阅读说明：本技术 再分布基板、制造再分布基板的方法和半导体封装件 (Redistribution substrate, method of manufacturing redistribution substrate, and semiconductor package ) 是由 金钟润 李锡贤 裵珉准 于 2019-09-09 设计创作，主要内容包括：提供了一种再分布基板、一种制造再分布基板的方法以及一种半导体封装件。所述方法包括：形成第一导电图案；在所述第一导电图案上形成第一光敏层,所述第一光敏层具有暴露所述第一导电图案的第一部分的第一通孔；在所述第一通孔中形成第一通路；去除所述第一光敏层；形成包封所述第一导电图案和所述第一通路的第一电介质层,所述第一电介质层暴露所述第一通路的顶表面；以及在所述第一通路的所述顶表面上形成第二导电图案。(A redistribution substrate, a method of manufacturing the redistribution substrate, and a semiconductor package are provided. The method comprises the following steps: forming a first conductive pattern; forming a first photosensitive layer on the first conductive pattern, the first photosensitive layer having a first via hole exposing a first portion of the first conductive pattern; forming a first via in the first via; removing the first photosensitive layer; forming a first dielectric layer encapsulating the first conductive pattern and the first via, the first dielectric layer exposing a top surface of the first via; and forming a second conductive pattern on the top surface of the first via.)

1. A method of fabricating a redistribution substrate, the method comprising:

forming a first conductive pattern;

forming a first photosensitive layer on the first conductive pattern, the first photosensitive layer having a first via hole exposing a first portion of the first conductive pattern;

forming a first via in the first via;

removing the first photosensitive layer;

forming a first dielectric layer encapsulating the first conductive pattern and the first via, the first dielectric layer exposing a top surface of the first via; and

forming a second conductive pattern on the top surface of the first via.

2. The method of claim 1, wherein the first via of the first photosensitive layer is cylindrical with a uniform width.

3. The method of claim 1, further comprising, prior to forming the first photosensitive layer, forming a first seed layer overlying the first conductive pattern,

wherein forming the first via comprises seeding with the first seed layer to form a conductive material filling the first via.

4. The method of claim 1, further comprising:

forming a second dielectric layer covering the second conductive pattern;

etching the second dielectric layer to form a second via exposing a second portion of the second conductive pattern; and

and forming a second via filling the second through hole and an under bump pad positioned on the second via.

5. The method of claim 4, wherein the second via and the under bump pad are integrally formed as a single body.

6. The method of claim 4, wherein the second via has a taper shape with a width that increases with distance from the second conductive pattern.

7. The method of claim 4, wherein the second width of the bottom surface of the second via is greater than the first width of the first via.

8. The method of claim 4, wherein forming the second via and the under bump pad comprises:

forming a second seed layer covering the second dielectric layer and also covering a bottom surface and inner walls of the second via;

forming a second photosensitive layer on the second seed layer, the second photosensitive layer having a third via hole exposing the second via hole; and

using the second seed layer as a seed to form a conductive material filling the second and third vias.

9. The method of claim 1, wherein the first via is formed by an exposure process performed on the first photosensitive layer.

10. The method of claim 1, after forming the first dielectric layer, the method further comprising: a top dielectric layer surface of the first dielectric layer is subjected to a polishing process to expose a top surface of the first via.

11. A redistribution substrate, the redistribution substrate comprising:

a first conductive pattern;

a first via connected to a first top surface of the first conductive pattern;

a second conductive pattern on the first via, the second conductive pattern comprising: a second conductive pattern pad connected to the first via; and a plurality of connection lines spaced apart from the second conductive pattern pads;

a second via connected to a second top surface of the second conductive pattern pad; and

an under bump pad on the second via,

wherein a first angle between a first side surface of the first via and the first top surface of the first conductive pattern is greater than a second angle between a second side surface of the second via and the second top surface of the second conductive pattern pad.

12. The redistribution substrate of claim 11, further comprising:

a first seed layer between the first via and the first conductive pattern; and

a second seed layer between the second via and the second conductive pattern pad.

13. The redistribution substrate of claim 11, further comprising: a first dielectric layer covering the first conductive pattern and surrounding the first via,

wherein the first dielectric layer is in direct contact with the first side surface of the first via.

14. The redistribution substrate of claim 13, wherein the first dielectric top surface of the first dielectric layer is coplanar with the first via top surface of the first via.

15. The redistribution substrate of claim 12, further comprising a second dielectric layer covering the second conductive pattern and surrounding the second via,

wherein the second seed layer extends between the second dielectric layer and the second via and between the second dielectric layer and the under bump pad.

16. The redistribution substrate of claim 11,

the first side surface of the first via is perpendicular to the first top surface of the first conductive pattern, and

the second side surface of the second via is inclined with respect to the second top surface of the second conductive pattern pad.

17. The redistribution substrate of claim 11, further comprising: a third seed layer between the first via and the second conductive pattern pad.

18. The redistribution substrate of claim 11,

the first via has a cylindrical shape whose first via width is uniform, and

the second via has a tapered shape whose second via width increases as a distance from the second conductive pattern pad increases.

19. The redistribution substrate of claim 11, wherein a first width of a via top surface of the first via is equal to or less than a second width of a bottom surface of the second via.

20. A semiconductor package, comprising:

a first conductive pattern and a second conductive pattern vertically spaced apart from each other in a dielectric layer;

a plurality of first vias connecting the first conductive patterns and the second conductive patterns to each other;

a plurality of second vias on the second conductive pattern;

a plurality of under bump pads on the dielectric layer and respectively connected to the plurality of second vias; and

a semiconductor chip mounted on the plurality of under bump pads,

wherein the plurality of first passages each have a cylindrical shape whose first passage width is uniform, and

wherein the plurality of second vias each have a tapered shape, and a width of the tapered second via increases as a distance from the second conductive pattern increases.

21. The semiconductor package of claim 20, wherein the dielectric layer comprises:

a first dielectric layer encapsulating the first conductive pattern and the plurality of first vias; and

a second dielectric layer encapsulating the second conductive pattern and the plurality of second vias.

22. The semiconductor package of claim 20, wherein the second conductive pattern comprises:

a plurality of second conductive pattern pads, the plurality of first vias being coupled to the plurality of second conductive pattern pads, respectively, and the plurality of second vias being coupled to the plurality of second conductive pattern pads, respectively; and

a plurality of connection lines between the plurality of second conductive pattern pads.

23. The semiconductor package of claim 22, wherein a first spacing between the plurality of second conductive pattern pads is greater than a second spacing between the plurality of under bump pads.

24. The semiconductor package of claim 20, further comprising: a second seed layer separating the dielectric layer from second side surfaces of the plurality of second vias,

wherein the dielectric layer is in contact with the first side surfaces of the plurality of first vias.

25. The semiconductor package of claim 20, wherein a first width of a top surface of the plurality of first vias is equal to or less than a second width of a bottom surface of the plurality of second vias.

Technical Field

The present inventive concept relates to a redistribution substrate, a method of manufacturing the redistribution substrate, and a semiconductor package including the redistribution substrate.

Background

Semiconductor packages are provided to implement integrated circuit chips suitable for use in electronic products. Generally, a semiconductor package is configured such that a semiconductor chip is mounted on a Printed Circuit Board (PCB), and bonding wires or bumps are used to electrically connect the semiconductor chip to the PCB. With the development of the electronics industry, electronic products have increasingly high requirements for high performance, high speed, and compact size.

The size of semiconductor chips becomes smaller with high integration of semiconductor chips. The shrinking semiconductor chips result in difficulty in forming a desired number of connection lines. To meet the above trend, a wafer level package and a panel level package are provided.

Disclosure of Invention

One aspect provides a redistribution substrate having an increased degree of integration, a method of manufacturing the same, and a semiconductor package including the same.

Another aspect provides a redistribution substrate having enhanced electrical characteristics, a method of manufacturing the same, and a semiconductor package including the same.

The various aspects are not limited to the above, and other aspects not mentioned above will be clearly understood by those skilled in the art from the following description.

According to an aspect of one or more example embodiments, there is provided a method of manufacturing a redistribution substrate, the method comprising: forming a first conductive pattern; forming a first photosensitive layer on the first conductive pattern, the first photosensitive layer having a first via hole exposing a first portion of the first conductive pattern; forming a first via in the first via; removing the first photosensitive layer; forming a first dielectric layer encapsulating the first conductive pattern and the first via, the first dielectric layer exposing a top surface of the first via; and forming a second conductive pattern on the top surface of the first via.

According to another aspect of one or more example embodiments, there is provided a redistribution substrate including: a first conductive pattern; a first via connected to a first top surface of the first conductive pattern; a second conductive pattern on the first via, the second conductive pattern including a second conductive pattern pad connected to the first via and a plurality of connection lines spaced apart from the second conductive pattern pad; a second via connected to a second top surface of the second conductive pattern pad; and an under bump pad on a second via, wherein a first angle between a first side surface of the first via and the first top surface of the first conductive pattern is greater than a second angle between a second side surface of the second via and the second top surface of the second conductive pattern pad.

According to another aspect of one or more example embodiments, there is provided a semiconductor package including: a first conductive pattern and a second conductive pattern vertically spaced apart from each other in a dielectric layer; a plurality of first vias connecting the first conductive patterns and the second conductive patterns to each other; a plurality of second vias on the second conductive pattern; a plurality of under bump pads on the dielectric layer and respectively connected to the plurality of second vias; and a semiconductor chip mounted on the plurality of under bump pads, wherein the plurality of first vias each have a pillar shape whose first via width is uniform, and the plurality of second vias each have a taper shape whose second via width increases with increasing distance from the second conductive pattern.

According to another aspect of one or more example embodiments, there is provided a redistribution substrate including: a first connection line layer including a first pad and a first via connected to a top surface of the first pad, the first via having a uniform width; a second connection line layer including a second pad connected to a top surface of the first via, a plurality of connection lines spaced apart from the second pad, and a second via connected to a top surface of the second pad, a second via width of the second via increasing with increasing distance from the second pad; and an under bump pad located on the second via.

Drawings

Fig. 1 is a cross-sectional view illustrating a semiconductor package according to some example embodiments;

fig. 2 illustrates an enlarged view showing a portion a of the semiconductor package of fig. 1;

fig. 3 illustrates a cross-sectional view showing a semiconductor package according to some example embodiments;

fig. 4 illustrates a cross-sectional view showing a semiconductor package according to some example embodiments;

fig. 5 illustrates a cross-sectional view showing a semiconductor package according to some example embodiments;

fig. 6 illustrates an enlarged view showing a portion B of the semiconductor package of fig. 5; and

fig. 7-17 illustrate cross-sectional views showing methods of fabricating a redistribution substrate according to some example embodiments.

Detailed Description

The redistribution substrate and the semiconductor package will be described below with reference to the drawings. Fig. 1 is a cross-sectional view illustrating a semiconductor package according to some example embodiments. Fig. 2 illustrates an enlarged view showing a portion a of the semiconductor package of fig. 1.

Referring to fig. 1, a semiconductor package 10 according to some example embodiments may include a redistribution substrate 400, a semiconductor chip 500, and a molding layer 600.

The redistribution substrate 400 may be disposed on the bottom surface of the semiconductor chip 500 and the bottom surface of the molding layer 600. The thickness of the redistribution substrate 400 may be less than the thickness of the semiconductor chip 500. The redistribution substrate 400 may include at least one layer of connecting wires. The connection line layer may be provided in plurality. In some embodiments, the redistribution substrate 400 may include a first wiring layer 200 and a second wiring layer 300. The redistribution substrate 400 will be described in detail below with reference to fig. 1 and 2.

Referring to fig. 1 and 2, a support substrate 100 may be provided. The support substrate 100 may include a silicon substrate or a dielectric substrate. However, in some embodiments, the support substrate 100 may be omitted as desired.

The first connection line layer 200 may be disposed on the support substrate 100. The first connection line layer 200 may include a first conductive pattern 210, a first via 220, and a first dielectric layer 230.

The first conductive pattern 210 may be disposed on the support substrate 100. The first conductive pattern 210 may include a first pad 212 and a first connection line 214. In this specification, the first connection line 214 may extend in a direction parallel to the top surface of the support substrate 100 and may be defined as a component constituting a circuit, and the first pad 212 may be formed to have a width greater than that of the first connection line 214 and may be defined as a component coupled with the first connection line 214 and the first via 220. The first connection line 214 may be disposed between the first pads 212 or disposed at a side of the first pads 212. The first connection line 214 may be electrically connected to the first pad 212. In this specification, the phrase "electrically connected/coupled" may include "directly or indirectly connected/coupled". The first conductive pattern 210 may include a conductive material. For example, the first conductive pattern 210 may include copper (Cu), aluminum (Al), or a copper alloy.

The first seed layer 216 may be disposed between the first conductive pattern 210 and the support substrate 100. The first seed layer 216 may include copper (Cu). The first seed layer 216 may have a thickness of about

To about

Is measured.

The first via 220 may be disposed on the first conductive pattern 210. For example, the first via 220 may be disposed on a top surface of the at least one first pad 212. In the present specification, the first via 220 may be defined as an assembly vertically connecting the first conductive pattern 210 in the first connection line layer 200 to the second conductive pattern 310 in the second connection line layer 300, which will be discussed below. As shown in fig. 2, the side surface 220a of the first via 220 may be disposed at a first angle AG1 with respect to the top surface of the first pad 212, and the first angle AG1 may be about 90 °. The side surface 220a of the first via 220 may be substantially perpendicular to the top surface of the first conductive pattern 210. Each first passage 220 may have a cylindrical shape with a uniform width W1. The width W1 of each first via 220 may be about 2 μm to about 8 μm. For example, the width W1 of each first via 220 may be about 5 μm. The first via 220 may be electrically connected to the first connection line 214 through the first pad 212. The first via 220 may include a conductive material. For example, the first via 220 may include copper (Cu), aluminum (Al), or a copper alloy.

The second seed layer 222 may be disposed between the first conductive pattern 210 and each of the first vias 220. The second seed layer 222 may contact the bottom surface 220b of each first via 220 and may not cover the side surface 220a of each first via 220. The second seed layer 222 may include copper (Cu). The second seed layer 222 may have a thickness of about

To about

Is measured.

The first dielectric layer 230 may be disposed on the support substrate 100. The first dielectric layer 230 may cover the first conductive pattern 210 and may surround the first via 220. The first dielectric layer 230 may contact the side surfaces 220a of the first via 220 and the side surfaces of the second seed layer 222. A top surface of the first dielectric layer 230 may be coplanar with a top surface 220c of the first via 220. The first dielectric layer 230 may include a curable material. Accordingly, the first dielectric layer 230 may be cured by heat or light. The curable material may include, but is not limited to, polyamide-based polymers and/or inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride. For example, the curable material may include one or more of photosensitive polyimide (PSPI), Polybenzoxazole (PBO), a novolac polymer, benzocyclobutene (BCB) polymer, and an epoxy polymer.

Referring back to fig. 1, a second connection line layer 300 may be disposed on the first connection line layer 200. The second connection line layer 300 may include a second conductive pattern 310, a second via 320, and a second dielectric layer 330.

The second conductive pattern 310 may be disposed on the first connection line layer 200. The second conductive pattern 310 may include a second pad 312 and a second connection line 314. In this specification, the second connection line 314 may extend in a direction parallel to the top surface of the first connection line layer 200 and may be defined as a component constituting a circuit, and the second pad 312 may be formed to have a width greater than that of the second connection line 314 and may be defined as a component coupled with the second connection line 314 and the second via 320. Some of the second pads 312 may be disposed on the first vias 220 and coupled to the first vias 220. As shown in fig. 2, the width W2 of each second pad 312 may be greater than the width W1 of each first via 220. For example, the width W2 of each second pad 312 may be 1 to 2 times the width W1 of each second via 220. The width W2 of each second pad 312 may be about 2 μm to about 15 μm. For example, in some embodiments, the width W2 of each second pad 312 may be about 2 μm to about 10 μm. The second pad 312 may protrude beyond the side surface 220a of the first via 220. For example, the second pad 312 and the first via 220 may be integrally coupled to constitute a T-shaped cross-section. For another example, the second pad 312 and the first via 220 may be integrally coupled to constitute a bolt-like shape. The second pad 312 may be electrically connected to the first pad 212 through the first via 220. The second connection line 314 may be disposed on the first dielectric layer 230. The second connection line 314 may be disposed between the second pads 312 or disposed at a side of the second pads 312 when viewed in a plan view. 8 to 15 second connection lines 314 may be disposed between the second pads 312. For example, in the embodiment shown in fig. 1, 11 second connection lines 314 may be disposed between the second pads 312. As shown in fig. 2, each of the second connection lines 314 may have a width LW of about 1 μm to about 3 μm. For example, the width LW of each second connection line 314 between the second pads 312 may be about 2 μm. The second connection lines 314 may be spaced apart from each other at an interval LG of about 1 μm to about 3 μm. For example, the second connection lines 314 may be spaced apart from each other at intervals LG of about 2 μm. The second connection line 314 may function as a redistribution line. The second connection line 314 may be electrically connected to the second pad 312. The second conductive pattern 310 may include a conductive material. For example, the second conductive pattern 310 may include copper (Cu), aluminum (Al), or a copper alloy.

The third seed layer 316 may be disposed between the second conductive pattern 310 and the first dielectric layer 230 and between the second conductive pattern 310 and the first via 220. For example, the third seed layer 316 may be disposed on the bottom surface of the second conductive pattern 310. The third seed layer 316 may include copper (Cu). The third seed layer 316 may have an approximate thickness

To about

Is measured.

The second via 320 may be disposed on the second conductive pattern 310. The second via 320 may be disposed on the top surface of the second pad 312, respectively. In this specification, the second via 320 may be defined as an assembly vertically connecting the second conductive pattern 310 in the second connection line layer 300 to the under bump pad 340, which will be discussed below. As shown in fig. 2, the side surface 320a of the second via 320 may be disposed at a second angle AG2 with respect to the top surface of the second pad 312, and the second angle AG2 may be smaller than the first angle AG1 between the side surface 220a of the first via 220 and the top surface of the first pad 212. For example, the second angle AG2 may be an acute angle less than about 90 °. The side surface 320a of the second via 320 may be inclined with respect to the top surface of the second conductive pattern 310. For example, each of the second vias 320 may have a tapered shape having a width that increases as the distance from the second conductive pattern 310 increases. Each second via 320 may have a bottom surface 320b and a top surface 320 c. The width W3b of the top surface 320c may be 2 to 4 times the width W3a of the bottom surface 320 b. The width W3a of the bottom surface 320b of each second passage 320 may be equal to or greater than the width W1 of each first passage 220. The width W3a of the bottom surface 320b of each second via 320 may be about 2 μm to about 8 μm. For example, the width W3a of the bottom surface 320b of each second via 320 may be about 5 μm. The second via 320 may be electrically connected to the second connection line 314 through the second pad 312. The second via 320 may include a conductive material.

The second dielectric layer 330 may be disposed on the first connection line layer 200. The second dielectric layer 330 may cover the second conductive pattern 310 and may surround the second via 320. The second dielectric layer 330 may contact a side surface of the second conductive pattern 310. The level of the top surface 320c of the second via 320 may be higher than the level of the top surface of the second dielectric layer 330. The second dielectric layer 330 may include a curable material. The curable material may include, but is not limited to, polyamide-based polymers and/or inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride.

The lower bump pad 340 may be disposed on the top surface 320c of the second via 320. The under bump pad 340 may be formed to have a width greater than that of the second via 320, and may be defined as a component coupled with the second via 320 and a connection terminal 510 of the semiconductor chip 500, which will be discussed below. As shown in fig. 2, the width W4 of each lower bump pad 340 may be greater than the width of the second pad 312. The width W4 of each lower bump pad 340 may be greater than the width W3b of the top surface 320c of each second via 320. The width W4 of each lower bump pad 340 may be about 1.5 to 3 times the width W3b of the top surface 320c of each second via 320. The lower bump pad 340 and the second via 320 may be integrally connected to be one body. The under bump pad 340 may include, for example, the same material as the second via 320. The under bump pad 340 may include a conductive material.

In the first dielectric layer 230, the first conductive pattern 210 may include circuits (e.g., the first connection line 214 and the first pad 212) extending in a direction parallel to the top surface of the first dielectric layer 230, and in the second dielectric layer 330, the second conductive pattern 310 may include circuits (e.g., the second connection line 314 and the second pad 312) extending in a direction parallel to the top surface of the second dielectric layer 330. The first via 220 may vertically connect the first conductive pattern 210 to the second conductive pattern 310, and the second via 320 may vertically connect the second conductive pattern 310 to the under bump pad 340.

According to the example embodiment shown in fig. 1 and 2, since each first via 220 has a pillar shape having a uniform width W1, each first via 220 may have a small width at a top surface 220c thereof, and the second pad 312 may be easily formed to have a small width on the corresponding first via 220. In addition, the lower bump pad 340 and the second pad 312 may be vertically spaced apart from each other by the second via 320 having a tapered shape. In this case, since the width W4 of each of the lower bump pads 340 is greater than the width W2 of each of the second pads 312, the lower bump pad interval between the lower bump pads 340 may be smaller than the second pad interval between the second pads 312. When the second pads 312 are arranged at the same pitch as that of the lower bump pads 340, a wider interval may be provided between the second pads 312 than that between the lower bump pads 340, and thus more second connection lines 314 may be provided between the second pads 312. For example, the redistribution substrate 400 may have a high density of second connection lines 314, and the redistribution substrate 400 may use a smaller area to form the same number of connection lines (e.g., second connection lines 314) than is the case in the prior art.

The fourth seed layer 322 may be disposed between the second conductive pattern 310 and each of the second vias 320. The fourth seed layer 322 may extend from the bottom surface 320b of the second via 320 along the side surface 320a of the second via 320 toward the gap between the second dielectric layer 330 and the under bump pad 340, as shown in fig. 2. For example, the fourth seed layer 322 may separate the second dielectric layer 330 from the second via 320 and the under bump pad 340. According to the inventive concept, the redistribution substrate 400 may be provided as described above.

Referring back to fig. 1, the semiconductor chip 500 may be placed on the top surface of the redistribution substrate 400. The semiconductor chip 500 may have a bottom surface or an active surface facing the redistribution substrate 400. The semiconductor chip 500 may include silicon (Si). The semiconductor chip 500 may be flip-chip bonded to the redistribution substrate 400. For example, the semiconductor chip 500 may have the connection terminal 510 on a bottom surface thereof. The connection terminals 510 may be coupled to the under bump pads 340 of the redistribution substrate 400. The connection terminal 510 may include a solder ball or a solder bump. The semiconductor chip 500 may be electrically connected to the second connection lines 314 through the lower bump pads 340 and the second vias 320 of the redistribution substrate 400. The redistribution substrate 400 may redistribute the connections of the semiconductor chip 500 using the second connection lines 314.

The molding layer 600 may be disposed on the redistribution substrate 400. On the top surface of the redistribution substrate 400, the molding layer 600 may encapsulate the semiconductor chip 500. For example, the molding layer 600 may cover the top surface and the side surface of the semiconductor chip 500. The molding layer 600 may fill a gap between the semiconductor chip 500 and the redistribution substrate 400. The molding layer 600 may include a dielectric material such as an epoxy-based polymer. Alternatively, the underfill member may fill the gap between the semiconductor chip 500 and the redistribution substrate 400.

According to the example embodiments shown in fig. 1 and 2, the semiconductor package 10 may include a redistribution substrate 400 having a high density of connection lines. Accordingly, the semiconductor package 10 can increase the degree of integration and reduce the size.

In other embodiments, the redistribution substrate 400 may be provided with external terminals 730 below the first wiring layer 200. Fig. 3 illustrates a cross-sectional view showing a semiconductor package according to some example embodiments.

Referring to fig. 3, the redistribution substrate 400 may be provided with a passivation layer 700 on a bottom surface thereof instead of the support substrate (see 100 of fig. 1). The passivation layer 700 may include an organic material, an inorganic material, an ajinomoto build-up film (ABF), or a dielectric polymer (e.g., an epoxy-based polymer). The external terminal 730 may be disposed on a bottom surface of the passivation layer 700.The external terminal 730 may be disposed on the external pad 710, and the external pad 710 penetrates the passivation layer 700 and is connected to the first conductive pattern 210. The external terminal 730 may be electrically connected to the first pad 212 of the redistribution substrate 400 through the external pad 710. A barrier metal layer 720 may be disposed between the passivation layer 700 and each of the outer pads 710. For example, the passivation layer 700 may have a recess exposing the first pad 212, and the barrier metal layer 720 may cover a bottom surface and an inner wall of the recess. The barrier metal layer 720 may be provided thereon with an outer pad 710 filling the recess. The external terminal 730 may include a solder ball or a solder bump. The external pad 710 may include a metal such as copper (Cu). The barrier metal layer 720 may include one or more of Ta, TaN, TaSiN, Ti, TiN, TiSiN, W, and WN. The barrier metal layer 720 may have a thickness of about

To aboutIs measured.

In other embodiments, the redistribution substrate 400 may include more than two layers of bonding wires. Fig. 4 illustrates a cross-sectional view showing a semiconductor package according to some example embodiments.

Referring to fig. 4, the redistribution substrate 400 may further include a third connection line layer 800 between the first connection line layer 200 and the second connection line layer 300. The third connection line layer 800 may include a third conductive pattern 810, a third via 820, and a third dielectric layer 830.

The third conductive pattern 810 may be disposed on the first connection line layer 200. The third conductive pattern 810 may include a third pad 812 and a third connection line 814. Some third pads 812 may be disposed on the first vias 220 and coupled to the first vias 220. The width of each third pad 812 may be greater than the width of each first via 220. The third connection line 814 may be disposed between the third pads 812 or disposed at a side of the third pads 812. The third connection line 814 may function as a redistribution line.

The fifth seed layer 816 may be disposed between the third conductive pattern 810 and the first dielectric layer 230 and between the third conductive pattern 810 and the first via 220. For example, the fifth seed layer 816 may be disposed on the bottom surface of the third conductive pattern 810.

The third via 820 may be disposed on the third conductive pattern 810. For example, the third via 820 may be disposed on a top surface of the at least one third pad 812. The third via 820 on the third pad 812 may be coupled to the second pad 312. The third passage 820 may have the same shape as that of the first passage 220. A side surface of the third via 820 may be perpendicular to a top surface of the third conductive pattern 810. Each third passage 820 may be a column shape having a uniform width. Each third via 820 may have a width of about 2 μm to about 8 μm. The sixth seed layer 822 may be disposed between the third conductive pattern 810 and each of the third vias 820. The sixth seed layer 822 may contact the bottom surface of the third via 820 and may not cover the side surface of the third via 820.

A third dielectric layer 830 may be disposed on the first connection line layer 200. The third dielectric layer 830 may cover the third conductive pattern 810 and may surround the third via 820. A top surface of third dielectric layer 830 may be coplanar with top surface 320c of third via 820. The third dielectric layer 830 may contact side surfaces of the third via 820 and side surfaces of the sixth seed layer 822. The third dielectric layer 830 may contact the bottom surface of the second connection line layer 300.

Fig. 4 illustrates a redistribution substrate 400 including three wiring layers 200, 300, and 800, but the inventive concept is not limited thereto. The redistribution substrate 400 may include more than three layers of connecting wires.

According to the example embodiment shown in fig. 4, since the first via 220 and the third via 820 are each in a column shape having a uniform width, the first via 220 and the third via 820 may each have a small width at the top surface thereof, and the third pad 812 and the second pad 312 may be easily formed to have a small width on the first via 220 and the third via 820, respectively. A wider interval may be provided between the second pads 312 having a narrow width and between the third pads 812 having a narrow width, and thus a greater number of second connection lines 314 may be provided between the second pads 312 and, likewise, a greater number of third connection lines 814 may be provided between the third pads 812. For example, the redistribution substrate 400 may have a high density of the connection lines 314 and 814, and the redistribution substrate 400 may use a smaller area to form the same number of connection lines 314 and 814 than is the case in the prior art.

Fig. 5 illustrates a cross-sectional view showing a semiconductor package according to some example embodiments. Fig. 6 shows an enlarged view showing a portion B of the semiconductor package of fig. 5. In the following embodiments, some components of the semiconductor package shown in fig. 5 and 6 may be omitted for convenience of description. For convenience of description, duplicate explanations will be omitted.

Referring to fig. 5 and 6, the semiconductor package 20 according to some example embodiments may include a redistribution substrate 400, a semiconductor chip 500, and a molding layer 600.

The redistribution substrate 400 may be disposed on the bottom surface of the semiconductor chip 500 and the bottom surface of the molding layer 600. The redistribution substrate 400 may include a first wiring layer 200 and a second wiring layer 300.

The first connection line layer 200 may be disposed on the support substrate 100. The first connection line layer 200 may include a first conductive pattern 210, a first via 220, and a first dielectric layer 230.

The first conductive pattern 210 may be disposed on the support substrate 100. The first conductive pattern 210 may include a first pad 212 and a first connection line 214. The first connection line 214 may be disposed between the first pads 212 or disposed at a side of the first pads 212. The first seed layer 216 may be disposed between the first conductive pattern 210 and the support substrate 100.

The first via 220 may be disposed on the first conductive pattern 210. For example, the first via 220 may be disposed on a top surface of the at least one first pad 212. As shown in fig. 6, a side surface 220a of the first via 220 may be perpendicular to a top surface of the first conductive pattern 210. Each first passage 220 may have a cylindrical shape with a uniform width W1. The first via 220 may include a conductive material. The second seed layer 222 may be disposed between the first conductive pattern 210 and each of the first vias 220. The second seed layer 222 may contact the bottom surface 220b of the first via 220 and may not cover the side surface 220a of the first via 220.

The first dielectric layer 230 may be disposed on the support substrate 100. The first dielectric layer 230 may cover the first conductive pattern 210 and may surround the first via 220. A top surface of the first dielectric layer 230 may be coplanar with a top surface of the first via 220. The first dielectric layer 230 may contact the side surfaces 220a of the first via 220 and the side surfaces of the second seed layer 222.

The second connection line layer 300 may be disposed on the first connection line layer 200. The second connection line layer 300 may include a second conductive pattern 310, a second via 320, and a second dielectric layer 330.

The second conductive pattern 310 may be disposed on the first connection line layer 200. The second conductive pattern 310 may include a second pad 312 and a second connection line 314. Some of the second pads 312 may be disposed on the first vias 220 and coupled to the first vias 220. The width W2 of each second pad 312 may be greater than the width W1 of each first via 220. The second connection line 314 may be disposed between the second pads 312 or disposed at a side of the second pads 312. The second connection line 314 may function as a redistribution line.

The third seed layer 316 may be disposed between the second conductive pattern 310 and the first dielectric layer 230 and between the second conductive pattern 310 and the first via 220. For example, the third seed layer 316 may be disposed on the bottom surface of the second conductive pattern 310.

The second via 320 may be disposed on the second conductive pattern 310. For example, the second via 320 may be disposed on a top surface of the at least one second pad 312. The side surface 320a of the second via 320 may be perpendicular to the top surface of the second conductive pattern 310. Each of the second passages 320 may have a cylindrical shape having a uniform width W3. The width W3 of each second via 320 may be about 2 μm to about 8 μm. For example, the width W3 of each second via 320 may be about 5 μm.

The fourth seed layer 322 may be between the second conductive pattern 310 and each of the second vias 320. The fourth seed layer 322 may contact the bottom surface 320b of the second via 320 and may not cover the side surface 320a of the second via 320.

The second dielectric layer 330 may be disposed on the first connection line layer 200. The second dielectric layer 330 may cover the second conductive pattern 310 and may surround the second via 320. A top surface of second dielectric layer 330 may be coplanar with a top surface 320c of second via 320. The second dielectric layer 330 may contact the side surfaces 320a of the second via 320 and the side surfaces of the fourth seed layer 322.

The under bump pad 340 may be disposed on the second dielectric layer 330. The under bump pad 340 may contact the top surface 320c of the second via 320 and the top surface of the second dielectric layer 330. The width W4 of each lower bump pad 340 may be greater than the width W3 of each second via 320. For example, the width W4 of each lower bump pad 340 may be 1 to 2 times the width W3 of each second via 320.

Fig. 7-17 illustrate cross-sectional views showing methods of fabricating a redistribution substrate according to some example embodiments.

Referring to fig. 7, a first conductive pattern 210 may be formed on the support substrate 100. For example, the first seed layer 216 may be formed on the support substrate 100, and then an etch mask having a depression may be formed on the first seed layer 216. The recess may define a region where the first conductive pattern 210 is formed. A plating process or the like may be performed to fill the recesses with a conductive material, thereby forming the first conductive patterns 210. Thereafter, the etch mask and a portion of the first seed layer 216 may be removed. The first seed layer 216 may remain between the first conductive pattern 210 and the support substrate 100. Alternatively, the conductive material may be deposited on the support substrate 100 and then patterned to form the first conductive pattern 210. The first conductive pattern 210 may include a first pad 212 and a first connection line 214.

Referring to fig. 8, a second seed layer 222 may be formed on the support substrate 100. The second seed layer 222 may be formed along the top surface of the support substrate 100 and along the side surfaces and the top surface of the first conductive pattern 210.

The first photosensitive layer PS1 may be formed on the support substrate 100. For example, a photosensitive hard mask material may be coated on the support substrate 100, the first conductive pattern 210, and the second seed layer 222 to form the first photosensitive layer PS 1. The photosensitive hard mask material may include a resin, a photosensitive material, a cross-linking agent, and a solvent.

Thereafter, a first through hole TH1 may be formed in the first photosensitive layer PS 1. For example, the exposed portion of the first photosensitive layer PS1 may be dissolved by a developing solution, and the unexposed portion of the first photosensitive layer PS1 may not be dissolved by the developing solution. The first through holes TH1 may penetrate the first photosensitive layer PS1 and may expose the top surface of the second seed layer 222. The first through holes TH1 may be formed on the first pad 212. Each of the first through holes TH1 may be formed in a pillar shape having a uniform width HW 1. The width HW1 of each first through hole TH1 may be about 2 μm to about 8 μm.

Referring to fig. 9, a first via 220 may be formed on the first conductive pattern 210. The first via 220 may be formed by filling the first through holes TH1 with a conductive material. For example, a plating process may be performed in which the second seed layer 222 exposed by the first photosensitive layer PS1 may be used as a seed. The plating process may fill the first through holes TH1 with a conductive material. The plating process may continue until the conductive material protrudes outward from the first photosensitive layer PS 1. Each of the first through-holes 220 may be formed in a cylindrical shape having a uniform width based on the shape of the first through-hole TH 1.

In the case of forming the via using the hard mask, the hard mask formed on the conductive pattern may be etched to form a through hole in which the via is formed. In this case, when the hard mask is etched, an upper portion of the hard mask may be lost, and thus the via hole may be formed to have a lower portion and an upper portion wider than the lower portion. Therefore, even if the lower portion of the through-hole is formed to have a minimum width for coupling between the conductive pattern and the via, the upper portion of the through-hole may be formed to be wider than the lower portion.

In contrast, according to example embodiments shown in fig. 7 to 9, a process for forming the first through holes TH1 may include an exposure process performed on the first photosensitive layer PS 1. In this case, the exposure process may change physical properties of the portion of the first photosensitive layer PS1 defining the region where the first through hole TH1 is formed, and no over-etching may act on the first photosensitive layer PS1 except the defined region. Accordingly, each of the first through holes TH1 may be formed to have a vertical straight line shape (e.g., a pillar shape having a uniform width), and also formed to have a minimum width for coupling between the first conductive pattern 210 and the first via 220. Further, according to the exemplary embodiments shown in fig. 7 to 9, the first photosensitive layer PS1 on which the exposure process is performed may be used as a mold for the plating process, and thus the first through holes TH1 each having a small width may be easily formed.

Referring to fig. 10, the first photosensitive layer PS1 may be removed. For example, the first photosensitive layer PS1 may be etched and removed, or the first photosensitive layer PS1 may be dissolved.

Thereafter, the second seed layer 222 may be partially removed. For example, a removal process may be performed on a portion of the second seed layer 222 (i.e., the portion exposed at the top surface of the support substrate 100 and at the side surfaces and the top surface of the first conductive pattern 210). The second seed layer 222 may remain between each first pad 212 and each first via 220.

Referring to fig. 11, a first dielectric layer 230 may be formed on a support substrate 100. For example, the first dielectric layer 230 may be formed by coating or depositing an encapsulation material on the support substrate 100, the first conductive pattern 210, and the first via 220. The first dielectric layer 230 may be formed using PECVD (plasma enhanced CVD), HDPCVD (high density plasma CVD), APCVD (atmospheric pressure CVD), spin coating, or the like. The first dielectric layer 230 may encapsulate the first conductive pattern 210 and the first via 220. Optionally, a curing process may be performed on the first dielectric layer 230, if desired.

Referring to fig. 12, a polishing process may be performed on the first dielectric layer 230. The grinding process may be continued until the top surface of the first via 220 is exposed at the top surface of the first dielectric layer 230. After performing the grinding process, a top surface of the first dielectric layer 230 may be coplanar with a top surface of the first via 220. Through the above process, the first connection line layer 200 may be formed on the support substrate 100.

Referring to fig. 13, a second conductive pattern 310 may be formed on the first connection line layer 200. For example, a third seed layer 316 may be formed on the first dielectric layer 230. The third seed layer 316 may overlie the first dielectric layer 230.

A mask pattern MP may be formed on the third seed layer 316. The mask pattern MP may have a first hole H1 exposing the first via 220 and a second hole H2 spaced apart from the first hole H1. The first hole H1 may define a region in which the second pad 312, which will be discussed below, is formed, and the second hole H2 may define a region in which the second connection line 314, which will be discussed below, is formed. The planar shape of the first hole H1 may be the same as or larger than the planar shape of the first passage 220. The width of the first holes H1 may be 1 to 2 times the width of each first through hole TH1 (see HW1 of fig. 8). The width of the first hole H1 may be about 2 μm to about 15 μm. The second holes H2 may be formed between the first holes H1. The second holes H2 may each have a width of about 1 μm to about 3 μm, and may be spaced apart from each other at intervals of about 1 μm to about 3 μm.

A plating process or the like may be performed to fill the first hole H1 and the second hole H2 with a conductive material, thereby forming the second conductive pattern 310 including the second pad 312 and the second connection line 314. Each of the second pads 312 may be formed to have a width of about 2 μm to about 15 μm based on the shape of the first hole H1. Alternatively, the conductive material may be deposited on the first dielectric layer 230 and then patterned to form the second conductive pattern 310. The second pads 312 may be formed on the first via 220, and the second connection line 314 may be formed between the second pads 312.

Each of the second pads 312 may be formed to have a width identical to or greater than a width of each of the first vias 220. According to the example embodiments shown in fig. 7 to 13, the first via 220 may be formed in the first through hole (see TH1 of fig. 9) having the same width at the upper and lower portions thereof, and the first via 220 may be easily formed to have an upper portion having a small width. Therefore, the second pad 312 may also have a small width on the first via 220. In addition, the second pad 312 may be separately formed after the first via 220 is formed, and thus the second pad 312 having a small size may be easily formed. Accordingly, a wider interval may be provided between the second pads 312, and a greater number of second connection lines 314 may be provided between the second pads 312. Accordingly, a semiconductor package having an improved integration and a reduced size can be manufactured as compared with the related art case.

On the other hand, when the first via 220 is formed such that the upper portion is wider than the lower portion as in the related art, the width of the second pads 312 may be increased, thereby decreasing the interval between the second pads 312, and thus, a small amount of the second connection line 314 may be formed between the second pads 312.

Referring to fig. 14, the mask pattern MP may be removed, and a portion of the third seed layer 316 may be removed. The third seed layer 316 may remain between each first via 220 and each second pad 312 and between the first dielectric layer 230 and each second connection line 314.

A second dielectric layer 330 may be formed on the first connection line layer 200. For example, the second dielectric layer 330 may be formed by coating or depositing an encapsulation material on the first dielectric layer 230 and the second conductive pattern 310. The second dielectric layer 330 may be formed using PECVD (plasma enhanced CVD), HDPCVD (high density plasma CVD), APCVD (atmospheric pressure CVD), spin coating, or the like. The second dielectric layer 330 may encapsulate the second conductive pattern 310. Optionally, a curing process may be performed on the second dielectric layer 330.

Referring to fig. 15, a second through hole TH2 may be formed in the second dielectric layer 330. For example, the second dielectric layer 330 may be subjected to an etching process to form the second through holes TH 2. The etching process may over-etch an upper portion of the second dielectric layer 330, and thus each of the second through holes TH2 may have a tapered shape in which a width increases with increasing distance from the second conductive pattern 310. The second through holes TH2 may penetrate the second dielectric layer 330 and may expose the top surface of the second pads 312. Each of the second through holes TH2 may have a top end having a width 2 to 4 times that of a bottom end of the second through hole TH 2. The width of the bottom end of the second through hole TH2 may be equal to or greater than the width of the first through hole TH1 (see HW1 of fig. 8). The width of the bottom end of the second through hole TH2 may be about 2 μm to about 8 μm. The second through holes TH2 may define a region in which a second via 320, which will be discussed below, is formed.

Referring to fig. 16, a fourth seed layer 322 may be formed on the second dielectric layer 330. The fourth seed layer 322 may be formed along the top surface of the second dielectric layer 330 and along the bottom surface and the inner wall of the second via TH 2.

A second photosensitive layer PS2 may be formed on the second dielectric layer 330. For example, the second sensitive layer PS2 may be formed by coating a photosensitive material on the fourth seed layer 322. Thereafter, third through holes TH3 may be formed in the second photosensitive layer PS 2. The third through holes TH3 may be formed on the second through holes TH 2. For example, the third through hole TH3 of the second photosensitive layer PS2 may be spatially connected to the second through hole TH2 of the second dielectric layer 330. The third through holes TH3 may expose the top surface of the fourth seed layer 322. The third through holes TH3 may define a region in which a lower bump pad 340, which will be discussed below, is formed. The planar shape of each third through hole TH3 may be the same as or greater than that of each second through hole TH 2. The width of each third through hole TH3 may be 1 to 2 times the width of each second through hole TH 2.

Referring to fig. 17, a second via 320 and a lower bump pad 340 may be formed on the second pad 312. The second via 320 may be formed by filling the second via hole TH2 with a conductive material. For example, the fourth seed layer 322 exposed to the second through holes TH2 may be used as a seed to perform a plating process to fill the second through holes TH2 with a conductive material. Each of the second vias 320 may be formed to have a tapered shape having a width that increases as a distance from the second conductive pattern 310 increases, based on the shape of each of the second through holes TH 2. The lower bump pad 340 may be formed by filling the third through hole TH3 with a conductive material. For example, the second via 320 exposed to the third through hole TH3 may be used as a seed to perform a plating process to fill the third through hole TH3 with a conductive material. Although the process for forming the second via 320 and the process for forming the under bump pad 340 are described separately from each other, the process for forming the second via 320 and the process for forming the under bump pad 340 may be performed continuously, and the second via 320 and the under bump pad 340 may be integrally formed as a single body. In other embodiments, after forming the second via 320, a separate process may be performed to form the under bump pad 340. Through the above process, the second connection line layer 300 may be formed on the first connection line layer 200.

Thereafter, the second photosensitive layer PS2 may be removed to manufacture the redistribution substrate 400.

Referring back to fig. 1, a semiconductor chip 500 may be mounted on the redistribution substrate 400. For example, the semiconductor chip 500 may be flip-chip bonded to the under bump pads 340 of the redistribution substrate 400.

The molding layer 600 may be formed on the redistribution substrate 400. For example, a dielectric material may be provided on the redistribution substrate 400 to cover the semiconductor chip 500. The above process may manufacture the semiconductor package 10 of fig. 1.

In other embodiments, a process may be further performed to form the external terminal 730 on the semiconductor package 10 of fig. 1. Referring to fig. 3, the support substrate 100 may be removed to expose the bottom surface of the redistribution substrate 400. A passivation layer 700 may be formed under the redistribution substrate 400. For example, the redistribution substrate 400 may be provided with an organic material, an inorganic material, an ajinomoto build-up film (ABF), or a dielectric polymer (e.g., an epoxy-based polymer) on a bottom surface thereof, which may form the passivation layer 700. Thereafter, a groove exposing the first pad 212 may be formed in the passivation layer 700, and then the groove may be filled with a conductive material to form the metal layer 720 and the outer pad 710. The external pads 710 may be provided thereon with external terminals 730 (e.g., solder balls or solder bumps), with the result that a semiconductor package as shown in fig. 3 may be manufactured.

According to some example embodiments, since the redistribution substrate includes pads each having a narrow width, a wide space may be provided between the pads, and thus a greater number of connection lines may be disposed between the pads. Thus, the redistribution substrate may have a high density of connection lines for redistribution, and the redistribution substrate may use a smaller area to form the same number of connection lines than in the prior art case. As a result, a semiconductor package of compact size can be provided.

In a method of manufacturing a semiconductor package according to some example embodiments, a via may be formed to have a small width, and thus, a pad formed on the via may also have a small width. Therefore, a small-sized pad can be easily formed. Therefore, a wider interval can be provided between the pads and a larger number of connection lines can be formed between the pads than in the case of the related art. Accordingly, a semiconductor package having an increased integration and a reduced size can be manufactured as compared with the case of the related art.

Although the present inventive concept has been described with reference to certain exemplary embodiments shown in the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and essential characteristics of the inventive concept as set forth in the appended claims. Accordingly, the disclosed embodiments are to be considered in all respects as illustrative and not restrictive.