阅读说明：本技术 一种集成电路封装外壳 (Integrated circuit packaging shell ) 是由 黄晓波 于 2020-12-22 设计创作，主要内容包括：本发明涉及一种集成电路封装外壳,包括底座、卡接结构；卡接结构设置在底座内；卡接结构包括两组卡板、两组连接杆、同步连接组件；两组卡板的中部分别通过转轴一转动连接在底座内,且卡板向上推动时能够卡主集成电路芯片的两端；卡板的下端与连接杆的一端通过转轴二进行转动连接；连接杆远离卡板的一端通过转轴三转动连接在同步连接组件上；同步连接组件上设置有滑动块,通过向上推动滑动块,带动连接杆推动卡板运动,卡板通过转轴一转动连接在底座上,卡板运动时沿着转轴一转动,实现对集成电路芯片的卡接。(The invention relates to an integrated circuit packaging shell, which comprises a base and a clamping structure, wherein the base is provided with a clamping structure; the clamping structure is arranged in the base; the clamping structure comprises two groups of clamping plates, two groups of connecting rods and a synchronous connecting assembly; the middle parts of the two groups of clamping plates are respectively connected in the base in a rotating way through a rotating shaft, and the two ends of the main integrated circuit chip can be clamped when the clamping plates are pushed upwards; the lower end of the clamping plate is rotatably connected with one end of the connecting rod through a second rotating shaft; one end of the connecting rod, which is far away from the clamping plate, is rotatably connected to the synchronous connecting assembly through a rotating shaft III; be provided with the sliding block on the synchronous connection subassembly, through upwards promoting the sliding block, drive the connecting rod and promote the cardboard motion, the cardboard rotates through a pivot and connects on the base, rotates along a pivot during the cardboard motion, realizes the joint to integrated circuit chip.)

1. An integrated circuit package housing, comprising:

comprises a base (1) and a clamping structure (3);

the clamping structure (3) is arranged in the base (1);

the clamping structure (3) comprises two groups of clamping plates (31), two groups of connecting rods (34) and a synchronous connecting assembly (36);

the middle parts of the two groups of clamping plates (31) are respectively and rotatably connected in the base (1) through a first rotating shaft (32), and the clamping plates (31) can clamp two ends of the main integrated circuit chip (4) when being pushed upwards;

the lower end of the clamping plate (31) is rotatably connected with one end of the connecting rod (34) through a second rotating shaft (33);

one end of the connecting rod (34) far away from the clamping plate is rotatably connected to the synchronous connecting component (36) through a rotating shaft III (35);

the connecting rod (34) can be pushed through the synchronous connecting component (36) so as to drive the clamping plate (31) to clamp the integrated circuit chip (4).

2. An integrated circuit package housing in accordance with claim 1, wherein:

a movable frame (12) is arranged on the front end surface of the base (1);

the synchronous connecting component (36) comprises a synchronous connecting block (361) and a sliding block (362);

the synchronous connecting block (361) is rotationally connected with a connecting rod (34) through a rotating shaft III (35);

the sliding block (362) is fixed on the front face of the synchronous connecting block (361), the sliding block (361) extends and penetrates through the movable frame (12), and the sliding block (362) slides up and down in the movable frame (12) to drive the clamping structure (3) to move.

3. An integrated circuit package housing in accordance with claim 1, wherein:

the housing comprises an upper cover plate (2) for encapsulating an integrated circuit chip (4);

the upper cover plate (2) is divided into a left cover plate (21) and a right cover plate (22);

left side apron (21) and right side apron (22) splice each other, and the middle part of left side apron (21) and right side apron (22) forms and holds the chamber, holds the chamber and is used for holding integrated circuit chip (4).

4. An integrated circuit package housing as recited in claim 3, wherein:

the left end and the right end of the base (1) are fixed with connecting blocks (14);

the upper cover plate (2) is provided with a connecting groove (24) matched with the connecting block (14) at a position corresponding to the connecting block (14);

the upper cover plate (2) is positioned by matching the connecting block (14) and the connecting groove (24).

5. An integrated circuit package housing in accordance with claim 4, wherein:

the connecting block (14) is arranged in an inverted triangle structure, and the connecting groove (24) is completely matched with the connecting block (14);

with left side apron (21) and right side apron (22) through connecting groove (24) joint on connecting block (14), can realize left side apron (21) and right side apron (22) for the injecing of base (1) position.

6. An integrated circuit package housing as recited in claim 3, wherein:

the left end and the right end of the base (1) are respectively provided with a movable groove (13);

guide rails (26) are arranged at the positions of the left cover plate (21) and the right cover plate (22) corresponding to the movable grooves (13);

the left cover plate (21) slides rightwards from the left side of the base (1) through the guide rail (26);

the right cover plate (22) slides leftwards from the right side of the base (1) through a guide rail (26);

when the left cover plate (21) and the right cover plate (22) slide to the final positions, the left cover plate (21) and the right cover plate (22) are spliced.

7. An integrated circuit package housing as recited in claim 3, wherein:

the upper cover plate (2) is provided with a buckling mechanism (23);

the buckling mechanism (23) is divided into a locking hook (231) and a locking buckle (232);

the lock hook (231) is fixed at the right end of the left cover plate (21);

the lock catch (232) is fixed at the left end of the right cover plate (22);

through the cooperation of latch hook (231) and hasp (232), realize the concatenation to left side apron (21) and right side apron (22), ensure the stability of upper cover plate (2).

8. An integrated circuit package housing as recited in claim 3, wherein:

the upper end of the inner side of the upper cover plate (2) is embedded with a heat conducting fin (25);

the heat conducting fins (25) are directly exposed in the accommodating cavity, and the heat conducting fins (25) are positioned at the left side and the right side of the upper cover plate (2) and are exposed in the air.

9. An integrated circuit package housing in accordance with claim 8, wherein:

the heat conducting fins (25) are respectively arranged at the upper ends of the left cover plate (21) and the right cover plate (22), and bosses (251) are arranged at the positions of the heat conducting fins (25) relative to the clamping plate (31);

the boss (251) is of an inverted trapezoidal structure, and the clamping plate (31) can be pressed through the boss (251), so that the clamping stability of the integrated circuit chip (4) is ensured.

10. An integrated circuit package housing in accordance with claim 1, wherein:

the lower end of the synchronous connecting component (36) is provided with an elastic structure;

one end of the elastic structure is fixed at the lower end of the synchronous connecting component (36), and the other end of the elastic structure is fixed at the lower end face inside the base (1).

Technical Field

The invention relates to an integrated circuit packaging shell, and belongs to the technical field of integrated circuit packaging.

Background

The integrated circuit package mainly plays a role in protecting the chip from the outside air. Most of the existing integrated circuit packaging shells are integrated, and after the integrated circuit chips are packaged, the whole components cannot be disassembled, and the integrated circuit chips cannot be replaced. To this end, a more versatile integrated circuit chip package has been developed.

Disclosure of Invention

The invention relates to an integrated circuit packaging shell, which comprises a base and a clamping structure, wherein the base is provided with a clamping structure; the clamping structure is arranged in the base; the clamping structure comprises two groups of clamping plates, two groups of connecting rods and a synchronous connecting assembly; the middle parts of the two groups of clamping plates are respectively connected in the base in a rotating way through a rotating shaft, and the two ends of the main integrated circuit chip can be clamped when the clamping plates are pushed upwards; the lower end of the clamping plate is rotatably connected with one end of the connecting rod through a second rotating shaft; one end of the connecting rod, which is far away from the clamping plate, is rotatably connected to the synchronous connecting assembly through a rotating shaft III; thereby can promote the connecting rod through synchronous connection subassembly and drive the cardboard and with integrated circuit chip card owner.

A movable frame is arranged on the front end surface of the base; the synchronous connecting component comprises a synchronous connecting block and a sliding block; the synchronous connecting block is rotatably connected with a connecting rod through a rotating shaft III; the sliding block is fixed in the front of synchronous connection piece, and the sliding block extends and passes the movable frame, slides from top to bottom in the movable frame through the sliding block, drives the motion of joint structure.

The shell comprises an upper cover plate used for packaging the integrated circuit chip; the upper cover plate is divided into a left cover plate and a right cover plate; the left cover plate and the right cover plate are mutually spliced, a containing cavity is formed in the middle of the left cover plate and the right cover plate, and the containing cavity is used for containing an integrated circuit chip.

The left end and the right end of the base are fixedly provided with connecting blocks; the upper cover plate is provided with a connecting groove matched with the connecting block at a position corresponding to the connecting block; through the matching of connecting block and spread groove, realize the location to the upper cover plate.

The connecting blocks are arranged in an inverted triangle structure, and the connecting grooves are completely matched with the connecting blocks; pass through the spread groove joint with left side apron and right side apron on the connecting block, can realize that left side apron and right side apron are for the injecing of base position.

The left end and the right end of the base are respectively provided with a movable groove; guide rails are arranged at the positions of the left cover plate and the right cover plate corresponding to the movable grooves; the left cover plate slides rightwards from the left side of the base through the guide rail; the right cover plate slides leftwards from the right side of the base through the guide rail; when the left cover plate and the right cover plate slide to the final positions, the left cover plate and the right cover plate are spliced.

The upper cover plate is provided with a buckling mechanism; the buckling mechanism is divided into a locking hook and a lock catch; the latch hook is fixed at the right end of the left cover plate; the lock catch is fixed at the left end of the right cover plate; through the cooperation of latch hook and hasp, realize the concatenation to left side apron and right side apron, ensure the stability of upper cover plate.

The upper end of the inner side of the upper cover plate is embedded with a heat conducting sheet; the heat conducting fin is directly exposed in the accommodating cavity, and the heat conducting fin is positioned at the left side and the right side of the upper cover plate and is exposed in the air.

The heat conducting fins are respectively arranged at the upper ends of the left cover plate and the right cover plate, and bosses are arranged at the positions of the heat conducting fins relative to the clamping plate; the boss is inverted trapezoid structure, and the clamping plate can be pressed through the boss, so that the clamping stability of the integrated circuit chip is ensured.

The lower end of the synchronous connecting component is provided with an elastic structure; one end of the elastic structure is fixed at the lower end of the synchronous connection assembly, and the other end of the elastic structure is fixed at the lower end face inside the base.

The invention has the beneficial effects that:

1. the clamping structure is arranged, the sliding block is pushed upwards to drive the connecting rod to push the clamping plate to move, the clamping plate is rotatably connected to the base through one rotating shaft, and the clamping plate rotates along the one rotating shaft when moving, so that the integrated circuit chip is clamped.

2. Be provided with the upper cover plate, the upper cover plate divide into left side apron and right side apron, be provided with connecting block and activity groove on the base, be provided with guided way and spread groove on left side apron and the right side apron respectively, through the matching of guided way and activity groove, ensure the accuracy that left side apron and right side apron promoted the position, the setting of the structure of falling the triangle of connecting block simultaneously, through the matching of connecting block and spread groove, realize the fixed of the relative base position of left side apron and right side apron, ensure the stability of left side apron and right side apron assembly. In addition, the left cover plate and the right cover plate are buckled with each other through the buckling mechanism, the overall stability of the upper cover plate is ensured, and the effect of sealing and packaging the integrated circuit chip is improved.

3. Be provided with the conducting strip in left side apron and the right side apron respectively, the optional pottery conducting strip of conducting strip, the conducting strip directly exposes and holds the intracavity, can conveniently absorb the heat that the integrated circuit chip during operation produced to expose the position in the air through the conducting strip, with the heat effluvium.

4. The position that the conducting strip is close to the cardboard is provided with the boss, and after using the cardboard to integrated circuit chip pretension, through promoting left side apron and right side apron, the boss continues to push down the cardboard, ensures the stability of cardboard to integrated circuit chip joint.

5. The elastic component connected with the lower end of the inner side of the base is fixed at the lower end of the synchronous connection component, and when the left cover plate and the right cover plate are opened, the elastic component rebounds to drive the synchronous connection component to move downwards, so that the clamping plate is loosened to facilitate the replacement of the integrated circuit chip.

Drawings

FIG. 1 is a block diagram of a package housing of the present invention;

FIG. 2 is a side view of the package housing of the present invention;

FIG. 3 is a view of the base structure of the present invention;

FIG. 4 is a cross-sectional view of a base of the present invention;

FIG. 5 is a block diagram of a synchronization connection assembly;

FIG. 6 is a schematic view of the left cover plate of the present invention;

FIG. 7 is a view of the right cover plate of the present invention;

FIG. 8 is a cross-sectional view of the left cover plate of the present invention.

In the figure: 1. a base; 11. a stitch; 12. a movable frame; 13. a movable groove; 14. connecting blocks; 2. an upper cover plate; 21. a left cover plate; 22. a right cover plate; 23. a fastening mechanism; 231. a latch hook; 232. locking; 24. connecting grooves; 25. a heat conductive sheet; 251. a boss; 26. a guide rail; 3. a clamping structure; 31. clamping a plate; 32. a first rotating shaft; 33. a second rotating shaft; 34. a connecting rod; 35. a rotating shaft III; 36. a synchronization connection assembly; 361. a synchronous connecting block; 362. a slider; 4. an integrated circuit chip.

Detailed Description

The invention provides an integrated circuit packaging shell, which comprises a base 1 and a clamping structure 3; the clamping structure 3 is arranged in the base 1; the clamping structure 3 comprises two groups of clamping plates 31, two groups of connecting rods 34 and a synchronous connecting assembly 36; the middle parts of the two groups of clamping plates 31 are respectively and rotatably connected in the base 1 through a first rotating shaft 32, and the two ends of the main integrated circuit chip 4 can be clamped when the clamping plates 31 are pushed upwards; the lower end of the clamping plate 31 is rotatably connected with one end of a connecting rod 34 through a second rotating shaft 33; one end of the connecting rod 34 far away from the clamping plate is rotatably connected to the synchronous connecting component 36 through a third rotating shaft 35; the connecting bar 34 can be pushed by the synchronizing connection assembly 36 to bring the card board 31 to clamp the integrated circuit chip 4.

A movable frame 12 is arranged on the front end surface of the base 1; the synchronization connection assembly 36 includes a synchronization link 361 and a slider 362; the synchronous connecting block 361 is rotatably connected with a connecting rod 34 through a third rotating shaft 35; the sliding block 362 is fixed on the front surface of the synchronous connecting block 361, and the sliding block 361 extends and passes through the movable frame 12, and the sliding block 362 slides up and down in the movable frame 12 to drive the clamping structure 3 to move.

The housing includes an upper cover plate 2 for enclosing an integrated circuit chip 4; the upper cover plate 2 is divided into a left cover plate 21 and a right cover plate 22; left side apron 21 and right side apron 22 splice each other, and the middle part of left side apron 21 and right side apron 22 forms and holds the chamber, holds the chamber and is used for holding integrated circuit chip 4.

The left end and the right end of the base 1 are fixed with connecting blocks 14; the upper cover plate 2 is provided with a connecting groove 24 matched with the connecting block 14 at a position corresponding to the connecting block 14; the positioning of the upper cover plate 2 is achieved by the matching of the connecting block 14 and the connecting groove 24.

The connecting block 14 is arranged in an inverted triangle structure, and the connecting groove 24 is completely matched with the connecting block 14; the left cover plate 21 and the right cover plate 22 are clamped on the connecting block 14 through the connecting groove 24, and the position of the left cover plate 21 and the position of the right cover plate 22 relative to the base 1 can be limited.

The left end and the right end of the base 1 are respectively provided with a movable groove 13; the left cover plate 21 and the right cover plate 22 are provided with guide rails 26 corresponding to the positions of the movable grooves 13; the left cover plate 21 slides rightwards from the left side of the base 1 through the guide rail 26; the right cover plate 22 slides leftwards from the right side of the base 1 through the guide rail 26; when the left cover plate 21 and the right cover plate 22 slide to the final positions, the left cover plate 21 and the right cover plate 22 are spliced.

The upper cover plate 2 is provided with a buckling mechanism 23; the fastening mechanism 23 is divided into a lock hook 231 and a lock catch 232; the latch hook 231 is fixed at the right end of the left cover plate 21; the latch 232 is fixed at the left end of the right cover plate 22; through the cooperation of latch hook 231 and hasp 232, realize the concatenation to left side apron 21 and right side apron 22, ensure the stability of upper cover plate 2.

The upper end of the inner side of the upper cover plate 2 is embedded with a heat conducting fin 25; the thermally conductive sheet 25 is directly exposed in the accommodation chamber.

The heat conducting fins 25 are respectively arranged at the upper ends of the left cover plate 21 and the right cover plate 22, and bosses 251 are arranged at the positions of the heat conducting fins 25 relative to the clamping plate 31; the boss 251 is of an inverted trapezoidal structure, and the clamping plate 31 can be pressed through the boss 251, so that the clamping stability of the integrated circuit chip 4 is ensured.

The lower end of the synchronous connecting component 36 is provided with an elastic structure; one end of the elastic structure is fixed at the lower end of the synchronous connection component 36, and the other end of the elastic structure is fixed at the inner lower end face of the base 1.

The base 1 is provided with pins 11, and the integrated circuit chip 4 is conducted with the pins 11 after being packaged.

During the use, draw out left side apron 21 and right side apron 22 earlier, place integrated circuit chip 4 on base 1, upwards promote sliding block 362, drive cardboard 31 through connecting rod 34 and rotate along a pivot 32, realize the joint to integrated circuit chip 4. Assemble left side apron 21 and right side apron 22, through the matching of movable groove 13 and guided way 26, ensure the accuracy of left side apron 21 and right side apron 22 mounted position, through the inverted triangle structure of connecting block 14, spread groove 24 sliding connection is on connecting block 14, realizes the joint to left side apron 21 and right side apron 22, and through latch mechanism 23, the concatenation of realization left side apron 21 and right side apron 22 guarantees the stability of 2 concatenations of upper cover plate simultaneously.

When promoting left side apron 21 and right side apron 22, the boss 251 that sets up on the conducting strip 25 can be towards cardboard 31 motion, and boss 251 becomes the structure of falling trapezium, can slow promotion and compress tightly cardboard 31, ensures the stability of integrated circuit chip 4 joint.

When integrated circuit chip 4 was dismantled to needs, released left side apron 21 and right side apron 22, cardboard 31 had lost compressing tightly of boss 251, through the fixed elastic component of synchronous connection subassembly 36 lower extreme this moment, can drive synchronous connection subassembly 36 downstream to drive cardboard 31 and release, the convenient change to integrated circuit chip 4.