode, the number of the Micro LED transferred at each time is large, the requirements on the stability and the accuracy of the huge amount transfer are high, and the huge amount transfer difficulty is greatly increased.

Disclosure of Invention

The present invention at least solves one of the technical problems in the prior art, and provides a micro light emitting diode display substrate, a micro light emitting diode display device and a manufacturing method thereof.

The technical scheme adopted for solving the technical problem of the invention is a micro light-emitting diode display substrate, which comprises: the light emitting diode device comprises a first substrate and a plurality of micro light emitting diodes positioned on the first substrate; the micro light-emitting diode comprises a first electrode and a second electrode; the micro light emitting diode display substrate further includes:

the common electrode layer is arranged on one side, away from the first substrate, of the layer where the first electrode and the second electrode are arranged; the common electrode layer is connected with the second electrode of each micro light-emitting diode and is disconnected from the first electrode;

the interlayer insulating layer is arranged on one side, away from the first substrate, of the common electrode layer, and a through hole is formed in the position, corresponding to the first electrode of the micro light-emitting diode, of the interlayer insulating layer;

and the first connecting electrodes are arranged on one side of the interlayer insulating layer, which is deviated from the first substrate, are in one-to-one correspondence with the via holes, and are connected with the first electrodes through the via holes corresponding to the first connecting electrodes.

Optionally, a plurality of the micro light emitting diodes are the same color, or at least some of the micro light emitting diodes are different in color.

Optionally, the micro light emitting diode display substrate further includes:

an adhesive layer disposed between the first substrate and the micro light emitting diode.

Optionally, the micro light emitting diode display substrate further includes:

and the conductive adhesive layer is arranged on one side of the first connecting electrode, which is deviated from the first substrate.

Optionally, the material of the conductive adhesive layer includes anisotropic conductive adhesive.

The technical scheme adopted for solving the technical problem of the invention is a micro light-emitting diode display device which comprises the micro light-emitting diode display substrate.

Optionally, the micro light emitting diode display device further comprises: the array substrate is arranged opposite to the micro light-emitting diode display substrate;

the array substrate includes: the driving circuit comprises a second substrate, a plurality of driving devices positioned on the second substrate, and a plurality of second connecting electrodes positioned on a layer where the driving devices are positioned and connected with the driving devices;

the second connecting electrodes are connected with the first connecting electrodes in a one-to-one correspondence manner.

Optionally, the driving device comprises: a drive transistor;

the drain of the driving transistor is connected to the second connection electrode.

The technical scheme adopted for solving the technical problem of the invention is a preparation method of a micro light-emitting diode display substrate, which comprises the following steps:

forming a plurality of micro light emitting diodes on a first substrate; the micro light-emitting diode comprises a first electrode and a second electrode;

covering the first electrode of each micro light-emitting diode with photoresist;

forming a common electrode layer on one side, away from the first substrate, of the layer where the first electrode and the second electrode of the micro light-emitting diode are located, and removing the photoresist to enable the common electrode layer to be connected with the second electrode of each micro light-emitting diode and disconnected from the first electrode;

forming an interlayer insulating layer on one side of the common electrode layer, which is far away from the first substrate, and arranging a through hole at a position, corresponding to the first electrode of the light-emitting diode, of the interlayer insulating layer;

and forming a plurality of first connecting electrodes on one side of the interlayer insulating layer, which is deviated from the first substrate, so that the first connecting electrodes correspond to the via holes one to one and are connected with the first electrodes through the via holes.

Optionally, the forming a common electrode layer on a side of the layer where the first electrode and the second electrode of the micro light emitting diode are located, the side being away from the first substrate, includes:

depositing and forming an initial common electrode layer on one side of the layer where the first electrode and the second electrode of the micro light-emitting diode are located, which is far away from the first substrate;

and photoetching the position corresponding to the first electrode in the initial common electrode layer to form the common electrode layer.

Optionally, the forming a plurality of first connection electrodes on a side of the interlayer insulating layer facing away from the first substrate includes:

depositing and forming a first connecting electrode layer connected with the first electrode on one side of the interlayer insulating layer, which is far away from the first substrate;

and photoetching the position, corresponding to the gap between two adjacent micro light-emitting diodes, in the first connecting electrode layer to form a plurality of first connecting electrodes.

The technical scheme adopted for solving the technical problem of the invention is a preparation method of a micro light-emitting diode display device, which comprises the preparation method of the micro light-emitting diode display substrate.

Optionally, the method for manufacturing a micro light emitting diode display device further includes:

forming a driving device on a second substrate;

forming a plurality of second connection electrodes connected with the driving device on the layer where the driving device is located;

and correspondingly connecting the second connecting electrodes with the first connecting electrodes in the micro light-emitting diode display substrate one by one.

Drawings

Fig. 1 is a schematic structural diagram of a micro light emitting diode display substrate according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a micro light emitting diode display device according to an embodiment of the present invention;

fig. 3 is a schematic flow chart illustrating a method for manufacturing a micro light emitting diode display substrate according to an embodiment of the present invention;

fig. 4a to fig. 4g are schematic diagrams illustrating steps in a method for manufacturing a micro light emitting diode display substrate according to an embodiment of the invention;

fig. 5 is a schematic flow chart illustrating a method for manufacturing a micro light emitting diode display device according to an embodiment of the present invention;

fig. 6a to fig. 6c are schematic diagrams illustrating steps in a method for manufacturing a micro light emitting diode display device according to an embodiment of the present invention.

Wherein the reference numerals are:

10-micro light emitting diode display substrate, 101-first substrate, 102-micro light emitting diode, 103-common electrode layer, 104-interlayer insulating layer, 105-via hole, 106-first connecting electrode, 107-adhesive layer, 108-conductive glue layer, P-first electrode, N-second electrode, 20-array substrate, 201-second substrate, 202-driving device, and 203-second connecting electrode.

Detailed Description

In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.