阅读说明：本技术 电子封装结构及其制法 (Electronic package structure and method for fabricating the same ) 是由 谢沛蓉 许智勋 蔡芳霖 姜亦震 林长甫 于 2018-09-19 设计创作，主要内容包括：一种电子封装结构及其制法,于具有线路层的承载件上设置电子元件,且以包覆层包覆该电子元件,并于该包覆层上形成有外露该线路层的阶梯状开孔,以利于将导电元件卡接于该阶梯状开孔中。(An electronic package structure and its making method, setting electronic element on the bearing part with circuit layer, using the coating layer to coat the electronic element, and forming a ladder-shaped opening on the coating layer to expose the circuit layer, so as to be beneficial to clamping the conductive element in the ladder-shaped opening.)

1. An electronic package structure, comprising:

a carrier having a circuit layer;

at least one electronic element, which is connected on the bearing piece and is electrically connected with the circuit layer;

a covering layer formed on the bearing piece to cover the electronic element, wherein the covering layer is provided with a plurality of step-shaped openings so that part of the circuit layer is exposed out of the step-shaped openings; and

and a plurality of conductive elements arranged in the plurality of stepped openings to be combined on the circuit layer.

2. The electronic package structure of claim 1, wherein the carrier has a first side and a second side opposite to each other, and the electronic component is disposed on the first side and the second side, respectively.

3. The electronic package structure of claim 1, wherein the stepped opening is formed by sequentially forming a plurality of recesses with decreasing widths from the outer side to the inner side of the cover layer.

4. The electronic package structure of claim 1, wherein the carrier has a first side and a second side opposite to each other, and the cover layer is disposed over the first side and the second side, respectively.

5. A method for fabricating an electronic package structure, comprising:

providing an electronic component, which comprises a bearing piece with a circuit layer, at least one electronic element which is connected on the bearing piece and is electrically connected with the circuit layer, and a coating layer which is formed on the bearing piece and is used for coating the electronic element;

forming a plurality of step-shaped openings on the coating layer so that part of the circuit layer is exposed out of the step-shaped openings; and

and forming a plurality of conductive elements in the plurality of stepped openings so that the conductive elements are combined on the circuit layer.

6. The method of claim 5, wherein the carrier has a first side and a second side opposite to each other, and the electronic component is disposed on the first side and the second side, respectively.

7. The method of claim 5, wherein the step-shaped opening is formed by sequentially forming a plurality of recesses with decreasing widths from the outer side to the inner side of the covering layer.

8. The method of claim 5, wherein the step-like opening process comprises:

forming a first recess on the cladding layer; and

and forming a second concave part on the bottom surface of the first concave part, wherein the width of the second concave part is smaller than that of the first concave part, so that the first concave part and the second concave part form the stepped opening, and part of the circuit layer is exposed out of the second concave part.

9. The method of claim 8, wherein the first recess is formed by firing the cladding layer with a high intensity laser, and the second recess is formed by firing the cladding layer with a low intensity laser.

10. The method of claim 5, wherein the carrier has a first side and a second side opposite to each other, and the cover layer is disposed on the first side and the second side, respectively.

Technical Field

The present invention relates to semiconductor structures, and more particularly, to an electronic package structure and a method for fabricating the same.

Background

With the rapid development of portable electronic products in recent years, the development of various related products is also oriented to high density, high performance, and light, thin, short and small trends, and various semiconductor package structures are also developed to meet the requirements of light, thin, short and high density.

Fig. 1 is a schematic cross-sectional view of a conventional semiconductor package 1. As shown in fig. 1, the semiconductor package structure 1 is provided with a semiconductor device 11 and a passive device 11 'on the upper and lower sides of a substrate 10, and an encapsulant 14 encapsulates the semiconductor device 11 and the passive device 11', and exposes a contact (I/O)100 of the substrate 10 to an opening 140 of the encapsulant 14, and then a plurality of solder balls 13 are formed on the contact 100, so that in the subsequent process, the semiconductor package structure 1 is mounted on an electronic device (not shown) such as a circuit board or another circuit board through the solder balls 13.

However, in the semiconductor package structure 1, since the opening 140 of the encapsulant 14 penetrates through the encapsulant 14 by laser ablation, the adhesive debris in the opening 140 cannot be effectively removed, so that the solder ball 13 is bonded with the residual adhesive debris, and the solder ball 13 cannot be effectively bonded to the contact 100 or the solder ball 13 is deformed by the extrusion of the adhesive debris, thereby easily causing ball dropping (separation of the solder ball 13 from the contact 100), and further causing an excessively low yield of the overall ball implantation.

In addition, the laser burning method needs to be performed at the same position to repeatedly shoot the laser with the same intensity to form the opening 140 with the required depth, but due to the thermal effect, the width of the opening 140 is not easy to control, and thus the opening is easily changed into the opening 140 with a wide top and a narrow bottom or a cone shape, so the solder ball 13 cannot be effectively clamped in the opening 140, the ball drop (the solder ball 13 is separated from the contact 100) occurs, and the ball drop is caused by the low yield of the whole ball planting.

Therefore, how to overcome the above problems of the prior art has become an issue to be solved.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, the present invention provides an electronic package structure and a method for fabricating the same, so as to avoid ball dropping.

The electronic packaging structure of the invention comprises: a carrier having a circuit layer; at least one electronic element arranged on the bearing piece and electrically connected with the circuit layer; a covering layer formed on the bearing piece to cover the electronic element, wherein the covering layer is provided with a plurality of step-shaped openings so that part of the circuit layer is exposed out of the step-shaped openings; and a plurality of conductive elements arranged in the plurality of stepped openings to be combined on the circuit layer.

The invention also provides a manufacturing method of the electronic packaging structure, which comprises the following steps: providing an electronic component, which comprises a bearing piece with a circuit layer, at least one electronic element which is connected on the bearing piece and is electrically connected with the circuit layer, and a coating layer which is formed on the bearing piece and is used for coating the electronic element; forming a plurality of step-shaped openings on the coating layer so that part of the circuit layer is exposed out of the step-shaped openings; and forming a plurality of conductive elements in the plurality of stepped openings so that the plurality of conductive elements are combined on the circuit layer.

In the aforementioned manufacturing method, the step-shaped opening process includes: forming a first recess on the cladding layer; and forming a second concave part on the bottom surface of the first concave part, wherein the width of the second concave part is smaller than that of the first concave part, so that the first concave part and the second concave part are used as the stepped open holes, and part of the circuit layer is exposed out of the second concave part.

In the above method, the first recess is formed by burning the cladding layer with a high intensity laser, and the second recess is formed by burning the cladding layer with a low intensity laser.

In the electronic package structure and the method for manufacturing the same, the carrier has a first side and a second side opposite to each other, and the electronic element is disposed on the first side and the second side, respectively.

In the electronic package structure and the method for fabricating the same, the conductive element is a solder ball, a copper core ball, a passive element or a metal element.

In the electronic package structure and the method for manufacturing the same, the carrier has a first side and a second side opposite to each other, and the cover layer is disposed on the first side and the second side, respectively.

In the electronic package structure and the method for manufacturing the same, the stepped opening is formed on the encapsulation layer above at least one of the first side and the second side.

Therefore, compared with the prior art, the electronic packaging structure and the manufacturing method thereof can effectively remove the residual adhesive dust in the previous laser process through the subsequent laser process with low strength, so that the conductive element can not be combined with the residual adhesive dust, the conductive element can be effectively contacted and combined with the circuit layer, and the conductive element cannot be extruded by the adhesive dust to deform, thereby avoiding the occurrence of ball dropping.

In addition, the invention carries out a plurality of laser processes on the same preset joint of the coating layer by lasers with different intensities to form the step-shaped opening, so that repeated shooting by high-intensity lasers is not needed, compared with the prior art, the invention can avoid the problem of heat effect, the width of the step-shaped opening is easy to control, and the conductive element can be effectively clamped in the step-shaped opening to avoid the condition of ball falling.

Drawings

Fig. 1 is a schematic cross-sectional view of a conventional semiconductor package structure.

Fig. 2A to 2C are schematic cross-sectional views illustrating a method for fabricating an electronic package structure according to the present invention.

Description of the symbols

1 semiconductor package structure 10 substrate

100 contact 11 semiconductor element

11' passive component 13 solder ball

14 opening of the encapsulant 140

2 electronic packaging Structure 2a electronic component

20a first side of a carrier 20a

20b second side 200 line layer

21 first electronic component 21a

21b non-active surface 210 electrode pad

22 conductive bumps 21', 21 ″

23 conductive elements 24a,24b cladding

240 stepped bore 241 first recess

242 second recess R width.

Detailed Description

The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for understanding and reading the contents disclosed in the specification, and are not used for limiting the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, ratio relationship changes or size adjustments should still fall within the scope of the technical contents disclosed in the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "first", "second", and "a" as used in the present specification are for clarity of description only, and are not intended to limit the scope of the present invention, and changes or modifications in the relative relationship may be made without substantial technical changes.

Fig. 2A to fig. 2C are schematic cross-sectional views illustrating a manufacturing method of the electronic package structure 2 according to the present invention.

As shown in fig. 2A, an electronic assembly 2A is provided, which includes a carrier 20, a first electronic component 21 and a second electronic component 21 '21 ″ disposed on the carrier 20, and cladding layers 24a and 24b formed on the carrier 20 to clad the first electronic component 21 and the second electronic component 21' 21 ″. Next, a plurality of first recesses 241 are formed in the clad layer 24 a.

The carrier 20 has a first side 20a and a second side 20b opposite to each other. In the present embodiment, the carrier 20 is a circuit structure, such as a package substrate (substrate) having a core layer and a circuit structure or a coreless layer (core), and has a plurality of circuit layers 200, such as fan-out (fan out) redistribution layer (RDL). It should be understood that the carrier 20 may also be other carrier units for carrying electronic devices such as chips, for example, lead frame (leadframe), but is not limited thereto.

The first electronic component 21 is disposed on the first side 20a of the carrier 20. In the present embodiment, the first electronic component 21 is an active component, such as a semiconductor chip, a passive component, such as a resistor, a capacitor, or an inductor, or a combination thereof. For example, the first electronic component 21 has an active surface 21a and an inactive surface 21b opposite to each other, and the active surface 21a has a plurality of electrode pads 210, so that the electrode pads 210 are electrically connected to the circuit layer 200 in a flip-chip manner through a plurality of conductive bumps 22 such as solder material; alternatively, the first electronic component 21 can be electrically connected to the circuit layer 200 by wire bonding through a plurality of bonding wires (not shown). However, the manner of electrically connecting the first electronic component 21 to the carrier 20 is not limited to the above.

The second electronic component 21', 21 "is arranged on the second side 20b of the carrier 20. In the present embodiment, the second electronic component 21 ', 21 ″ is an active component (e.g., 21'), a passive component (e.g., 21 "), or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, or an inductor. For example, the second electronic component 21' is disposed on the circuit layer 200 in a flip-chip manner; alternatively, the second electronic element 21' can be electrically connected to the circuit layer 200 by wire bonding through a plurality of bonding wires (not shown). Alternatively, the second electronic component 21 ″ may directly contact the circuit layer 200. However, the manner of electrically connecting the second electronic components 21', 21 ″ to the carrier 20 is not limited to the above.

It should be understood that electronic components can be disposed on at least one of the first side 20a and the second side 20b as required, for example, electronic components can be disposed on only the first side 20a or the second side 20 b.

The coating layers 24a and 24b are made of Polyimide (PI), dry film (dryfilm), epoxy resin (epoxy), or molding compound (molding compound). It should be understood that the materials of the cladding layers 24a,24b on the first side 20a and the second side 20b may be the same or different.

It should be understood that the cladding layers 24a,24b may be formed on at least one of the first side 20a and the second side 20b as required, so that the cladding layers 24a,24b clad the electronic device on at least one of the first side 20a and the second side 20b, for example, a cladding layer is formed only on one side of the first side 20a or the second side 20b where the electronic device is disposed.

In addition, the first concave portion 241 is formed by burning the cladding layer 24a with a high intensity laser to reduce the amount of the adhesive debris, and the width R of the first concave portion 241 is easily controlled without repeated shots corresponding to the predetermined contact positions.

As shown in fig. 2B, a second recess 242 is formed on the bottom surface of the first recess 241 to penetrate through the cladding layer 24a, such that the first recess 241 and the second recess 242 form a step-shaped opening 240, and a portion of the circuit layer 200 is exposed to the second recess 242 (or the step-shaped opening 240).

In the present embodiment, the second recess 242 is formed by burning the cladding layer 24a with a low intensity laser, so as to facilitate the removal of the adhesive debris, and has a small thermal effect, and can prevent the circuit layer 200 from being damaged.

In addition, multi-level stepped openings may be formed. For example, recesses with reduced width are sequentially formed from the outer side to the inner side of the cladding layer 24a, and the laser intensity of the subsequent laser process is smaller than that of the previous laser process, i.e., the laser intensity is sequentially decreased.

It should be understood that the stepped opening 240 may be formed in the cladding layers 24a,24b above at least one of the first side 20a and the second side 20b, as desired, for example, the cladding layer 24b on the second side 20b may also form the stepped opening 240.

As shown in fig. 2C, a conductive element 23 is formed in the stepped opening 240, so that the conductive element 23 is bonded on the circuit layer 200.

In the present embodiment, the conductive element 23 is a solder ball (solder ball), a copper core ball (Cu core ball), a passive element such as a resistor, a capacitor, and an inductor, or a metal element (such as a pillar, a block, or a needle), but is not limited thereto.

In the manufacturing method of the present invention, the stepped opening 240 is formed by penetrating the cladding layer 24a through a plurality of laser processes with different laser intensities, so compared with the known technology, the present invention can effectively remove the residual adhesive debris from the previous laser process through the subsequent laser process with low intensity, so that the conductive element 23 is not bonded with the residual adhesive debris, and therefore, the conductive element 23 can be effectively bonded with the circuit layer 200 in a contact manner, and the conductive element 23 is not deformed by the extrusion of the adhesive debris, so as to avoid the occurrence of ball dropping (the conductive element 23 is separated from the circuit layer 200).

In the manufacturing method of the present invention, the stepped opening 240 is formed by performing a plurality of laser processes with different intensities on the same predetermined contact point of the cladding layer 24a, so that repeated laser shots with high intensity are not required, thereby avoiding the problem of thermal effect, enabling the width R of the stepped opening 240 to be easily controlled, and the conductive element 23 to be effectively clamped in the stepped opening 240, thereby avoiding the occurrence of ball dropping (the conductive element 23 is separated from the circuit layer 200).

The present invention also provides an electronic package structure 2, which includes: a carrier 20, a first electronic component 21, a second electronic component 21', 21 ", a plurality of conductive elements 23, and cladding layers 24a,24 b.

The carrier 20 has a first side 20a and a second side 20b opposite to each other, and the carrier 20 is configured with a circuit layer 200.

The first electronic component 21 is disposed on the first side 20a of the carrier 20 and electrically connected to the circuit layer 200.

The second electronic components 21', 21 ″ are disposed on the second side 20b of the carrier 20 and electrically connected to the circuit layer 200.

The cladding layers 24a and 24b are formed on the carrier 20 to clad the first electronic element 21 and the second electronic elements 21', 21 ″, wherein the cladding layer 24a is formed with a plurality of stepped openings 240, so that a portion of the circuit layer 200 is exposed to the stepped openings 240.

The conductive element 23 is disposed in the stepped opening 240 to be bonded to the circuit layer 200.

In one embodiment, the conductive elements 23 are solder balls, copper core balls, passive elements or metal elements.

In summary, the electronic package structure and the method for fabricating the same according to the present invention form the step-shaped opening by penetrating the coating layer through the laser process with different laser intensities for a plurality of times, so that the present invention can effectively remove the residual adhesive debris from the laser process, and the conductive element can effectively contact and bond with the circuit layer, and the conductive element can be effectively clamped in the step-shaped opening to avoid the occurrence of ball dropping, thereby improving the yield of the overall ball mounting.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.