阅读说明：本技术 转接板及其制作方法 (Adapter plate and manufacturing method thereof ) 是由 彭满芝 刘瑞武 何明展 于 2019-04-23 设计创作，主要内容包括：一种转接板(100)及其制作方法,包括：提供一模具,所述模具内设有多个第一固定板(210)与第二固定板(220),第一固定板(210)上设有多个第一固定孔(2101),第二固定板(220)上设有多个第二固定孔(2201)；提供多个导线(30),将多个导线(30)依次穿过多个第一固定板(210)与第二固定板(220)；成型腔内灌注非导电材料形成坯体(300)；沿第一固定板(210)及第二固定板(220)的两侧分别对坯体(300)进行切割以得到多个板体(10),板体(10)包括相对设置的第一表面(101)及第二表面(102)；在第一表面(101)形成多个第一连接垫(11),在第二表面(102)形成多个第二连接垫(12)。(An interposer (100) and method of making the same, comprising: providing a mould, wherein a plurality of first fixing plates (210) and second fixing plates (220) are arranged in the mould, a plurality of first fixing holes (2101) are formed in the first fixing plates (210), and a plurality of second fixing holes (2201) are formed in the second fixing plates (220); providing a plurality of leads (30), and sequentially passing the leads (30) through a plurality of first fixing plates (210) and second fixing plates (220); non-conductive materials are poured into the forming cavity to form a blank body (300); cutting the blank (300) along two sides of the first fixing plate (210) and the second fixing plate (220) respectively to obtain a plurality of plate bodies (10), wherein each plate body (10) comprises a first surface (101) and a second surface (102) which are arranged oppositely; a plurality of first connection pads (11) are formed on the first surface (101), and a plurality of second connection pads (12) are formed on the second surface (102).)

An adapter plate, its characterized in that: the adapter plate includes the plate body and locates a plurality of wires in the plate body, the plate body is including relative first surface and the second surface that sets up, the first surface is equipped with a plurality of first connecting pads, the second surface is equipped with a plurality of second connecting pads, each first connecting pad is through one the wire is connected one the second connecting pad is a plurality of first connecting pad has first span, and is a plurality of the second connecting pad has the second span, first span with the second span is not equal.

The interposer as recited in claim 1, wherein: the plurality of conducting wires are provided with a third span, and the third span is larger than the first span of the two first connecting pads connected with the conducting wires and smaller than the second span of the two second connecting pads connected with the conducting wires.

The interposer as recited in claim 2, wherein: the third span is smaller and smaller as the wire extends from the second connecting pad to the first connecting pad.

The interposer as recited in claim 1, wherein: the cross-sectional area of the wire is smaller than the cross-sectional areas of the first connecting pad and the second connecting pad.

The interposer as recited in claim 1, wherein: the area of the first surface is smaller than that of the second surface, and the projection of the first surface on the plane where the second surface is located is totally located inside the second surface.

The interposer as recited in claim 1, wherein: the plate body is made of one of polyether-ether-ketone, polytetrafluoroethylene, polyphenylene sulfone resin, liquid crystal high polymer, polyphenylene sulfide, meltable polytetrafluoroethylene and ceramic powder.

The interposer as recited in claim 1, wherein: the wire is made of one of copper, aluminum, silver, gold, copper alloy or aluminum alloy.

A manufacturing method of an adapter plate comprises the following steps:

providing a die, wherein a plurality of first fixing plates and a plurality of second fixing plates which are alternately arranged at intervals are arranged in the die, a plurality of first fixing holes are formed in the first fixing plates, and a plurality of second fixing holes are formed in the second fixing plates;

providing a plurality of leads, and sequentially penetrating the leads through the first fixing holes and the second fixing holes to form a plurality of first fixing plates and second fixing plates;

pouring a non-conductive material into the mold to form a blank;

cutting the blank along two sides of the first fixing plate and the second fixing plate respectively to obtain a plurality of plate bodies, wherein the plate bodies comprise a first surface and a second surface which are arranged oppositely;

and forming a plurality of first connecting pads on the first surface, forming a plurality of second connecting pads on the second surface, wherein each first connecting pad is connected with one second connecting pad through a wire.

The interposer manufacturing method of claim 8, wherein: the distance between the center lines of two adjacent first fixing holes is smaller than that between the center lines of two adjacent second fixing holes.

The interposer manufacturing method of claim 8, wherein: forming a plurality of first connecting pads on the first surface, and after the step of forming a plurality of second connecting pads on the second surface, the method further comprises the following steps: and cutting the board body along the first connecting pad and the second connecting pad on the outermost side.