阅读说明：本技术 电子封装件及其制法 (Electronic package and manufacturing method thereof ) 是由 曾盈彰 许元鸿 林长甫 于 2018-09-28 设计创作，主要内容包括：一种电子封装件及其制法,包括将一边缘设有止挡部的天线板堆叠于线路板上,并于该天线板与线路板之间形成固接该天线板与线路板的支撑体,以于形成该支撑体的过程中,经由该止挡部止挡该支撑体的胶材流动,避免该支撑体的胶材溢流至该天线板的天线结构上,确保该天线板的天线功能正常。(An electronic package and its manufacturing method, including stacking the antenna board with a stopping part on one edge on the circuit board, and forming a support body fixedly connected with the antenna board and the circuit board between the antenna board and the circuit board, so that in the process of forming the support body, the stopping part stops the flow of the rubber material of the support body, the rubber material of the support body is prevented from overflowing to the antenna structure of the antenna board, and the normal function of the antenna board is ensured.)

1. An electronic package, comprising:

a first substrate having an antenna structure and at least one stop portion disposed at an edge of the first substrate;

a second substrate having a circuit layer, wherein the first substrate is stacked on the second substrate via a plurality of conductive elements; and

at least one supporting body which is formed between the first substrate and the second substrate and extends to contact the stopping part, so that the supporting body is fixedly connected with the first substrate and the second substrate, and the supporting body is not electrically connected with the first substrate and the second substrate.

2. The electronic package according to claim 1, wherein the first substrate defines a first surface, a second surface and a side surface adjacent to the first surface and the second surface, and the side surface of the first substrate has at least one notch connecting the first surface and the second surface, and the wall surface of the notch is stepped to serve as the stopper.

3. The electronic package according to claim 1, wherein the first substrate defines a first surface, a second surface and a side surface adjacent to the first surface and the second surface, and the side surface of the first substrate defines at least one notch connecting the first surface and the second surface, and the supporting body is clamped in the notch.

4. The electronic package according to claim 1, wherein the surface of the first substrate is an insulating protective layer, and the insulating protective layer is stepped to serve as the stopper.

5. The electronic package according to claim 1, wherein a surface of the first substrate is provided with a bump as the stopper.

6. The electronic package of claim 1, wherein the support protrudes beyond the side of the first substrate.

7. The electronic package of claim 1, wherein the support is a thermosetting adhesive.

8. The electronic package of claim 1, further comprising an electronic component disposed on the second substrate.

9. The electronic package according to claim 8, wherein the second substrate has a first side and a second side opposite to each other, the first substrate is stacked on the first side of the second substrate, and the electronic component is disposed on the second side of the second substrate.

10. The electronic package of claim 1, wherein the second substrate further has an antenna portion that senses the antenna structure.

11. The electronic package of claim 1, wherein the first substrate has a width less than a width of the second substrate.

12. A method of fabricating an electronic package, the method comprising:

providing a first substrate with an antenna structure, and forming at least one stopping part on the edge of the first substrate;

stacking the first substrate on a second substrate with a circuit layer through a plurality of conductive elements; and

at least one support body is formed between the first substrate and the second substrate and extends to contact the stopping part, so that the support body is fixedly connected with the first substrate and the second substrate, and the support body is not electrically connected with the first substrate and the second substrate.

13. The method of claim 12, wherein the first substrate defines a first surface, a second surface and a side surface adjacent to the first surface and the second surface, and the side surface of the first substrate has at least one notch connecting the first surface and the second surface, and the wall surface of the notch is stepped to serve as the stop portion.

14. The method of claim 12, wherein the first substrate defines a first surface, a second surface and a side surface adjacent to the first surface and the second surface, and the side surface of the first substrate defines at least one notch connecting the first surface and the second surface, and the supporting member is clamped in the notch.

15. The method of claim 12, wherein the surface of the first substrate is an insulating protective layer, and the insulating protective layer is stepped to serve as the stopper.

16. The method of claim 12, wherein a bump is formed on the surface of the first substrate to serve as the protrusion of the stopper.

17. The method of claim 12, wherein the support protrudes from a side of the first substrate.

18. The method of claim 12, wherein the step of forming the support comprises forming a glue material between the first substrate and the second substrate to contact the first substrate and the second substrate, and curing the glue material to form the support.

19. The method of claim 12, further comprising disposing an electronic component on the second substrate.

20. The method of claim 19, wherein the second substrate has a first side and a second side opposite to each other, the first substrate is stacked on the first side of the second substrate, and the electronic component is disposed on the second side of the second substrate.

21. The method of claim 12, wherein the second substrate further comprises an antenna portion for sensing the antenna structure.

22. The method of claim 12, wherein the first substrate has a width smaller than a width of the second substrate.

Technical Field

The present invention relates to an electronic package, and more particularly, to an electronic package with an antenna structure.

Background

Currently, wireless communication technology has been widely applied to various consumer electronics products to facilitate receiving or transmitting various wireless signals, and in order to meet the design requirements of the consumer electronics products, the manufacturing and design of wireless communication modules are developed towards light, thin, short and small, wherein a planar Antenna (Patch Antenna) is widely applied to wireless communication modules of electronic products such as mobile phones (cell phones) due to its characteristics of small volume, light weight, easy manufacturing, and the like.

Fig. 1 is a schematic cross-sectional view of a conventional wireless communication module 1. The wireless communication module 1 is formed by stacking a substrate 12 having an antenna (not shown) on an upper side of a circuit board 10 having a semiconductor chip 11 on a lower side thereof via a plurality of solder bumps 18, wherein the circuit board 10 has a ground pad (not shown) and an antenna feedback circuit (not shown), and a plurality of solder balls 19 are formed below the circuit board 10, wherein a space a (i.e., a region surrounded by the solder bumps 18, in which no adhesive or molding filler is present) needs to be defined in a specific region between the circuit board 10 and the substrate 12, and a distance L between the circuit board 10 and the substrate 12 needs to be controlled to ensure quality of a transmission signal between the substrate 12 and the semiconductor chip 11.

However, in the conventional wireless communication module 1, after the circuit board 10 and the substrate 12 are stacked, the entire structure is turned over (the top and bottom of fig. 1 can be turned upside down) to reflow the solder balls 19, and at this time, the solder bumps 18 are in a molten state, so that the substrate 12 is lowered due to gravity, and the solder bumps 18 are stretched, so that the distance L between the circuit board 10 and the substrate 12 is increased, thereby affecting the antenna function of the substrate 12, and further reducing the yield of the product.

Therefore, how to overcome the above-mentioned problems of the prior art has become an issue to be solved.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, the present invention provides an electronic package and a method for fabricating the same, which can ensure the antenna of an antenna board to function properly.

The electronic package of the present invention includes: the first substrate is provided with an antenna structure and at least one stopping part arranged on the edge of the first substrate; a second substrate having a circuit layer, wherein the first substrate is stacked on the second substrate via a plurality of conductive elements; and at least one supporting body which is formed between the first substrate and the second substrate and extends to contact the stopping part, so that the supporting body is fixedly connected with the first substrate and the second substrate, and the supporting body is not electrically connected with the first substrate and the second substrate.

The invention also provides a manufacturing method of the electronic packaging piece, which comprises the following steps: providing a first substrate with an antenna structure, and forming at least one stopping part on the edge of the first substrate; stacking the first substrate on a second substrate with a circuit layer through a plurality of conductive elements; and forming at least one support body between the first substrate and the second substrate and extending to contact the stopping portion, so that the support body is fixedly connected with the first substrate and the second substrate, and the support body is not electrically connected with the first substrate and the second substrate.

In an embodiment of the present invention, the first substrate defines a first surface, a second surface and a side surface adjacent to the first surface and the second surface, and the side surface of the first substrate forms at least one notch communicating the first surface and the second surface, and a wall surface of the notch is stepped to serve as the stop portion.

In an embodiment of the electronic package and the method for manufacturing the same, the first substrate defines a first surface, a second surface and a side surface adjacent to the first surface and the second surface, and the side surface of the first substrate forms at least one notch communicating the first surface and the second surface, and the supporting body is clamped in the notch.

In an embodiment of the present invention, the surface of the first substrate is an insulating protective layer, and the insulating protective layer is in a step shape and serves as the stop portion.

In the electronic package and the method for manufacturing the same, a bump is formed on a surface of the first substrate to serve as the stopper.

In the electronic package and the method for manufacturing the same, the support protrudes out of the side surface of the first substrate.

In the foregoing electronic package and the method for fabricating the same, the supporting body is formed by forming a glue material between the first substrate and the second substrate to contact the first substrate and the second substrate, and then curing the glue material to form the supporting body. For example, the support is a thermosetting adhesive material.

The electronic package and the method for manufacturing the same further include disposing an electronic component on the second substrate.

In an embodiment, the second substrate has a first side and a second side opposite to the first side, the first substrate is stacked on the first side of the second substrate, and the electronic component is disposed on the second side of the second substrate.

In the electronic package and the method for manufacturing the same, the second substrate further has an antenna portion for sensing the antenna structure.

In the electronic package and the method for manufacturing the same, the width of the first substrate is smaller than the width of the second substrate.

As can be seen from the above, in the electronic package and the manufacturing method thereof of the present invention, the first substrate and the second substrate are connected by the support, so that the distance between the first substrate and the second substrate is kept unchanged, and the first substrate does not stretch the conductive elements due to gravity reduction during the packaging process (such as performing a reflow process).

In addition, the design of the stopping portion enables the stopping portion to be closer to the side surface of the first substrate than the antenna structure, so that when the supporting body is formed, the supporting body can extend to contact the stopping portion and be concentrated outside the stopping portion, the supporting body is prevented from overflowing to the antenna structure and being not remained on the antenna structure, and the normal function of the antenna structure of the first substrate can be ensured.

Drawings

Fig. 1 is a schematic cross-sectional view of a conventional wireless communication module.

Fig. 2A to 2C are schematic cross-sectional views illustrating a method for manufacturing an electronic package according to the present invention.

Fig. 2A' is a schematic top view of the first substrate of fig. 2A.

Fig. 3A to 3C are partially enlarged views of different embodiments of fig. 2A.

Description of the symbols

1 Wireless communication module 10 circuit board

11 semiconductor chip 12 substrate

18 solder bumps 19,29 solder balls

2 electronic package 20 electronic component

200 conductive bump 21 first substrate

21a first surface 21b a second surface

21c side 210 notch

211 antenna structure 212 electrical contact

213 insulating protective layer 22 second substrate

22a first side 22b a second side

220 circuit layer 221 antenna part

222 ground layer 223 antenna feedback circuit

23,33,43 stop 24 support

28 open area of conductive element A

D, R width H, L distance.

Detailed Description

The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for understanding and reading the contents disclosed in the specification, and are not used for limiting the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, ratio relationship changes or size adjustments should still fall within the scope of the technical contents disclosed in the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "first", "second", and "a" as used in the present specification are for clarity of description only, and are not intended to limit the scope of the present invention, and changes or modifications in the relative relationship therebetween may be regarded as the scope of the present invention without substantial changes in the technical contents.

Fig. 2A to 2C are schematic cross-sectional views illustrating a manufacturing method of an electronic package 2 according to the present invention, and fig. 2A is a cross-sectional view taken along line a-a of fig. 2A'.

As shown in fig. 2A, a first substrate 21 is provided, which has a first surface 21a and a second surface 21b opposite to each other, and a side surface 21c adjacent to the first and second surfaces 21a,21b, and a plurality of stopping portions 23 are formed at an edge of the first substrate 21.

In this embodiment, the first substrate 21 is an antenna board having at least one antenna structure 211 disposed on the first surface 21a and a plurality of electrical contacts 212 disposed on the second surface 21b, and the antenna structure 211 is a circuit-type antenna electrically isolated from the electrical contacts 212. It should be understood that the first substrate 21 can be other types of antenna boards, and is not limited to the above.

In addition, the side surface 21c of the first substrate 21 has at least one notch 210 communicating the first and second surfaces 21a,21b, such as a semicircular hole shown in fig. 2A', and the wall surface of the notch 210 is stepped to serve as the stopping portion 23 (see fig. 3A for details). For example, a large hole not connected to the second surface 21b is formed on the first surface 21a of the first substrate 21 along the side surface 21c, and a small hole connected to the second surface 21b is formed on the bottom surface of the large hole, so that the large hole and the small hole are used as the notch 210, and the stepped wall surface thereof is used as the stopping portion 23. It should be understood that multiple levels of stepped walls can be formed as desired, i.e., holes of decreasing width can be formed in sequence.

Alternatively, as shown in fig. 3B, the insulating protective layer 213 constituting the first surface 21a of the first substrate 21 may be formed with a stepped edge to serve as the stopper 33. It should be understood that the edges of the insulating protection layer 213 may be formed in multiple levels as desired.

As shown in fig. 3C, a dam (dam) may be formed on the first surface 21a of the first substrate 21 as a stopping portion 43, and the stopping portion 43 is, for example, a metal bump or an insulating bump, which protrudes from the first surface 21a of the first substrate 21.

It should be understood that the aspects related to the notch 210 and the stopping portions 23,33,43 can be designed as required, and are not limited to the above.

As shown in fig. 2B, the first substrate 21 is stacked on a second substrate 22 through a plurality of conductive elements 28 by a second surface 21B thereof, wherein a width D of the first substrate 21 is smaller than a width R of the second substrate 22, and a specific area between the first substrate 21 and the second substrate 22 is defined as an open area (i.e., an area surrounded by the conductive elements 28, which is not filled with a dispensing or molding material).

In the embodiment, the second substrate 22 is a circuit board, which defines a first side 22a and a second side 22b opposite to each other, and the first substrate 21 is stacked on the first side 22a of the second substrate 22 through the conductive elements 28. For example, the second substrate 22 has a circuit layer 220, an antenna portion 221, a ground layer 222, and an antenna feedback circuit (antenna feedback lines) 223. Specifically, the antenna portion 221 is a circuit type antenna, which is electrically connected to the ground layer 222 through the antenna feedback line 223, but the antenna portion 221 is electrically isolated from the circuit layer 220, wherein the antenna structure 211 of the first substrate 21 can sense the antenna portion 221 of the second substrate 22 to transmit signals therebetween.

In addition, the conductive element 28 is bonded between the electrical contact 212 of the first substrate 21 and the circuit layer 220 on the first side 22a of the second substrate 22 to electrically connect the first substrate 21 and the second substrate 22. The conductive element 28 is not particularly limited, and may be, for example, a copper pillar, a solder material, or other structures.

Moreover, the conductive elements 28 do not electrically connect the antenna structure 211 and the antenna portion 221, and a portion of the conductive elements 28 may be electrically connected to the ground layer 222 or dummy pads (dummy pads), i.e., the electrical contacts 212 or the contacts of the circuit layer 220 may be dummy pads without electrical function.

In addition, at least one electronic component 20 may be disposed on the second side 22b of the second substrate 22. Specifically, the electronic component 20 is an active component, such as a semiconductor chip, a passive component, such as a resistor, a capacitor, and an inductor, or a combination thereof. For example, the electronic component 20 is electrically connected to the circuit layer 220 in a flip-chip manner through a plurality of conductive bumps 200 such as solder material; alternatively, the electronic device 20 can be electrically connected to the circuit layer 220 by wire bonding via a plurality of bonding wires (not shown); alternatively, the electronic device 20 may directly contact the circuit layer 220 to electrically connect to the circuit layer 220. However, the manner of electrically connecting the electronic component 20 to the second substrate 22 is not limited to the above. It should be understood that the electronic component 20 is not disposed between the first substrate 21 and the second substrate 22, but the configuration of the electronic component 20 is various (e.g., disposed on the first side 22a of the second substrate 22), and is not limited to the above.

As shown in fig. 2C, a supporting member 24 is formed between the second surface 21b of the first substrate 21 and the first side 22a of the second substrate 22 through the notch 210, so that the supporting member 24 is fixedly connected to the first substrate 21 and the second substrate 22, and the supporting member 24 is not electrically connected to the first and second substrates 21, 22.

In the present embodiment, the supporting body 24 is an insulating material such as a glue pillar, and the supporting body 24 is exposed to the notch 210 or the first surface 21a of the first substrate 21. For example, in the manufacturing process of the supporting body 24, a dispensing needle is used to inject a thermosetting adhesive material between the first substrate 21 and the second substrate 22 through the gap 210 to contact the first surface 21a of the first substrate 21 and the first side 22a of the second substrate 22 (or to contact the wall surface of the gap 210 or the stopping portion 23), and then the thermosetting adhesive material is cured by heating to serve as the supporting body 24.

In addition, when the notch 210 is semicircular as shown in fig. 3A, a larger dispensing needle can be used to form the support body 24, thereby reducing the cost.

Also, the supporting body 24 may protrude from the side 21c of the first substrate 21 or not protrude from the side 21c of the first substrate 21 (only in the notch 210).

In addition, a plurality of solder balls 29 may be formed on the circuit layer 220 on the second side 22b of the second substrate 22, and the solder balls 29 are reflowed to mount an electronic device (not shown) such as a circuit board or another circuit board.

The manufacturing method of the present invention mainly connects the first substrate 21 and the second substrate 22 through the supporting body 24, so that the distance H between the first substrate 21 and the second substrate 22 is kept constant, and when reflowing the solder balls 29 or performing a subsequent high-temperature baking process, the first substrate 21 will not stretch the conductive elements 28 in the molten state due to gravity drop, so compared with the prior art, the electronic package 2 of the present invention will not affect the functions of the antenna structure 211 and the antenna portion 221 due to the increase of the distance H between the first substrate 21 and the second substrate 22, thereby effectively controlling the antenna quality and further improving the product yield.

In addition, the design of the stopping portions 23,33,43 enables the stopping portions 23,33,43 to be closer to the side surface 21c of the first substrate 21 than the antenna structure 211, so that when the supporting body 24 is formed, the supporting body 24 extends to contact the stopping portions 23,33,43 and is concentrated outside the stopping portions 23,33,43, so as to prevent the supporting body 24 from overflowing inwards onto the antenna structure 211 without remaining on the antenna structure 211, thereby ensuring the normal function of the antenna structure 211 of the first substrate 21 and further improving the product yield.

Moreover, through the design of the notch 210, when the supporting body 24 is formed, the supporting body 24 is formed in the notch 210 to strengthen the combination between the supporting body 24 and the first substrate 21, thereby being beneficial to clamping and fixing the supporting body 24 and avoiding the supporting body 24 from being separated from the first substrate 21.

The present invention also provides an electronic package 2 comprising: a first substrate 21, a second substrate 22 and at least one support 24.

The first substrate 21 has an antenna structure 211 and a stop portion 23 disposed at an edge of the first substrate 21.

The second substrate 22 has a circuit layer 220, and the first substrate 21 is stacked on the second substrate 22 via a plurality of conductive elements 28.

The supporting body 24 is formed between the first substrate 21 and the second substrate 22 and extends to contact the stopping portion 23, so that the supporting body 24 is fixedly connected to the first substrate 21 and the second substrate 22, and the supporting body 24 is not electrically connected to the first substrate 21 and the second substrate 22.

In one embodiment, the first substrate 21 defines a first surface 21a, a second surface 21b and a side surface 21c adjacent to the first and second surfaces 21a,21b, and the side surface 21c of the first substrate 21 has at least one notch 210 communicating the first surface 21a and the second surface 21b, and the wall surface of the notch 210 is stepped to be a stop portion 23, and the support body 24 is clamped in the notch 210.

In one embodiment, the surface of the first surface 21a of the first substrate 21 is an insulating protection layer 213, and a side edge of the insulating protection layer 213 is stepped to serve as the stopper 33.

In one embodiment, a protruding bump is formed on the first surface 21a of the first substrate 21 to serve as the stopping portion 43.

In one embodiment, the supporting body 24 protrudes from the side surface 21c of the first substrate 21.

In one embodiment, the supporting body 24 is a thermosetting adhesive material.

In one embodiment, the electronic package 2 further includes an electronic component 20 disposed on the second substrate 22. Further, the second substrate 22 has a first side 22a and a second side 22b opposite to each other, the first substrate 21 is stacked on the first side 22a of the second substrate 22, and the electronic component 20 is disposed on the second side 22b of the second substrate 22.

In one embodiment, the second substrate 22 further has an antenna portion 221 for inducing the antenna structure 211.

In summary, the electronic package and the manufacturing method thereof of the present invention, through the design of the supporting body, the distance between the first substrate and the second substrate can be kept unchanged after the high temperature process, so the electronic package of the present invention can ensure the normal function of the antenna structure, and thus can ensure that the product yield meets the expectation.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.