阅读说明：本技术 一体式多层陶瓷封装管座 (Integrated multilayer ceramic packaging tube seat ) 是由 张志昇 于 2019-04-11 设计创作，主要内容包括：本发明公开了一个通讯设备上的一个重要零件——一体式多层陶瓷封装管座。它是一体式多层陶瓷线路及芯片安装基座；由于它在设备中的重要性,气密性需要满足＜1×10-9Pa·m3/s(He)需求；它具有体积小、耐高温、一致性、标准化等特点；采用插配式设计,组装效率高；可按需求(圆型/方型)定制,适合批量生产；适用于光通信、医疗、汽车和电子等行业领域。本发明采用上述技术方案后,避免了常规金属管座依靠标记点定位,组装效率低等不足；便于大批量生产,降低生产成本,提高了企业的经济效益和竞争力。(The invention discloses an important part on communication equipment, namely an integrated multilayer ceramic packaging tube seat. It is an integrated multilayer ceramic circuit and chip mounting base; because of its importance in the equipment, the airtightness needs to meet the requirements of < 1 × 10-9Pa · m3/s (He); it has the characteristics of small volume, high temperature resistance, consistency, standardization and the like; the assembly efficiency is high by adopting the insertion design; can be customized according to requirements (round/square), and is suitable for batch production; the method is suitable for the fields of optical communication, medical treatment, automobiles, electronics and the like. By adopting the technical scheme, the defects that a conventional metal pipe seat is positioned by means of the mark points, the assembly efficiency is low and the like are overcome; is convenient for mass production, reduces the production cost and improves the economic benefit and the competitiveness of enterprises.)

1. An important part on communication equipment-integral type multilayer ceramic packaging tube seat is characterized in that: it is an integrated multilayer ceramic circuit and chip mounting base. It meets the air tightness requirement of < 1 x 10 < -9 > Pa.m < 3 >/s (He); it has the characteristics of small volume, high temperature resistance, consistency, standardization and the like; the assembly efficiency is high by adopting the insertion design; can be customized according to requirements (round/square), and is suitable for batch production; the method is suitable for the fields of optical communication, medical treatment, automobiles, electronics and the like.

Technical Field

The invention relates to an important part in communication equipment, namely an integrated multilayer ceramic packaging tube seat.

Technical Field

The original pipe seat is a metal pipe seat, and is positioned by the mark points, so that the production and customer assembly efficiency is low; meanwhile, gold wires are required to be tied by a customer, so that the production progress and the product precision of customer assembly are influenced.

Disclosure of Invention

The invention aims to overcome the defects and shortcomings and provides a novel multilayer ceramic packaging tube seat.

In order to achieve the purpose, the invention adopts the following technical scheme:

1. an integrated multilayer ceramic circuit is adopted.

2. A plug-in chip mounting base is adopted.

3. The structure of the product is optimized, the volume is smaller, and the diameter of the product is reduced from phi 2.9mm to phi 1.3 mm.

After the scheme is adopted, the performance requirements of the integrated multilayer ceramic packaging tube seat are ensured, and the requirements of < 1 x 10 < -9 > Pa.m 3/s (He) are met if the air tightness is satisfied; the production efficiency and the assembly efficiency and precision of customers are improved; and the assembly space is saved for the client, and the development of new functions by the client is facilitated. The invention is suitable for mass production, reduces the production cost and improves the economic benefit and the competitiveness of enterprises.

Drawings

Fig. 1 is a schematic structural diagram of the present invention, wherein: 1-integrated multilayer and chip mounting base, 2-positioning bolt, 3-metallization layer, 4-internal circuit, 5-welding position, 6-metal lead 1, 7-metal lead 2.

FIG. 2 is a schematic view of a metal stem, wherein: 5-welding position, 6-metal lead 1, 7-metal lead 2, 8-marking point, 9-insulating glass and 10-metal tube shell.

Detailed description of the preferred embodiments

The technical solution of the present invention is further specifically described below by way of specific examples with reference to fig. 1.

Because the integrated multilayer ceramic circuit and the plug-in chip mounting base are adopted, the metal tube seat is prevented from being positioned by the mark points, and the production and customer assembly efficiency is low; meanwhile, gold wires are required to be tied by a customer, so that the production progress and the product precision of customer assembly are influenced. The performance of the integrated multilayer ceramic packaging tube seat is ensured, for example, the air tightness meets the requirement of < 1 multiplied by 10 < -9 > Pa.m 3/s (He); the production efficiency and the assembly efficiency and precision of customers are improved;

because the invention optimizes the product structure, the volume is smaller, and the diameter is reduced from phi 2.9mm to phi 1.3 mm. The assembly space of the product is saved for the client, and the development of new functions by the client is facilitated. The invention is suitable for mass production, reduces the production cost and improves the economic benefit and the competitiveness of enterprises.

The method is already applied to Shenzhen Shuangxun precision machinery Limited liability company, and the product completely meets the requirements of customers.

The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent structures or equivalent transformations made by the present specification and the attached drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.