阅读说明：本技术 一种电子产品用高强不锈钢粉末及制备工艺 (High-strength stainless steel powder for electronic products and preparation process ) 是由 罗海文 于 2020-05-21 设计创作，主要内容包括：一种电子产品用高强不锈钢粉末及制备工艺,属于消费电子产品所用粉末冶金材料制备领域。成分重量百分比为:C:≤0.2％；Cr:11.0-13.5％；Co:11-14％；Mo:5-7.5％；(Cu+Ni)≤3.5％；V:0.1-0.5％；W:0-2％,余量为Fe及不可避免的杂质。经熔炼工艺制备母合金,经制粉、粉末烧结后,进行固溶处理→深冷处理→时效处理；热处理后的粉末烧结材料,其屈服强度≥1500MPa,延伸率≥4％。本发明不含有易氧化的强化元素Ti、Al等,通过W、Mo、Co、Cu等元素的强化,成分设计可以避免铁素体和过多奥氏体相的形成,得到的高强不锈钢金属粉末除了可用于消费电子产品领域,也可应用于激光打印用复杂精密零件的粉末耗材,也可推广至医疗、海工等相关领域,具有广阔的市场前景。(A high-strength stainless steel powder for electronic products and a preparation process thereof belong to the field of preparation of powder metallurgy materials used for consumer electronic products. The weight percentage of the components is that C is less than or equal to 0.2 percent; 11.0 to 13.5 percent of Cr; 11-14% of Co; 5 to 7.5 percent of Mo; (Cu + Ni) is less than or equal to 3.5 percent; 0.1 to 0.5 percent of V; 0-2% of W, and the balance of Fe and inevitable impurities. Preparing a master alloy by a smelting process, and carrying out solution treatment → cryogenic treatment → aging treatment after milling and powder sintering; the yield strength of the powder sintered material after heat treatment is more than or equal to 1500MPa, and the elongation is more than or equal to 4 percent. The high-strength stainless steel powder does not contain easily-oxidized strengthening elements such as Ti, Al and the like, ferrite and excessive austenite phases can be prevented from being formed through the component design through the strengthening of W, Mo, Co, Cu and the like, and the obtained high-strength stainless steel metal powder can be used in the field of consumer electronics products, can also be applied to powder consumables of complex precision parts for laser printing, can also be popularized to related fields such as medical treatment and maritime work, and has wide market prospects.)

1. The high-strength stainless steel powder for electronic products is characterized by comprising the following chemical components in percentage by weight, wherein the chemical components do not contain easily-oxidizable elements Al and Ti:

c is less than or equal to 0.2 percent; 11.0 to 13.5 percent of Cr; 11-14% of Co; 5 to 7.5 percent of Mo; (Cu + Ni) is less than or equal to 3.5 percent; 0.1 to 0.5 percent of V; 0-2% of W, and the balance of Fe and inevitable impurities.

2. The high-strength stainless steel powder for electronic products according to claim 1, comprising the following components in the ranges: 0.05 to 0.15 percent of C; 11.0 to 13.5 percent of Cr; (Cu + Ni) is less than or equal to 3.5 percent; 12-14% of Co; 5 to 7.5 percent of Mo; 0.1 to 0.5 percent of V; 0-2% of W; wherein the total content of S, P, O, N impurity elements is not more than 0.2%.

3. A process for preparing a high-strength stainless steel powder for electronic products according to claim 2, characterized in that:

(1) preparing a master alloy by a smelting process, wherein the master alloy comprises the following components in percentage by weight:

0.05 to 0.2 percent of C; 11.0 to 13.5 percent of Cr; 0 to 3.5 percent of Cu; 0 to 3.5 percent of Ni; (Cu + Ni) is less than or equal to 3.5 percent; 12-14% of Co; 5 to 7.5 percent of Mo; 0.1 to 0.5 percent of V; 0-2% of W; wherein S, P, O, N the total content of impurity elements is not more than 0.05%, wherein when the percentage of (Cu + Ni) reaches the upper limit of the range, the carbon content is in the lower limit of the range; the balance of Fe and inevitable impurities, and easily-oxidizable elements Al and Ti are not added; after smelting, casting into ingots or directly milling;

(2) and (3) preparing powder, namely melting the master alloy, and then carrying out gas atomization to prepare powder under an inert atmosphere, wherein the average components of the obtained powder are as follows: 0.05 to 0.15 percent of C; 11.0 to 13.5 percent of Cr; 12-14% of Co; 5 to 7.5 percent of Mo; (Cu + Ni) is less than or equal to 3.5 percent; 0.1 to 0.5 percent of V; 0-2% of W, and the balance of Fe and inevitable impurities, wherein the total amount of S, P, O, N impurity elements is not more than 0.05%;

(3) powder sintering, namely distributing the obtained powder according to the shape of a device according to the conventional standard, compacting, forming and sintering under the protection of inert atmosphere;

(4) the heat treatment process comprises the following steps: after the powder is sintered, carrying out solid solution treatment → cryogenic treatment → aging treatment;

(5) the yield strength of the powder sintered material subjected to the heat treatment is more than or equal to 1500MPa, and the elongation is more than or equal to 4%.

4. The process according to claim 3, wherein the sintering step (3) is carried out at 1200-1400 ℃ for 60 seconds to 10 hours.

5. The process for preparing a high-strength stainless steel powder for electronic products according to claim 3, wherein the solution treatment in the step (4) is performed by keeping the temperature at 1050 to 1150 ℃ for 2 seconds to 5 hours.

6. The process for preparing a high-strength stainless steel powder for electronic products according to claim 3, wherein said cryogenic treatment in step (4) is carried out at a temperature of ≦ 60 ℃ for 2 seconds to 10 hours.

7. The process for preparing a high-strength stainless steel powder for electronic products according to claim 3, wherein the aging treatment in the step (4) is performed by keeping the temperature at 500 to 650 ℃ for 10 seconds to 10 hours.

Technical Field

The invention relates to the field of preparation of powder metallurgy materials used for consumer electronics products, in particular to a high-strength stainless steel powder metallurgy material and a preparation method thereof.

Background

The traditional application field of stainless steel is petrochemical industry, national defense industry, marine apparatus and other aspects, but with the continuous upgrading and upgrading of communication electronic consumer products such as mobile phones, intelligent wristwatches and the like in recent years, parts directly sintered by stainless steel powder are more and more widely applied, and higher requirements are provided for the performance of the powder sintered material. On the one hand, the materials are required to still have sufficient corrosion resistance due to contact with human sweat; on the other hand, the strength requirement on the structural part of the electronic product is higher and higher, so that the internal precise electronic circuit can be protected without fracture and significant deformation under the conditions of bearing bending, impact, falling impact and the like. The current novel consumer electronic products require that the yield strength of the stainless steel powder is more than 1500MPa and the elongation is more than 4% after the stainless steel powder is sintered and formed, and simultaneously require that the stainless steel powder has good sintering manufacturability, namely does not contain easily-oxidizable elements such as Al and Ti, and the like, because the easily-oxidizable elements are easily oxidized during atomization powder preparation and sintering, the plasticity and the toughness are rapidly deteriorated and the density is reduced.

High yield strength stainless steels for such electronic products can only be martensitic at present, and in particular, can be subdivided into martensitic chromium steels and martensitic chromium nickel aged stainless steels having high hardness and high strength.

(1) Martensitic chromium steel. The steel contains a certain amount of carbon in addition to chromium. The chromium content determines the corrosion resistance of the steel, the higher the carbon content the higher the strength, hardness and wear resistance. The method is mainly used for manufacturing tools, cutters and the like which have high requirements on strength and hardness but low requirements on corrosion resistance. Typical steel grades are 2Crl3, 4Crl3, 9Crl8, and the like. The martensitic stainless steel is added with higher carbon content due to the requirement of high yield strength, which results in that firstly the corrosion resistance is obviously reduced, and secondly the plasticity is also obviously deteriorated, and the plasticity generally can not meet the application requirements of the consumer electronic products.

(2) The maraging chromium-nickel stainless steel is prepared by adding more than 10 percent of chromium and a certain content of nickel on the basis of the ultra-low carbon maraging steel, not only maintains the good comprehensive performance of the maraging steel, but also improves the corrosion resistance, and is mainly used for aeronautical structural parts with obdurability. The steel contains 10-15% of chromium to ensure corrosion resistance, the content of nickel is 6-11% (or the content of cobalt is 10-20%), strengthening elements such as Mo, Ti, Cu and the like are added, and the typical components, strengthening phases and yield strength of the maraging steel are shown in Table 1. Therefore, the yield strength of the precipitation hardening stainless steel series (PH) strengthened by Cu precipitation can only reach about 1200 MPa; while others pass through NiAl and Ni₃The maximum yield strength of the maraging stainless steel with strength improved by Ti and other strengthening phases can reach 1500MPa, but the maraging stainless steel cannot meet the technological requirements of sintering due to the fact that the maraging stainless steel contains Al, Ti and other easily-oxidizable elements. Therefore, the development of a martensitic stainless steel master alloy and powder which do not contain easily-oxidizable elements, have yield strength of over 1500MPa and have certain ductility and toughness is urgently needed to meet the requirements of consumer electronics products.

TABLE 1 alloy compositions and strengthening phases for typical high-strength stainless steels

Disclosure of Invention

The invention aims to provide high-strength stainless steel powder for consumer electronic products and a preparation process thereof, wherein a stainless steel part with yield strength of more than 1500MPa and elongation of more than 4 percent for the consumer electronic products is manufactured by mother alloy smelting, powder making, sintering and matched heat treatment processes so as to fill the current market blank.

The high-strength stainless steel powder for electronic products is characterized by comprising the following chemical components in percentage by weight, wherein the chemical components do not contain easily-oxidizable elements Al and Ti:

c is less than or equal to 0.2 percent; 11.0 to 13.5 percent of Cr; 11-14% of Co; 5 to 7.5 percent of Mo; (Cu + Ni) is less than or equal to 3.5 percent; 0.1 to 0.5 percent of V; 0-2% of W, and the balance of Fe and inevitable impurities.

Further, the stainless steel powder has the following composition ranges: 0.05 to 0.15 percent of C; 11.0 to 13.5 percent of Cr; (Cu + Ni) is less than or equal to 3.5 percent; 12-14% of Co; 5 to 7.5 percent of Mo; 0.1 to 0.5 percent of V; 0-2% of W; wherein the total content of S, P, O, N impurity elements is not more than 0.2%.

Compared with the chemical components of the traditional high-strength martensitic stainless steel metal powder, the high-strength martensitic stainless steel powder disclosed by the invention contains common elements such as Cr, Ni and Cu, and also contains unconventional strengthening elements such as Co, Mo, W and V, and the low oxygen and nitrogen contents are required to be controlled to improve the ductility and toughness. Wherein the elements have the following functions:

c: the effect of C is complex, the strength can be improved through solid solution strengthening, and carbide precipitation strengthening can also be formed; however, excessive C content causes twinning martensite to decrease the plasticity and toughness of steel, deteriorating corrosion resistance, and the amount and stability of retained austenite are also related to the carbon content.

V, Mo, W, Cu: all the elements are strengthening elements, but the strengthening mechanisms are different, and the plasticity and the toughness are reduced while strengthening; the contents of V, Mo and W with the optimal strengthening and toughening effect are related to the contents of carbon and other alloy elements;

cr: plays a decisive role in the corrosion resistance of stainless steels, whereas the chromium content, which causes a sudden change in the corrosion resistance of the steel, is about 12%. An excessively high chromium content generates ferrite in the matrix, resulting in a decrease in corrosion resistance, deterioration in transverse toughness, and a decrease in strength; also, the Ms point of the steel is lowered, resulting in an increase in the content of the participating austenite, and thus the content of Cr is controlled to 10.0-13.0%.

Ni: ni can improve the toughness of steel and reduce the content of ferrite, but too much Ni content can cause too much residual austenite in a room temperature structure and influence the yield strength of the steel, and meanwhile, Ni and Cu are austenitizing elements and obviously enlarge an austenite phase region, so that the content of Ni and Cu needs to be comprehensively designed to avoid too much residual.

Oxygen and nitrogen are harmful gas elements in the metal powder, so that more hollow powder is formed, and the plasticity and toughness, particularly the low-temperature plasticity and toughness, of the later-stage part are obviously reduced.

The preparation process of the high-strength stainless steel powder for the electronic product is characterized by comprising the following steps of:

(1) preparing the master alloy by adopting a vacuum melting process, wherein the master alloy comprises the following components in percentage by weight:

0.05 to 0.2 percent of C; 11.0 to 13.5 percent of Cr; 0 to 3.5 percent of Cu; 0 to 3.5 percent of Ni; (Cu + Ni) is less than or equal to 3.5 percent; 12-14% of Co; 5 to 7.5 percent of Mo; 0.1 to 0.5 percent of V; 0-2% of W; the balance of Fe and inevitable impurities, wherein the total amount of S, P, O, N impurity elements is not more than 0.05%; when the percentage of (Cu + Ni)% reaches the upper limit of the range, the carbon content is in the lower limit of the range; easily-oxidizable elements such as Al and Ti are not added; after smelting, the mixture can be cast into ingots or directly made into powder;

(2) and (3) preparing powder, namely melting the master alloy, and then carrying out gas atomization on the melted master alloy in an inert atmosphere, wherein the average composition of the powder has the characteristics of claim 1.

(3) Powder sintering, namely distributing, compacting and molding the obtained powder according to the shape of a device according to the conventional standard, and sintering under the protection of inert atmosphere;

(4) the heat treatment process comprises the following steps: after the powder is sintered, carrying out solid solution treatment → cryogenic treatment → aging treatment;

(5) the yield strength of the powder sintered material subjected to the heat treatment is more than or equal to 1500MPa, and the elongation is more than or equal to 4%.

Further, the sintering in the step (3) is carried out at the temperature of 1200-1400 ℃ for 2 seconds to 10 hours.

Further, the solution treatment in the step (4) is carried out at 1050-1150 ℃ for 2 seconds-5 hours.

Further, the subzero treatment in the step (4) is carried out at the temperature of less than or equal to minus 60 ℃ for 2 seconds to 10 hours.

Further, the aging treatment in the step (4) is carried out at 500-600 ℃ for 10 seconds-10 hours.

Furthermore, the heat preservation time of each step of the heat treatment in the step (4) is related to the size of the sintered device, the smaller the size is, the shorter the heat preservation time is, and the larger the heat preservation time is, the larger the heat preservation time is; the cryogenic treatment temperature is related to the contents of C, Cu and Ni elements, and when the three elements are at the upper limit, the cryogenic temperature is lower.

Compared with the prior art, the invention has the advantages that the invention adopts the innovative alloy component system design, does not contain easily oxidized strengthening elements such as Ti, Al and the like, and can avoid the formation of ferrite and excessive austenite phases through the strengthening of W, Mo, Co, Cu and other elements, and after the sintering by the conventional process, the high yield strength is more than or equal to 1500MPa and the elongation is more than or equal to 4 percent can be obtained according to the heat treatment process of the invention.

The high-strength stainless steel metal powder can be used in the field of consumer electronics, can also be used as a powder consumable of complex precision parts for laser printing, can also be popularized to related fields such as medical treatment, maritime work and the like, and has wide market prospect.

Drawings

FIG. 1 shows a sintered article for tensile test.

Detailed Description