阅读说明：本技术 扇出型封装结构及其制作方法 (Fan-out type packaging structure and manufacturing method thereof ) 是由 潘盈洁 吕香桦 倪庆羽 于 2019-11-06 设计创作，主要内容包括：本发明提出一种扇出型封装结构的制作方法,包括以下步骤：提供一载板,所述载板其中一表面上设置有一重布线层,所述重布线层中设有至少一导电线路；在所述重布线层上形成一定位片；在所述定位片上开设至少一开孔,其中,所述开孔贯穿所述定位片；在每一所述开孔中安装一芯片,并使得所述芯片与所述导电线路电连接；以及去除所述载板,从而得到所述扇出型封装结构。本发明提供的扇出型封装结构的制作方法能够防止所述芯片偏移。本发明还提供一种由所述方法制备的扇出型封装结构。(The invention provides a manufacturing method of a fan-out type packaging structure, which comprises the following steps: providing a carrier plate, wherein a rewiring layer is arranged on one surface of the carrier plate, and at least one conductive circuit is arranged in the rewiring layer; forming a positioning sheet on the rewiring layer; the positioning sheet is provided with at least one opening, wherein the opening penetrates through the positioning sheet; mounting a chip in each opening, and electrically connecting the chip with the conductive circuit; and removing the carrier plate, thereby obtaining the fan-out type packaging structure. The manufacturing method of the fan-out type packaging structure can prevent the chip from offsetting. The invention also provides a fan-out type packaging structure prepared by the method.)

1. A manufacturing method of a fan-out type packaging structure is characterized by comprising the following steps:

providing a carrier plate, wherein a rewiring layer is arranged on one surface of the carrier plate, and at least one conductive circuit is arranged in the rewiring layer;

forming a positioning sheet on the rewiring layer;

the positioning sheet is provided with at least one opening, wherein the opening penetrates through the positioning sheet;

mounting a chip in each opening, and electrically connecting the chip with the conductive circuit; and

and removing the carrier plate to obtain the fan-out type packaging structure.

2. The method of fabricating the fan-out package structure of claim 1, further comprising, after mounting the die, the steps of:

and removing the positioning sheet.

3. The method of fabricating the fan-out package structure of claim 1 or 2, further comprising, after mounting the die, the steps of:

and forming a protective layer on the surface of the chip and the side surface of the rewiring layer.

4. The method as claimed in claim 3, wherein each of the conductive traces includes at least a first bonding pad on a surface of the redistribution layer away from the carrier, the first bonding pad is exposed on the surface of the redistribution layer away from the carrier, the opening corresponds to the first bonding pad, and the chip is electrically connected to the first bonding pad.

5. The method as claimed in claim 4, wherein the diameter of the opening increases from the surface of the spacer adjacent to the redistribution layer to the surface of the spacer away from the redistribution layer, the diameter of the opening adjacent to the redistribution layer is equal to the width of the first connection pad, a gap is formed between the portion of the chip away from the redistribution layer and the inner wall of the opening, and the protection layer is further filled in the gap.

6. The method of manufacturing the fan-out package structure of claim 1, wherein the redistribution layer is bonded to the carrier by a peelable film.

7. A fan-out package structure, comprising:

the redistribution layer is provided with at least one conductive circuit;

the positioning piece is formed on the rewiring layer, at least one opening is formed in the positioning piece, and the opening penetrates through the positioning piece; and

and each chip is arranged in one of the openings and is electrically connected with the conductive circuit.

8. The fan-out package structure of claim 7, further comprising a protective layer covering a surface of the chip away from the redistribution layer and sides of the redistribution layer.

9. The fan-out package structure of claim 8, wherein each of the conductive traces includes at least a first connection pad on a surface of the redistribution layer adjacent to the positioning tab, the first connection pad exposed on the surface of the redistribution layer adjacent to the positioning tab, the opening corresponding to the first connection pad, and the chip electrically connected to the first connection pad.

10. The fan-out package structure of claim 9, wherein a diameter of the opening increases from a surface of the spacer adjacent to the redistribution layer to a surface of the spacer away from the redistribution layer, the diameter of the opening adjacent to the redistribution layer is equal to a width of the first connection pad, a portion of the chip away from the redistribution layer forms a gap with an inner wall of the opening, and the protection layer further fills in the gap.

Technical Field

The invention relates to the technical field of packaging, in particular to a fan-out type packaging structure and a manufacturing method thereof.

Background

The fan-out package is an embedded package and one of the main advanced packages with good integration flexibility. At present, a fan-out package is generally manufactured by mounting a chip on a carrier, forming a package layer on the carrier by molding to cover the chip, and disposing a conductive wire in the package layer. However, during the temporary bonding process between the die and the carrier, the chip in the package layer may shift, which may result in poor connection between the chip and the wires in the package layer, and thus may affect the quality of the fan-out package structure.

Disclosure of Invention

In view of the above, the present invention provides a method for manufacturing a fan-out package structure capable of preventing chip offset.

In addition, it is necessary to provide a fan-out package structure manufactured by the above manufacturing method.

The invention provides a manufacturing method of a fan-out type packaging structure, which comprises the following steps:

providing a carrier plate, wherein a rewiring layer is arranged on one surface of the carrier plate, and at least one conductive circuit is arranged in the rewiring layer;

forming a positioning sheet on the rewiring layer;

the positioning sheet is provided with at least one opening, wherein the opening penetrates through the positioning sheet;

mounting a chip in each opening, and electrically connecting the chip with the conductive circuit; and

and removing the carrier plate to obtain the fan-out type packaging structure.

The invention also provides a fan-out package structure, comprising:

the redistribution layer is provided with at least one conductive circuit;

the positioning piece is formed on the rewiring layer, at least one opening is formed in the positioning piece, and the opening penetrates through the positioning piece; and

and each chip is arranged in one of the openings and is electrically connected with the conductive circuit.

According to the fan-out type packaging structure, the positioning sheet is arranged on the rewiring layer, the opening is formed in the positioning sheet, the chip is installed in the opening to achieve positioning of the chip, the position of the chip is prevented from being affected by subsequent processes, accordingly, deviation of the chip is prevented, meanwhile, the alignment precision between the chip and the conductive circuit is improved, and further the quality of the fan-out type packaging structure is improved.

Drawings

Fig. 1 is a schematic structural diagram of a carrier board and a redistribution layer according to a first embodiment of the present invention.

Fig. 2 is a schematic structural view of a spacer formed on the redistribution layer shown in fig. 1.

Fig. 3 is a schematic structural view of the positioning sheet shown in fig. 2 after the positioning sheet is provided with the opening.

Fig. 4 is a schematic view of the structure of fig. 3 after a chip is mounted in the opening.

Fig. 5 is a schematic structural view of the chip shown in fig. 4 after forming a protective layer on the surface and the side surface of the redistribution layer.

Fig. 6 is a schematic structural diagram of the carrier board shown in fig. 5 after being removed.

Fig. 7 is a schematic structural diagram of a fan-out package structure obtained by cutting the protective layer, the positioning sheet, the redistribution layer, and the peelable film shown in fig. 6.

Fig. 8 is a schematic structural diagram of a fan-out package structure according to a second embodiment of the present invention.

Description of the main elements

Fan-out package structure 100, 200

Carrier plate 10

Redistribution layer 20

Conductive line 21

First connection pad 211

Second connecting pad 212

Peelable film 30

Positioning sheet 40

Opening 41

Gap 411

Chip 50

Protective layer 60

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.

A first embodiment of the present invention provides a method for manufacturing a fan-out package structure, including the following steps:

in step S1, please refer to fig. 1, a carrier 10 is provided.

A redistribution layer 20 is disposed on one surface of the carrier 10, and the redistribution layer 20 is bonded to the carrier 10 through a peelable film 30. The redistribution layer 20 is provided with at least one conductive trace 21, and each conductive trace 21 includes at least one first connection pad 211 located on a surface of the redistribution layer 20 away from the peelable film 30, and at least one second connection pad 212 located on a surface of the redistribution layer 20 close to the peelable film 30. The first connection pad 211 is exposed on the surface of the redistribution layer 20 away from the peelable film 30, and the second connection pad 212 is exposed on the surface of the redistribution layer 20 adjacent to the peelable film 30.

The first connecting pad 211 is electrically connected to the second connecting pad 212. The conductive circuit 21 is made of a metal material with a high conductivity coefficient, such as copper, silver, gold, tungsten, or the like. In the present embodiment, the conductive traces 21 are made of copper.

The carrier plate 10 may be made of organic or inorganic materials, and may specifically be made of glass, polymethyl methacrylate, polyimide, silica gel, epoxy resin, or the like. In the present embodiment, the material of the carrier 10 is polyimide.

As shown in fig. 1, the number of the conductive traces 21 in the redistribution layer 20 is at least two. Every two adjacent conductive traces 21 are arranged at intervals.

In step S2, referring to fig. 2, a positioning sheet 40 is formed on the redistribution layer 20.

In the present embodiment, the material of the positioning piece 40 is polyimide.

In step S3, referring to fig. 3, at least one opening 41 is formed on the positioning plate 40.

The opening 41 penetrates through the positioning sheet 40 and corresponds to the first connection pad 211, so as to expose the first connection pad 211 to the outside. In this embodiment, the diameter of the opening 41 increases from the surface of the positioning piece 40 adjacent to the redistribution layer 20 to the surface of the positioning piece 40 away from the redistribution layer 20. In this embodiment, the diameter of the opening 41 adjacent to the redistribution layer 20 is equal to the width of the first connection pad 211. The longitudinal section of the opening 41 has a substantially inverted trapezoidal shape.

In this embodiment, the opening 41 is formed by exposure, development, or the like. In other embodiments, the opening 41 can be formed by laser punching and mechanical punching.

In step S4, referring to fig. 4, a chip 50 is mounted in each of the openings 41.

The chip 50 is electrically connected to the first connection pads 211, and the front surface of the chip 50 faces the first connection pads 211. In this embodiment, the surface of the chip 50 away from the redistribution layer 20 is flush with the surface of the positioning piece 40 away from the redistribution layer 20. Due to the shape of the opening 41 as described above, a gap 411 is formed between the portion of the chip 50 away from the redistribution layer 20 and the inner wall of the opening 41. That is, the chip 50 does not completely fill the opening 41.

In step S5, referring to fig. 5, a protection layer 60 is formed at least on the surface of the chip 50 and the side surface of the redistribution layer 20.

The protective layer 60 also covers the surface of the positioning sheet 40 away from the redistribution layer 20 and the side surface of the positioning sheet 40. In the present embodiment, the protective layer 60 is also filled in the gap 411. The width of the carrier board 10 may be greater than the width of the redistribution layer 20, so that part of the surface of the carrier board 10 is not covered by the redistribution layer 20. The protective layer 60 formed on the side surface of the redistribution layer 20 is located on the surface of the carrier board 10 not covered by the redistribution layer 20.

The protective layer 60 is used to protect the chip 50, the positioning sheet 40, and the redistribution layer 20. In the present embodiment, the protective layer 60 is formed by injection molding. The material of the protection layer 60 may be resin, such as polyethylene and polypropylene.

In step S6, please refer to fig. 6, the carrier 10 is removed.

In step S7, referring to fig. 7, when the redistribution layer 20 includes at least two conductive traces 21, the protection layer 60, the positioning sheet 40, the redistribution layer 20, and the peelable film 30 are cut along a gap between two adjacent conductive traces 21, so as to obtain the fan-out package structure 100.

After the protective layer 60, the positioning sheet 40, the redistribution layer 20, and the peelable film 30 are cut, at least two fan-out package structures 100 can be obtained. Wherein the conductive line 21 is not damaged during cutting.

In another embodiment, when only one conductive line 21 is provided in the redistribution layer 20, dicing is not required.

The fan-out package structure 100 is electrically connected to an external device (not shown) through the second connection pad 212, so as to realize signal transmission between the fan-out package structure 100 and the external device. Wherein the peelable film 30 is used to protect the second connection pad 212. Specifically, when the fan-out package structure 100 needs to perform signal transmission with an external device, the peelable film 30 needs to be removed first to expose the second connection pad 212, and the fan-out package structure 100 is electrically connected with the external device through the second connection pad 212, so that signal transmission between the fan-out package structure 100 and the external device is realized.

Referring to fig. 8, a second embodiment of the present invention provides a method for manufacturing a fan-out package structure, the second embodiment is different from the first embodiment in that: in step S4, after mounting the chip 50, the method further includes removing the positioning sheet 40 so that the protection layer 60 also covers the surface of the redistribution layer 20 adjacent to the chip 50 and the side surface of the chip 50.

Referring to fig. 7, a fan-out package structure 100 according to a third embodiment of the present invention includes a redistribution layer 20, a positioning sheet 40 formed on the redistribution layer 20, at least one chip 50, and a protection layer 60.

The redistribution layer 20 is provided with at least one conductive trace 21, and each conductive trace 21 includes at least one first connection pad 211 located on a surface of the redistribution layer 20 close to the positioning sheet 40, and at least one second connection pad 212 located on a surface of the redistribution layer 20 away from the positioning sheet 40. The first connection pads 211 are exposed on the surface of the redistribution layer 20 close to the positioning sheet 40, and the second connection pads 212 are exposed on the surface of the redistribution layer 20 far from the positioning sheet 40.

The first connecting pad 211 is electrically connected to the second connecting pad 212. The second connection pad 212 is connected to an external device (not shown) to realize signal transmission between the fan-out package structure 100 and the external device. The conductive circuit 21 is made of a metal material with a high conductivity coefficient, such as copper, silver, gold, tungsten, or the like. In the present embodiment, the conductive traces 21 are made of copper.

The surface of the redistribution layer 20 away from the chip 50 is adhered with a peelable film 30, and the peelable film 30 is used for protecting the second connection pad 212. Specifically, when the fan-out package structure 100 needs to perform signal transmission with an external device, the peelable film 30 needs to be removed first to expose the second connection pad 212, and the fan-out package structure 100 is electrically connected with the external device through the second connection pad 212, so that signal transmission between the fan-out package structure 100 and the external device is realized.

The positioning sheet 40 is provided with at least one opening 41, and the opening 41 penetrates through the positioning sheet 40 and corresponds to the first connection pad 211. In this embodiment, the diameter of the opening 41 increases from the surface of the positioning piece 40 adjacent to the redistribution layer 20 to the surface of the positioning piece 40 away from the redistribution layer 20. In this embodiment, the diameter of the opening 41 adjacent to the redistribution layer 20 is equal to the width of the first connection pad 211. The longitudinal section of the opening 41 has a substantially inverted trapezoidal shape. In the present embodiment, the material of the positioning piece 40 is polyimide.

Each of the chips 50 is mounted in one of the openings 41 and electrically connected to the first connection pad 211. The front surface of the chip 50 faces the first connection pads 211. In this embodiment, the surface of the chip 50 away from the redistribution layer 20 is flush with the surface of the positioning piece 40 away from the redistribution layer 20. Due to the shape of the opening 41 as described above, a gap 411 is formed between the portion of the chip 50 away from the redistribution layer 20 and the inner wall of the opening 41. That is, the chip 50 does not completely fill the opening 41.

The protective layer 60 covers at least the surface of the chip 50 away from the redistribution layer 20 and the side surface of the redistribution layer 20. In this embodiment, the protective layer 60 also covers the surface of the positioning piece 40 away from the redistribution layer 20 and the side surface of the positioning piece 40. In the present embodiment, the protective layer 60 is also filled in the gap 411. The width of the peelable film 30 may be greater than the width of the redistribution layer 20 so that the protective layer 60 covering the side surface of the redistribution layer 20 is located on the surface of the peelable film 30 beyond the redistribution layer 20. The protective layer 60 is used to protect the chip 50, the positioning sheet 40, and the redistribution layer 20. The material of the protection layer 60 may be resin, such as polyethylene and polypropylene.

Referring to fig. 8, a fan-out package structure 200 is provided in a fourth embodiment of the present invention, which is different from the third embodiment in that: the fan-out package structure 200 does not include the positioning sheet 40, wherein the protection layer 60 further covers the surface of the redistribution layer 20 adjacent to the chip 50 and the side surface of the chip 50.

According to the invention, the positioning sheet 40 is arranged on the redistribution layer 20, the opening 41 is formed in the positioning sheet 40, the chip 50 is arranged in the opening 41 to realize the positioning of the chip 50, the influence of the subsequent process on the position of the chip 50 is avoided, the deviation of the chip 50 is prevented, the alignment precision between the chip 50 and the first connection pad 211 is improved, and the quality of the fan-out type packaging structure is improved. The opening 41 is also arranged to be in an inverted trapezoid structure, which is beneficial to the installation of the chip 50, so that the production efficiency of the fan-out type packaging structure is improved, and meanwhile, different openings 41 can be used for the installation of different chips 50, so that the production efficiency of the fan-out type packaging structure is further improved.

The above description is only an optimized embodiment of the present invention, but the present invention is not limited to this embodiment in practical application. Other modifications and changes to the technical idea of the present invention should be made by those skilled in the art within the scope of the claims of the present invention.