阅读说明：本技术 集成电路芯片和集成电路 (IC chip and integrated circuit ) 是由 曹旺 陆健 张敏 高庆 于 2019-08-23 设计创作，主要内容包括：本发明实施例提供了一种集成电路芯片和集成电路。该集成电路芯片包括：内核结构、隔离区和多个压焊块,所述隔离区位于所述内核结构和多个压焊块之间；多个所述压焊块位于所述内核结构之外的一个指定区域中。本发明实施例提供的一种集成电路芯片和集成电路的技术方案中,由于多个压焊块位于内核结构之外的一个指定区域中,因此当多个压焊块之间静电放电时,放电电流不会通过内核结构,从而避免了对内核结构造成损伤。(The embodiment of the invention provides a kind of IC chip and integrated circuits.The IC chip includes: inner core, isolated area and multiple press welding blocks, and the isolated area is between the inner core and multiple press welding blocks；Multiple press welding blocks are located in a specified region except the inner core.In the technical solution of a kind of IC chip and integrated circuit provided in an embodiment of the present invention, since multiple press welding blocks are located in a specified region except inner core, therefore when static discharge between multiple press welding blocks, discharge current will not cause to damage by inner core so as to avoid to inner core.)

1. a kind of IC chip characterized by comprising inner core, isolated area and multiple press welding blocks, the isolated area Between the inner core and multiple press welding blocks；

Multiple press welding blocks are located in a specified region except the inner core.

2. IC chip according to claim 1, which is characterized in that the specified region includes being located at the kernel The region of structure side.

3. IC chip according to claim 1, which is characterized in that the side of the inner core has open region Domain, the open area include the specified region.

4. IC chip according to claim 1, which is characterized in that the inner core has hollowed out area, institute Stating hollowed out area includes the specified region.

5. IC chip according to claim 4, which is characterized in that the hollowed out area is located at the inner core Middle position.

6. IC chip according to any one of claims 1 to 5, which is characterized in that multiple press welding blocks are described in One side direction of IC chip is extended.

7. IC chip according to claim 6, which is characterized in that multiple press welding blocks are set in a column multirow It sets；Alternatively, multiple press welding blocks are arranged in multiple row multirow.

8. IC chip according to claim 1, which is characterized in that the input/output port power supply line is located at multiple The underface of the press welding block.

9. a kind of integrated circuit, which is characterized in that including any IC chip of shell and claim 1 to 8, institute Ic chip package is stated in the shell；

The shell includes the pin being correspondingly arranged with multiple press welding blocks, and the pin passes through connection with corresponding press welding block Line electrical connection.

10. integrated circuit according to claim 9, which is characterized in that multiple pins are distributed in the integrated circuit The two sides of chip；

If multiple press welding blocks are arranged in a column multirow, the pin positioned at the IC chip side is successively arranged with one Even number press welding block in press welding block is electrically connected by connecting line, positioned at the IC chip other side pin successively with Odd number press welding block in the column press welding block is electrically connected by connecting line.

[technical field]

The present invention relates to IC design field more particularly to a kind of IC chips and integrated circuit.

[background technique]

Integrated circuit is a kind of microelectronic device or component.Using certain technique, crystalline substance needed for a circuit The elements such as body pipe, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter semiconductor wafer or dielectric substrate, Chip or substrate after completing are commonly referred to as IC chip, and ic chip package becomes in a shell Integrated circuit with required circuit function.Using wire the press welding block and shell of ic core on piece in encapsulation process On metal pin be attached, to realize the electrical connection of press welding block and metal pin.

Fig. 1 is the structural schematic diagram of IC chip in the prior art, as shown in Figure 1, the IC chip 100 wraps Include inner core 21, isolated area 22, press welding block 23 and input/output port power supply line 28.Multiple press welding blocks 23 divide for multiple groups, and every group Press welding block 23 is located at the side of inner core 1, as shown in Figure 1, four groups of press welding blocks 23 are distributed in the surrounding of inner core 21.Kernel Each side of structure 21 is provided with one group of press welding block 23, isolated area 22 be located at this group of press welding block 23 and inner core 21 it Between.Input/output port power supply line 28 is arranged around inner core 21.In the prior art, press welding block 23 may be located on inner core 21 two sides or three sides.

[summary of the invention]

In view of this, the embodiment of the invention provides a kind of IC chip and integrated circuit, for avoiding electric discharge electricity Stream causes to damage to kernel circuitry.

On the one hand, the embodiment of the invention provides a kind of IC chips, comprising: inner core, isolated area and multiple Press welding block, the isolated area is between the inner core and multiple press welding blocks；

Multiple press welding blocks are located in a specified region except the inner core.

Optionally, the specified region includes positioned at the region of the inner core side.

Optionally, the side of the inner core has open area, and the open area includes the specified region.

Optionally, the inner core has hollowed out area, and the hollowed out area includes the specified region.

Optionally, the middle position that hollowed out area is located at the inner core is stated.

Optionally, which is characterized in that multiple press welding blocks extend along a side direction of the inner core Setting.

Optionally, multiple press welding blocks are arranged in a column multirow；Alternatively, multiple press welding blocks are arranged in multiple row multirow.

Optionally, the input/output port power supply line is located at the underface of multiple press welding blocks.

On the other hand, the embodiment of the invention provides a kind of integrated circuit, including shell and said integrated circuit chip, institutes Ic chip package is stated in the shell；

The shell includes the pin being correspondingly arranged with multiple press welding blocks, and the pin passes through with corresponding press welding block Connecting line electrical connection.

Optionally, multiple pins are distributed in the two sides of the IC chip；

If multiple press welding blocks in a column multirow be arranged, positioned at the IC chip side pin successively with Even number press welding block in one column press welding block is electrically connected by connecting line, positioned at the IC chip other side pin according to The secondary odd number press welding block with the column press welding block is electrically connected by connecting line.

In the technical solution of a kind of IC chip and integrated circuit provided in an embodiment of the present invention, due to multiple pressure weldings Block is located in a specified region except inner core, therefore when static discharge between multiple press welding blocks, discharge current is not It can cause to damage so as to avoid to inner core by inner core.In the embodiment of the present invention, isolated area is only located at specified area Between press welding block and inner core in domain, compared with isolated area in the prior art is located at multiple sides of inner core, subtract The small length of isolated area further reduces the area that isolated area occupies IC chip, to reduce integrated circuit The entire area of chip, and then further reduced the manufacturing cost of integrated circuit.In the embodiment of the present invention, multiple press welding blocks are only In a specified region, since input/output port power supply line is located at the underface of multiple press welding blocks, with the prior art Middle input/output port power supply line is compared around the scheme that four sides of inner core are arranged, and it is defeated that input is reduced in the present embodiment Outlet power line occupies the area of IC chip, to reduce the entire area of IC chip, and then further Reduce the manufacturing cost of integrated circuit.

[Detailed description of the invention]

In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached Figure is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this field For those of ordinary skill, without creative efforts, it can also be obtained according to these attached drawings other attached drawings.

Fig. 1 is the structural schematic diagram of IC chip in the prior art；

Fig. 2 is a kind of structural schematic diagram of IC chip provided in an embodiment of the present invention；

Fig. 3 is the structural schematic diagram of another IC chip provided in an embodiment of the present invention；

Fig. 4 is the structural schematic diagram of another IC chip provided in an embodiment of the present invention；

Fig. 5 is the structural schematic diagram of another IC chip provided in an embodiment of the present invention；

Fig. 6 is the structural schematic diagram of another IC chip provided in an embodiment of the present invention；

Fig. 7 is a kind of schematic diagram of packaged type of IC chip in the embodiment of the present invention；

Fig. 8 is the schematic diagram of another packaged type of IC chip in the embodiment of the present invention.

[specific embodiment]

For a better understanding of the technical solution of the present invention, being retouched in detail to the embodiment of the present invention with reference to the accompanying drawing It states.

It will be appreciated that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Base Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its Its embodiment, shall fall within the protection scope of the present invention.

The term used in embodiments of the present invention is only to be not intended to be limiting merely for for the purpose of describing particular embodiments The present invention.In the embodiment of the present invention and the "an" of singular used in the attached claims, " described " and "the" It is also intended to including most forms, unless the context clearly indicates other meaning.

It should be appreciated that term "and/or" used herein is only a kind of incidence relation for describing affiliated partner, indicate There may be three kinds of relationships, for example, A and/or B, can indicate: individualism A, exist simultaneously A and B, individualism B these three Situation.In addition, character "/" herein, typicallys represent the relationship that forward-backward correlation object is a kind of "or".

Fig. 2 is a kind of structural schematic diagram of IC chip provided in an embodiment of the present invention, as shown in Fig. 2, this is integrated Circuit chip 200 includes: inner core 21, isolated area 22 and multiple press welding blocks 23, and isolated area 22 is located at inner core 21 and more Between a press welding block 23, multiple press welding blocks 23 are located in a specified region 24 except inner core 21.

In the embodiment of the present invention, in a specified region 24 being located at except inner core 21 due to multiple press welding blocks 23, Therefore when static discharge between multiple press welding blocks 23, discharge current will not be by inner core 21, so as to avoid to kernel Structure 21 causes to damage.

In the embodiment of the present invention, inner core 21 may include the elements such as several transistors, resistance, capacitor, integrated to realize The specific function of circuit.The advantage of integrated circuit is exactly that can integrate the element of a myriad of in same IC chip In 200.Usual inner core 21 occupies the most of area of IC chip 200.

In the embodiment of the present invention, isolated area 22 is inputted on an integrated circuit die according to the design of IC design rule One or more protection structure between delivery outlet and inner core 21.The electric current of input/output port is larger, easily causes bolt-lock Effect (Latch Up) triggers high current in IC interior, burns integrated circuit malfunction even, therefore integrated The phenomenon that isolated area 22 is set in circuit chip 200, integrated circuit malfunction can be effectively prevent even to burn.

In the embodiment of the present invention, press welding block 23 is an exposed metallic region.It is packaged in when by IC chip 200 In shell, press welding block 23 is bonded with one end of wire, and the other end of wire is bonded on the metal pin of shell, thus Realize the electrical connection of IC interior and integrated circuit external.

Further, which further includes input/output port power supply line, which uses The each input and output mouth structure for being located at 23 lower section of press welding block on for IC chip 200 provides power supply, and for positioned at pressure Static discharge (ESD) the protection structure of 23 lower section of welding block provides electric current leakage path.Input/output port power supply line and press welding block 23 are located at different layers, for example, input/output port power supply line can be located at the underface of multiple press welding blocks 23.Input/output port power supply line It may include at least one the first power supply line and at least one second source lines.Wherein, the first power supply line can be vdd line, first High level signal is loaded on power supply line；Second source line can be GND line, load low level signal on second source line.Into one Step ground, the IC chip can also include function element, and function element can be located at the underface of press welding block, input/output port Power supply line can be electrically connected with function element, and function element is electrically connected with press welding block.Wherein, function element may include static discharge (Electro-Static discharge, abbreviation ESD) protects device and/or driving element, for example, driving element can be gold Category-oxide semiconductor field effect transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, abbreviation metal-oxide-semiconductor), which can be NMOS tube or PMOS tube, the source electrode of metal-oxide-semiconductor and the first power supply line or The electrical connection of second source line, the drain electrode of metal-oxide-semiconductor is electrically connected with press welding block 23, at this point, the first power supply line or second source line can be with The source electrode same layer of metal-oxide-semiconductor is arranged.Particularly, when a press welding block 23 be the first power supply line press welding block when, the first power supply line directly with The electrical connection of first power supply line press welding block；When a press welding block 23 is second source line press welding block, second source line is directly with second The electrical connection of power supply line press welding block.It should be understood that input/output port power supply line and function element are not drawn specifically in Fig. 2.

In the embodiment of the present invention, specified region 24 includes positioned at the region of 21 side of inner core.Specified region 24 can be with For positioned at the region of any side of inner core 21.As shown in Fig. 2, the shape of inner core 21 is rectangle, then inner core 21 have four sides, and specifying region 24 can be the region of any side in four sides of kernel area 21.In Fig. 2 Inner core 21 shape be regular shape, in practical applications, internal structure 21 can also be polymorphic structure, such situation It no longer specifically describes in the present embodiment.

In the embodiment of the present invention, the position in specified region 24 can be determined according to the quantity of the press welding block 23 of setting.Work as pressure welding When the quantity of block 23 is more, therefore specified region 24 can be for positioned at the area of the longest side of length of inner core 21 Domain, to meet the biggish demand of 23 area occupied of press welding block.

In the embodiment of the present invention, region 24 is specified to be extended along a side direction of inner core 21, then position Multiple press welding blocks 23 in specified region 24 are extended along a side direction of inner core 21.For example, such as Fig. 2 Shown, multiple press welding blocks 23 are arranged in a column multirow, the area occupied of multiple press welding blocks 23 are reduced, to further reduce The entire area of IC chip 200.

In the embodiment of the present invention, for avoid integrated circuit malfunction even burn the phenomenon that appearance, the width of isolated area 22 Degree needs to be greater than minimum setting width.And layout of the length of isolated area 22 then according to IC chip 200 is different, such as Shown in Fig. 2, since multiple press welding blocks 23 are located in specified region, isolated area 22 is only arranged at specified region 24 and interior Between nuclear structure 21, compared with prior art, the length of isolated area 22 is reduced, to further reduce the occupancy of isolated area 22 The area of IC chip 200, and then further reduced the manufacturing cost of integrated circuit.

In the embodiment of the present invention, it is located in the specified region of inner core side due to multiple press welding blocks, when multiple Between press welding block when static discharge, discharge current will not cause to damage by inner core so as to avoid to inner core.This In inventive embodiments, isolated area is only located between the press welding block and inner core in specified region, is isolated in the prior art Multiple sides that area is located at inner core are compared, and the length of isolated area is reduced, and are further reduced isolated area and are occupied integrated electricity The area of road chip to reduce the entire area of IC chip, and then further reduced the manufacture of integrated circuit Cost.In the embodiment of the present invention, multiple press welding blocks are only located in a specified region, since input/output port power supply line is positioned at more The underface of a press welding block, therefore be arranged with input/output port power supply line in the prior art around four sides of inner core Scheme is compared, and the area that input/output port power supply line occupies IC chip is reduced in the present embodiment, to reduce collection At the entire area of circuit chip, and then it further reduced the manufacturing cost of integrated circuit.In the embodiment of the present invention, press welding block A column multirow setting mode, can also provide between press welding block and pin connecting line wiring flexibility.

Fig. 3 is the structural schematic diagram of another IC chip provided in an embodiment of the present invention, as shown in figure 3, this reality The difference for applying example and embodiment in above-mentioned Fig. 2 is: in the present embodiment, multiple press welding blocks 23 are arranged in multiple row multirow.

In the embodiment of the present invention, the arrangement mode of multiple press welding blocks 23 can be according to the quantity and ic core of press welding block 23 The integral layout of piece 200 is configured.For example, when the quantity of press welding block 23 is more, it can be in specified region 24 by press welding block 23 are configured according to the arrangement mode of multiple row multirow.As shown in figure 3, multiple press welding blocks 23 are arranged in two column multirows.

In the embodiment of the present invention, multiple press welding blocks are arranged in multiple row multirow, to meet the integrated of different designs structure The demand of circuit chip improves the flexibility of design of integrated circuit.

Fig. 4 is the structural schematic diagram of another IC chip provided in an embodiment of the present invention, as shown in figure 4, this reality The difference for applying example and embodiment in above-mentioned Fig. 2 is: in the present embodiment, the side of inner core 21 has open area 25, should Open area 25 includes specified region 24.

In the present embodiment, multiple press welding blocks 23 can be arranged according to the arrangement mode of the column multirow in Fig. 2 or multiple pressures Welding block 23 can be arranged according to the spread pattern of the multiple row multirow in Fig. 3.

In the present embodiment, since isolated area 22 is between inner core 21 and multiple press welding blocks 23, isolated area 22 It also is located in open area 25.

Fig. 5 is the structural schematic diagram of another IC chip provided in an embodiment of the present invention, as shown in figure 5, this reality The difference for applying example and embodiment in above-mentioned Fig. 4 is: the present embodiment split shed region 29 has two sides, and opening in Fig. 4 Mouth region domain 29 has three sides.

Embodiment in Fig. 4 can be found in remaining description of IC chip in the present embodiment, details are not described herein again.

Fig. 6 is the structural schematic diagram of another IC chip provided in an embodiment of the present invention, as shown in fig. 6, this reality The difference for applying example and embodiment in above-mentioned Fig. 2 is: in the present embodiment, inner core 21 has hollowed out area 26, hollowed out area 26 include specified region 24.

Since hollowed out area 26 is located at the middle position of inner core 21, and specified region 24 is located in hollowed out area 26, Therefore multiple press welding blocks 23 are located at the middle position in inner core 21.

In the present embodiment, multiple press welding blocks 23 can be arranged according to the arrangement mode of the column multirow in Fig. 2 or multiple pressures Welding block 23 can be arranged according to the spread pattern of the multiple row multirow in Fig. 3.

In the present embodiment, since isolated area 22 is between inner core 21 and multiple press welding blocks 23, isolated area 22 It also is located in hollowed out area 26.

The embodiment of the invention provides a kind of integrated circuit, which includes shell and IC chip, is integrated For circuit chip package in shell, shell includes the pin being correspondingly arranged with multiple press welding blocks, and pin is logical with corresponding press welding block Cross connecting line electrical connection.

In the present embodiment, ic core of the above-mentioned Fig. 2 in any embodiment into Fig. 6 is can be used in IC chip Piece is not repeated to describe herein.

In the present embodiment, connecting line can be wire.

Different packaged types can be used in the present embodiment to be packaged IC chip.

Fig. 7 is a kind of schematic diagram of packaged type of IC chip in the embodiment of the present invention, as shown in fig. 7, this reality It applies in example, multiple pins are distributed in the two sides of IC chip 200.Wherein, it is retouched by taking 16 press welding blocks 23 as an example in Fig. 7 It states, is then provided with 16 pins in shell, wherein pin 1 is set to the side of IC chip 200, pin 9 to pin 8 It is located at the other side of IC chip 200 to pin 16.

As shown in fig. 7, multiple press welding blocks 23 in a column multirow be arranged, positioned at 200 side of IC chip pin according to The secondary even number press welding block with a column press welding block 23 is electrically connected by connecting line 27, is located at 200 other side of IC chip Pin be successively electrically connected with the odd number press welding block 23 in the column press welding block 23 by connecting line 27.For example, pin 1 and the 2nd A press welding block 3 is electrically connected by connecting line 27, and pin 2 is electrically connected with the 4th press welding block 23 by connecting line 27, and so on； Pin 16 is electrically connected with the 1st press welding block 23 by connecting line 27, and pin 15 is electrically connected with the 3rd press welding block 23 by connecting line 27 It connects, and so on.

In practical applications, multiple pins can also be distributed in the surrounding of IC chip 200, for example, multiple pins It can be distributed in four sides of IC chip 200.Above situation is not drawn specifically in figure.

Fig. 8 is the schematic diagram of another packaged type of IC chip in the embodiment of the present invention, as shown in figure 8, Fig. 8 In packaged type be with the difference of the packaged type in Fig. 7: connecting line 7 in Fig. 8 not replaces from IC chip 200 two sides are drawn, but are located at the pin of IC chip 200 and any corresponding press welding block in a column press welding block 23 23 are electrically connected by connecting line 27, positioned at 200 other side of IC chip pin successively with its in the column press welding block 23 Remaining corresponding press welding block 23 is electrically connected by connecting line 27.

As shown in figure 8, pin 2 is pressed with the 4th for example, pin 1 and the 3rd press welding block 23 are electrically connected by connecting line 27 Welding block 23 is electrically connected by connecting line 27, and pin 3 passes through connecting line 27 with the 6th press welding block 23 and is electrically connected, pin 4 and the 8th Press welding block 23 is electrically connected by connecting line 27, and pin 5 passes through connecting line 27 with the 10th press welding block 23 and is electrically connected, pin 6 and the 14 press welding blocks 23 are electrically connected by connecting line 27, and pin 7 is electrically connected with the 15th press welding block 23 by connecting line 27, pin 8 It is electrically connected with the 16th press welding block 23 by connecting line 27；Pin 16 is electrically connected with the 1st press welding block 23 by connecting line 27, is managed Foot 15 is electrically connected with the 2nd press welding block 23 by connecting line 27, and pin 14 is electrically connected with the 5th press welding block 23 by connecting line 27 It connects, pin 13 is electrically connected with the 7th press welding block 23 by connecting line 27, and pin 12 and the 9th press welding block 23 pass through connecting line 27 Electrical connection, pin 11 are electrically connected with the 11st press welding block 23 by connecting line 27, and pin 10 and the 12nd press welding block 23 pass through company Wiring 27 is electrically connected, and pin 9 is electrically connected with the 13rd press welding block 23 by connecting line 27.

The different packaged types that Fig. 7 and Fig. 8 is used are packaged IC chip, and connecting line 27 replaces in Fig. 7 It is drawn from the two sides of IC chip 200, and connecting line 27 is arbitrarily drawn from the two sides of IC chip 200 in Fig. 8, because This, the embodiment of the invention provides the flexibilities that connecting line in encapsulation process is routed.Packaged type provided in this embodiment can spirit It is living to change putting in order for ic pin, without change existing printed wiring board (Printed Circuit Board, Abbreviation PCB).

In the technical solution of integrated circuit provided in an embodiment of the present invention, since multiple press welding blocks are located at except inner core A specified region in, therefore when static discharge between multiple press welding blocks, discharge current will not by inner core, thus It avoids and inner core is caused to damage.In the embodiment of the present invention, isolated area is only located at press welding block and kernel in specified region Between structure, compared with isolated area in the prior art is located at multiple sides of inner core, the length of isolated area is reduced, into One step reduces the area that isolated area occupies IC chip, to reduce the entire area of IC chip, in turn It further reduced the manufacturing cost of integrated circuit.In the embodiment of the present invention, multiple press welding blocks are only located in a specified region, Since input/output port power supply line is located at the underface of multiple press welding blocks, enclosed with input/output port power supply line in the prior art The scheme being arranged around four sides of inner core is compared, and input/output port power supply line is reduced in the present embodiment and occupies integrated electricity The area of road chip to reduce the entire area of IC chip, and then further reduced the manufacture of integrated circuit Cost.

The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of the present invention.