Si layer for oxygen insertion to reduce contact implant out-diffusion in vertical power devices
阅读说明:本技术 用于在垂直功率器件中减小接触注入物向外扩散的氧***的Si层 (Si layer for oxygen insertion to reduce contact implant out-diffusion in vertical power devices ) 是由 M.波茨尔 O.布兰克 T.菲尔 B.格勒 R.哈瑟 S.里奥曼 A.梅瑟 M.罗施 于 2019-08-08 设计创作,主要内容包括:用于在垂直功率器件中减小接触注入物向外扩散的氧插入的Si层。一种半导体器件包括:延伸到Si衬底中的栅沟槽;在Si衬底中的本体区,该本体区包括沿栅沟槽的侧壁延伸的沟道区;在本体区上方、在Si衬底中的源区;延伸到Si衬底中并且通过源区的一部分和本体区的一部分与栅沟槽分离的接触沟槽,该接触沟槽填充有导电材料,该导电材料接触在接触沟槽的侧壁处的源区和在接触沟槽的底部处的高掺杂本体接触区;以及沿接触沟槽的侧壁形成并且被设置在高掺杂本体接触区和沟道区之间的扩散阻挡结构,该扩散阻挡结构包括Si和氧掺杂Si的交替层。(An oxygen-inserted Si layer for reducing contact implant out-diffusion in vertical power devices. A semiconductor device includes: a gate trench extending into the Si substrate; a body region in the Si substrate, the body region including a channel region extending along a sidewall of the gate trench; a source region in the Si substrate over the body region; a contact trench extending into the Si substrate and separated from the gate trench by a portion of the source region and a portion of the body region, the contact trench being filled with a conductive material contacting the source region at sidewalls of the contact trench and the highly doped body contact region at a bottom of the contact trench; and a diffusion barrier structure formed along sidewalls of the contact trench and disposed between the highly doped body contact region and the channel region, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si.)
1. A semiconductor device, comprising:
a gate trench extending into the Si substrate;
a body region in the Si substrate, the body region comprising a channel region extending along a sidewall of the gate trench;
a source region in the Si substrate over the body region;
a contact trench extending into the Si substrate and separated from the gate trench by a portion of the source region and a portion of the body region, the contact trench filled with a conductive material that contacts the source region at sidewalls of the contact trench and a highly doped body contact region at a bottom of the contact trench; and
a diffusion barrier structure formed along sidewalls of the contact trench and disposed between the highly doped body contact region and the channel region, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si.
2. The semiconductor device of claim 1, wherein the diffusion barrier structure extends along a bottom of the contact trench.
3. The semiconductor device of claim 1 wherein the highly doped body contact region is laterally confined only by the diffusion barrier structure, which is not at the bottom of the contact trench.
4. The semiconductor device of claim 1, wherein the conductive material filling the contact trench may extend onto the front major surface of the Si substrate beyond the diffusion barrier structure and in a direction towards the gate trench.
5. The semiconductor device of claim 1, wherein the diffusion barrier structure comprises a blanket layer of Si epitaxially grown on the alternating layers of Si and oxygen-doped Si.
6. A method of manufacturing a semiconductor device, the method comprising:
forming a gate trench extending into the Si substrate;
forming a contact trench extending into the Si substrate and separated from the gate trench;
forming a highly doped body contact region in the Si substrate at the bottom of the contact trench;
forming a diffusion barrier structure along sidewalls of the contact trench, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si;
forming a body region in the Si substrate, the body region including a channel region extending along a sidewall of the gate trench;
forming a source region in the Si substrate over the body region; and
the contact trench is filled with a conductive material that contacts the source region at the sidewalls of the contact trench and the highly doped body contact region at the bottom of the contact trench.
7. The method of claim 6, wherein forming the diffusion barrier structure comprises:
epitaxially growing the alternating layers of Si and oxygen-doped Si on sidewalls and bottom of the contact trench prior to filling the contact trench with the conductive material.
8. The method of claim 7, further comprising:
epitaxially growing a Si cap layer on the alternating layers of Si and oxygen-doped Si.
9. The method of claim 7, wherein forming the highly doped body contact region comprises:
implanting dopant species into the alternating layers of Si and oxygen-doped Si at the bottom of the contact trench; and
annealing the Si substrate to activate the implanted dopant species.
10. The method of claim 7, further comprising:
removing the alternating layers of Si and oxygen-doped Si from at least a portion of the bottom of the contact trench.
11. The method of claim 10, wherein removing the alternating layers of Si and oxygen-doped Si from at least a portion of the bottom of the contact trench comprises:
epitaxially growing a Si cap layer on the alternating layers of Si and oxygen-doped Si;
depositing a conformal spacer oxide on the Si cap layer;
anisotropically etching the conformal spacer oxide to expose a diffusion barrier structure at a bottom of the contact trench;
etching away the exposed diffusion barrier structure at the bottom of the contact trench; and
removing the conformal spacer oxide after etching away the exposed diffusion barrier structure at the bottom of the contact trench.
12. The method of claim 6, wherein forming the diffusion barrier structure comprises:
epitaxially growing the alternating layers of Si and oxygen-doped Si only on the sidewalls, but not on the bottom, of the contact trench prior to filling the contact trench with the conductive material.
13. The method of claim 12, further comprising:
epitaxially growing a Si cap layer on the alternating layers of Si and oxygen-doped Si.
14. The method of claim 12, wherein forming the highly doped body contact region comprises:
implanting dopant species into the bottom of the contact trench, the bottom of the contact trench being free of the alternating layers of Si and oxygen-doped Si; and
annealing the Si substrate to activate the implanted dopant species.
15. The method of claim 6, further comprising:
etching back an insulating layer formed on the front main surface of the Si substrate before filling the contact trench with the conductive material, such that the insulating layer has an opening that is aligned with the contact trench and is wider than a combined width of the contact trench and the diffusion barrier structure.
16. The method of claim 15, wherein filling the contact trench with the conductive material comprises:
depositing the conductive material in the contact trench and in an opening formed in the insulating layer such that the conductive material extends onto the front major surface of the Si substrate beyond the diffusion barrier structure and in a direction toward the gate trench.
17. The method of claim 6, wherein forming the diffusion barrier structure comprises:
epitaxially growing the alternating layers of Si and oxygen-doped Si on the sidewalls and bottom of the contact trench prior to forming the body region and the source region.
18. The method of claim 17, further comprising:
epitaxially growing a Si cap layer on the alternating layers of Si and oxygen-doped Si before forming the body regions and the source regions.
19. The method of claim 17, further comprising:
removing the alternating layers of Si and oxygen-doped Si from at least a portion of the bottom of the contact trench.
20. The method of claim 19, wherein removing the alternating layers of Si and oxygen-doped Si from at least a portion of the bottom of the contact trench comprises:
epitaxially growing a Si cap layer on the alternating layers of Si and oxygen-doped Si;
depositing a conformal spacer oxide on the Si cap layer;
anisotropically etching the conformal spacer oxide to expose a diffusion barrier structure at a bottom of the contact trench;
etching away the exposed diffusion barrier structure at the bottom of the contact trench; and
removing the conformal spacer oxide after etching away the exposed diffusion barrier structure at the bottom of the contact trench.
21. The method of claim 6, wherein forming the diffusion barrier structure comprises:
forming a sacrificial insulating layer at the bottom of the contact trench before forming the body region and the source region;
after forming the sacrificial insulating layer, epitaxially growing alternating layers of the Si and oxygen-doped Si on sidewalls of the contact trench;
after epitaxially growing the alternating layers of Si and oxygen-doped Si, the sacrificial insulating layer is removed from the bottom of the contact trench.
22. The method of claim 6, further comprising:
filling the contact trench with a sacrificial plug material after forming the diffusion barrier structure and before forming the source and body regions;
forming the source region and the body region in the Si substrate after filling the contact trench with the sacrificial plug material;
removing the sacrificial plug material after forming the source region and the body region;
implanting dopant species into the bottom of the contact trench after removing the sacrificial plug material and before filling the contact trench with the conductive material; and
annealing the Si substrate to activate the implanted dopant species to form the highly doped body contact region.
Background
As the dimensions of trench-based transistors shrink, the impact of highly doped source/body contacts on the net body doping near the channel region becomes more important. The Vth (threshold voltage) and RonA (on-state resistance) of the device increase for a wider lateral distribution of source/body contact diffusion with doping levels 2-3 orders of magnitude higher than the body doping. Increasing the distance between the source/body contact and the channel region causes the body to be depleted at high drain voltages, which may result in high DIBL (drain induced barrier reduction). Furthermore, the process window variation for both trench width and contact width, as well as contact misalignment, must become smaller to avoid these adverse effects (higher Vth, higher RonA, and higher DIBL).
Therefore, it is desirable to better control the lateral out-diffusion of the source/body contact doping.
Disclosure of Invention
According to an embodiment of a semiconductor device, the semiconductor device comprises: a gate trench extending into the Si substrate; a body region in the Si substrate, the body region including a channel region extending along a sidewall of the gate trench; a source region in the Si substrate over the body region; a contact trench extending into the Si substrate and separated from the gate trench by a portion of the source region and a portion of the body region, the contact trench being filled with a conductive material contacting the source region at sidewalls of the contact trench and the highly doped body contact region at a bottom of the contact trench; and a diffusion barrier structure formed along sidewalls of the contact trench and disposed between the highly doped body contact region and the channel region, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si.
In an embodiment, the diffusion barrier structure may extend along the bottom of the contact trench.
Alone or in combination, the highly doped body contact region may be laterally confined only by the diffusion barrier structure, which is not at the bottom of the contact trench.
The conductive material filling the contact trenches may extend onto the front main surface of the Si substrate beyond the diffusion barrier structure and in a direction towards the gate trenches, either individually or in combination.
The diffusion barrier structure may comprise, either alone or in combination, a blanket layer of Si epitaxially grown on alternating layers of Si and oxygen-doped Si.
The Si substrate may comprise, alone or in combination, one or more Si epitaxial layers grown on a base Si substrate.
According to an embodiment of a method of manufacturing a semiconductor device, the method comprises: forming a gate trench extending into the Si substrate; forming a contact trench extending into the Si substrate and separated from the gate trench; forming a highly doped body contact region in the Si substrate at the bottom of the contact trench; forming a diffusion barrier structure along sidewalls of the contact trench, the diffusion barrier structure comprising alternating layers of Si and oxygen-doped Si; forming a body region in the Si substrate, the body region including a channel region extending along a sidewall of the gate trench; forming a source region in the Si substrate over the body region; and filling the contact trench with a conductive material that contacts the source region at the contact trench sidewalls and the highly doped body contact region at the bottom of the contact trench.
In an embodiment, forming the diffusion barrier structure may include epitaxially growing alternating layers of Si and oxygen-doped Si on sidewalls and a bottom of the contact trench prior to filling the contact trench with the conductive material.
The method may further comprise epitaxially growing a blanket layer of Si on the alternating layers of Si and oxygen-doped Si, either alone or in combination.
Separately or in combination, forming the highly doped body contact region may include implanting dopant species into the alternating layers of Si and oxygen-doped Si at the bottom of the contact trench, and annealing the Si substrate to activate the implanted dopant species.
Separately or in combination, the method may further include removing the alternating layers of Si and oxygen-doped Si from at least a portion of the bottom of the contact trench.
Removing the alternating layers of Si and oxygen-doped Si from at least a portion of the bottom of the contact trench, alone or in combination, may include: epitaxially growing a Si cap layer on the alternating layers of Si and oxygen-doped Si; depositing a conformal spacer oxide on the Si cap layer; anisotropically etching the conformal spacer oxide to expose the diffusion barrier structure at the bottom of the contact trench; etching away the exposed diffusion barrier structure at the bottom of the contact trench; and removing the conformal spacer oxide after etching away the exposed diffusion barrier structure at the bottom of the contact trench.
Separately or in combination, forming the diffusion barrier structure may include epitaxially growing alternating layers of Si and oxygen-doped Si only on the sidewalls, but not on the bottom, of the contact trench prior to filling the contact trench with the conductive material.
The method may further comprise epitaxially growing a blanket layer of Si on the alternating layers of Si and oxygen-doped Si, either alone or in combination.
Separately or in combination, forming the highly doped body contact region may include: implanting dopant species into a region of the bottom of the contact trench that is free of alternating layers of Si and oxygen-doped Si, and annealing the Si substrate to activate the implanted dopant species.
Separately or in combination, the method may further comprise, prior to filling the contact trench with the conductive material, etching back an insulating layer formed on the front main surface of the Si substrate such that the insulating layer has an opening aligned with the contact trench and wider than a combined width of the contact trench and the diffusion barrier structure.
Filling the contact trench with a conductive material may include, alone or in combination: a conductive material is deposited in the contact trench and in the opening formed in the insulating layer such that the conductive material extends onto the front major surface of the Si substrate beyond the diffusion barrier structure and in a direction towards the gate trench.
Forming the diffusion barrier structure may comprise, either alone or in combination, epitaxially growing alternating layers of Si and oxygen-doped Si on the sidewalls and bottom of the contact trench prior to forming the body and source regions.
Separately or in combination, the method may further comprise epitaxially growing a blanket layer of Si on the alternating layers of Si and oxygen-doped Si prior to forming the body and source regions.
Separately or in combination, the method may further include removing the alternating layers of Si and oxygen-doped Si from at least a portion of the bottom of the contact trench.
Removing the alternating layers of Si and oxygen-doped Si from at least a portion of the bottom of the contact trench, alone or in combination, may include: epitaxially growing a Si cap layer on the alternating layers of Si and oxygen-doped Si; depositing a conformal spacer oxide on the Si cap layer; anisotropically etching the conformal spacer oxide to expose the diffusion barrier structure at the bottom of the contact trench; etching away the exposed diffusion barrier structure at the bottom of the contact trench; and removing the conformal spacer oxide after etching away the exposed diffusion barrier structure at the bottom of the contact trench.
Separately or in combination, forming the diffusion barrier structure may include: forming a sacrificial insulating layer at the bottom of the contact trench before forming the body region and the source region; after forming the sacrificial insulating layer, epitaxially growing alternating layers of Si and oxygen-doped Si on sidewalls of the contact trench; after epitaxially growing alternating layers of Si and oxygen-doped Si, the sacrificial insulating layer is removed from the bottom of the contact trench.
Individually or in combination, the method may further comprise: filling the contact trench with a sacrificial plug material after forming the diffusion barrier structure and before forming the source and body regions; forming a source region and a body region in the Si substrate after filling the contact trench with a sacrificial plug material; removing the sacrificial plug material after forming the source region and the body region; implanting dopant species into the bottom of the contact trench after removing the sacrificial plug material and before filling the contact trench with a conductive material; and annealing the Si substrate to activate the implanted dopant species to form a highly doped body contact region.
Those skilled in the art will recognize additional features and advantages upon reading the following detailed description, and upon viewing the accompanying drawings.
Drawings
The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts. Features of the various illustrated embodiments may be combined unless they are mutually exclusive. Embodiments are depicted in the drawings and are detailed in the following description.
Fig. 1 illustrates a partial cross-sectional view of an embodiment of a trench-based semiconductor device having a diffusion barrier structure.
Fig. 2A to 2F illustrate respective cross-sectional views of the trench-based semiconductor device shown in fig. 1 during different stages of the fabrication process.
Fig. 3 illustrates a partial cross-sectional view of another embodiment of a trench-based semiconductor device having a diffusion barrier structure.
Fig. 4 illustrates a partial cross-sectional view of another embodiment of a trench-based semiconductor device having a diffusion barrier structure.
Fig. 5A to 5D illustrate respective cross-sectional views of embodiments omitting the diffusion barrier structure from at least a portion of the bottom of the contact trench.
Fig. 6A-6L illustrate respective partial cross-sectional views of a trench-based semiconductor device during different stages of the fabrication process, wherein a diffusion barrier structure is formed prior to the body and source regions of the device.
Detailed Description
Embodiments described herein control lateral out-diffusion of source/body contact doping of trench-based transistors, allowing narrower Vth, RonA, and DIBL distributions for given geometrical variations of highly doped source/body contacts and gate trenches, and/or allowing lateral spacing between the source/body contacts and the channel region of the device to be reduced for given Vth, RonA, and DIBL windows. Lateral out-diffusion of source/body contact doping is better controlled by interposing a diffusion barrier structure comprising alternating layers of Si and oxygen doped Si between the highly doped source/body contact and the channel region of the device. The oxygen-doped Si layer of the diffusion barrier structure limits lateral out-diffusion of the source/body contact doping, thereby controlling the lateral out-diffusion of the source/body contact doping in a direction towards the channel region. The diffusion barrier structure enables a narrower Vth distribution of, for example, a narrow trench MOSFET, or enables a smaller distance between the contact trench and the gate trench for a predetermined Vth distribution width. Embodiments of a semiconductor device having such a diffusion barrier structure, and corresponding manufacturing methods, are described in more detail below.
Fig. 1 illustrates a partial cross-sectional view of an embodiment of a trench-based
The trench-based
The trench-based
The highly doped
In either case, the
Fig. 1 provides an exploded view of the
The oxygen-doped
Fig. 2A-2F illustrate respective cross-sectional views of the trench-based
Fig. 2A shows
Fig. 2B shows the
Fig. 2C shows
Fig. 2D shows the
Fig. 2E shows the
Fig. 2F shows the device after filling the
Fig. 3 illustrates a partial cross-sectional view of another embodiment of a trench-based
Fig. 4 illustrates a partial cross-sectional view of another embodiment of a trench-based
Fig. 5A-5D illustrate respective cross-sectional views of another embodiment omitting the
Fig. 5A shows the
Fig. 5B shows the
Fig. 5C shows the
Fig. 5D shows the
Fig. 6A-6L illustrate respective partial cross-sectional views of a trench-based
Fig. 6A shows the
Fig. 6B shows the
Fig. 6C shows
Fig. 6D shows an alternative embodiment in which the
In one embodiment, a sacrificial insulating layer 602 is formed at the bottom of the
In another embodiment, alternating layers of Si134 and oxygen-doped Si136 may be grown on the sidewalls and bottom of the
Fig. 6E-6L illustrate portions of the
Fig. 6E shows the
Fig. 6F shows the
Fig. 6G shows
Fig. 6H shows the
Fig. 6I shows the
Fig. 6J illustrates the
Fig. 6K shows the
Fig. 6L shows the
Spatially relative terms, such as "below," "lower," "over," "upper," and the like, are used for ease of description to explain the positioning of one element relative to a second element. These terms are intended to encompass different orientations of the device in addition to different orientations than those depicted in the figures. Furthermore, terms such as "first," "second," and the like, are also used to describe various elements, regions, sections, etc., and are also not intended to be limiting. Like terms refer to like elements throughout the specification.
As used herein, the terms "having," "containing," "including," "comprising," and the like are open-ended terms that indicate the presence of stated elements or features, but do not preclude additional elements or features. The articles "a," "an," and "the" are intended to include the plural as well as the singular, unless the context clearly indicates otherwise.
With the above range of variations and applications in mind, it should be understood that the present invention is not limited by the foregoing description, nor is it limited by the accompanying drawings. Instead, the present invention is limited only by the following claims and their legal equivalents.
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