阅读说明：本技术 存储器器件以及制造存储器器件的方法 (Memory device and method of manufacturing memory device ) 是由 庄学理 江典蔚 刘国安 陈家庠 于 2019-06-28 设计创作，主要内容包括：在一些实施例中,本申请提供一种存储器器件。存储器器件包含芯片,芯片包含磁性随机存取存储器(MRAM)单元。至少部分地包围芯片的磁场屏蔽结构包含多层堆叠。多层堆叠包含磁性层和介电层。第一磁性区位于磁场屏蔽结构的内表面内部且第二磁性区直接位于磁场屏蔽结构的外表面外部。第一磁性区中的磁场小于第二磁性区中的磁场。(In some embodiments, the present application provides a memory device. The memory device includes a chip including Magnetic Random Access Memory (MRAM) cells. The magnetic field shielding structure at least partially surrounding the chip comprises a multilayer stack. The multi-layer stack includes a magnetic layer and a dielectric layer. The first magnetic region is located inside an inner surface of the magnetic field shielding structure and the second magnetic region is located directly outside an outer surface of the magnetic field shielding structure. The magnetic field in the first magnetic region is less than the magnetic field in the second magnetic region.)

1. A memory device, comprising:

a chip including magnetoresistive random access memory cells; and

a magnetic field shielding structure at least partially surrounding the chip and including a magnetic layer and a dielectric layer.

2. The memory device of claim 1, wherein the magnetic field shielding structure comprises a top region above an upper surface of the chip, a bottom region below a lower surface of the chip, a sidewall region extending between the top region and the bottom region, wherein electrical connections extend through the sidewall region and are coupled to the chip.

3. The memory device of claim 1, wherein the magnetic field shielding structure comprises:

a first multi-layer stack disposed at a first distance above an upper surface of the chip; and

a second multi-layer stack disposed at the first distance below a lower surface of the chip, wherein the second multi-layer stack is the same as the first multi-layer stack.

4. The memory device of claim 1, further comprising:

an insulating adhesive disposed over the magnetic layer and the dielectric layer;

wherein the magnetic layer is a continuous sheet of magnetic material disposed over the chip, the continuous sheet of magnetic material having a length and a width that are greater than a length and a width, respectively, of a top surface of the chip; and is

Wherein the dielectric layer is a continuous sheet of dielectric material disposed over the continuous sheet of magnetic material, the continuous sheet of dielectric material having a length and a width that are greater than the length and the width, respectively, of the top surface of the chip.

5. The memory device of claim 1, wherein the magnetic field shielding structure comprises:

a plurality of strips of magnetic material arranged in a plane above an upper surface of the chip, each strip of magnetic material having a length greater than a length of a top surface of the chip and having a width less than a width of the top surface of the chip; and

a plurality of strips of dielectric material arranged in the plane and separating the plurality of strips of magnetic material from each other, each of the strips of dielectric material having a length greater than the length of the top surface of the chip and a width less than a width of the top surface of the chip.

6. A memory device, comprising:

a chip including magnetoresistive random access memory cells, wherein the chip includes an upper face, a bottom face, and sidewalls extending between the upper face and the bottom face; and

a magnetic field shielding structure at least partially surrounding the chip, the magnetic field shielding structure comprising a multilayer stack comprised of magnetic layers and dielectric layers, wherein the magnetic field shielding structure comprises a top region above the upper face of the chip, a bottom region below the bottom face of the chip, and a sidewall region laterally surrounding the sidewall of the chip, wherein the sidewall region of the magnetic field shielding structure is present in an opening through which an electrical connector extends and couples to the chip, wherein a first magnetic region is located inside an inner surface of the magnetic field shielding structure and a second magnetic region is located directly outside an outer surface of the magnetic field shielding structure, a magnetic field in the first magnetic region being less than a magnetic field in the second magnetic region.

7. The memory device of claim 6, wherein a pair of layers comprises the magnetic layer disposed over the dielectric layer, the multilayer stack being comprised of one or more of the pair of layers disposed over the magnetic layer and an insulating adhesive, wherein a length and width of the magnetic layer is greater than a length and width of the upper face of the chip.

8. The memory device of claim 6, wherein a pair of layers includes the magnetic layer disposed laterally adjacent the dielectric layer, the multilayer stack being comprised of three or more of the pair of layers, wherein a length of the magnetic layer is greater than a length of the upper face of the chip, wherein a width of the magnetic layer is less than a width of the upper face of the chip, wherein a length and a width of the multilayer stack are greater than the length and a width of the upper face of the chip.

9. The memory device of claim 6, wherein the multi-layer stack is comprised of a plurality of rectangles of the magnetic layer, each of the plurality of rectangles separated by the dielectric layer, wherein a length and width of the multi-layer stack is greater than a length and width of the upper face of the chip.

10. A method of manufacturing a memory device, comprising:

forming one or more multi-layer stacks, wherein the multi-layer stacks comprise a magnetic layer and a dielectric layer;

forming one or more magnetic layers;

tailoring the one or more multilayer stacks and the one or more magnetic layers to conform to dimensions of a package structure, wherein the package structure comprises a chip including magnetoresistive random access memory cells and an insulating material encapsulating the chip, wherein an outer surface of the package structure comprises the insulating material; and

adhering the cut one or more multilayer stacks and the cut one or more magnetic layers to the outer surface of the package structure.

Technical Field

Embodiments of the present invention relate to a memory device, and more particularly, to a memory device and a method of manufacturing the memory device.

Background

Many modern electronic devices contain electronic memory, such as a hard disk drive or Random Access Memory (RAM). The electronic memory may be volatile memory or non-volatile memory. Non-volatile memories are capable of retaining their stored data without power being applied, while volatile memories lose their data memory contents when power is removed. Magnetic Tunnel Junctions (MTJs) may be used in hard disk drives and/or Magnetic RAM (MRAM) and are therefore promising candidates for new generation memory solutions.

Disclosure of Invention

In some embodiments, the present application provides a memory device comprising: a chip including Magnetoresistive Random Access Memory (MRAM) cells; and a magnetic field shielding structure at least partially surrounding the chip and including a magnetic layer and a dielectric layer.

In some embodiments, the present application provides a memory device comprising: a chip including Magnetoresistive Random Access Memory (MRAM) cells, the chip including an upper face, a bottom face, and sidewalls extending between the upper face and the bottom face; a magnetic field shielding structure at least partially surrounding the chip, comprising a multilayer stack of magnetic layers and dielectric layers, the magnetic field shielding structure comprising a top region above an upper face of the chip, a bottom region below a bottom face of the chip, and a sidewall region laterally surrounding a sidewall of the chip, wherein the sidewall region of the magnetic field shielding structure is present in an opening through which an electrical connection extends and is coupled to the chip, wherein a first magnetic region is located inside an inner surface of the magnetic field shielding structure and a second magnetic region is located directly outside an outer surface of the magnetic field shielding structure, a magnetic field in the first magnetic region being smaller than a magnetic field in the second magnetic region.

In some embodiments, the present application provides a method of manufacturing a memory device, the method comprising: forming one or more multi-layer stacks, wherein the multi-layer stacks comprise a magnetic layer and a dielectric layer; forming one or more magnetic layers; tailoring the one or more multilayer stacks and the one or more magnetic layers to conform to dimensions of a package structure, wherein the package structure comprises a chip comprising magnetoresistive random access memory cells and an insulating material encapsulating the chip, wherein an outer surface of the package structure comprises the insulating material; and adhering the cut one or more multi-layer stacks and the cut one or more magnetic layers to an outer surface of the package structure.

Drawings

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that, according to standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

Fig. 1A, 1B, 1C show perspective views of some embodiments of memory devices including chips and using magnetic field shielding structures according to some embodiments, with front portions removed to more clearly depict internal portions of the memory devices, and fig. 1D shows perspective views of the chips of fig. 1A, 1B, 1C with front portions removed to more clearly depict internal portions of the chips.

Fig. 1E illustrates a perspective view of some embodiments of a packaged memory device including a chip and using a magnetic field shielding structure, with front portions removed to more clearly depict interior portions of the packaged memory device, in accordance with some embodiments.

Fig. 2A-2C depict top views of fig. 1A-1C, respectively, of a memory device including a magnetic field shielding structure in accordance with some embodiments.

Fig. 2D-2F depict top views of some embodiments of fig. 1A-1C, respectively, including memory devices using magnetic field shielding structures according to some embodiments.

Fig. 3A-3C depict cross-sectional views of some embodiments of fig. 2D-2F, respectively, including a memory device using a magnetic field shielding structure, according to some embodiments.

Fig. 4A-4C depict cross-sectional views of some embodiments of fig. 2D-2F, respectively, including a memory device using a magnetic field shielding structure, according to some embodiments.

Fig. 5A-5C and 6A-6C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 7A-7C and 8A-8C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 9A-9C and 10A-10C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 11A-11C and 12A-12C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 13A-13C and 14A-14C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 15A-15C and 16A-16C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 17A-17C and 18A-18C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 19A-19C and 20A-20C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 21A-21C and 22A-22C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 23A-23C and 24A-24C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 25A-25C and 26A-26C depict cross-sectional views of some embodiments of fig. 3A-3C and 4A-4C, respectively, including a memory device using a magnetic field shielding structure according to some embodiments.

Fig. 27, 28A, 28B, 29, 30A, 30B, 31, 32A, and 32B illustrate perspective views of various embodiments of methods for forming a cross-section (section) of a magnetic field shielding structure.

Fig. 33, 34, 35A-35C, and 36A-36C illustrate cross-sectional views of various embodiments of methods for forming a magnetic field shielding structure around a chip.

Fig. 37 illustrates a block diagram of some embodiments of the methods of fig. 27, 28A, 28B, 29, 30A, 30B, 31, 32A, and 32B.

Fig. 38 illustrates a block diagram of some embodiments of the methods of fig. 33, 34, 35A-35C, and 36A-36C.

Description of the reference numerals

100 a: a memory device;

100b, 100c, 100d, 100 e: a perspective view;

101: a printed circuit board;

102: a magnetic layer;

103 a: a first multi-layer stack;

103 b: a second multi-layer stack;

103 c: a third multi-layer stack;

104: a dielectric layer;

105: a magnetic field shielding structure;

105 a: a vertical distance;

105 b: a horizontal distance;

105 c: an opening distance;

105d, W1, W2: a width;

106: a chip;

108: an electrical connection;

108 a: a conductive contact lead;

108 b: a conductive wire;

109: a semiconductor substrate;

110: a transistor;

111: an interconnect structure;

112: a magnetic random access memory cell;

120: an insulating structure;

121: a packaging structure;

122: a top region;

124: a sidewall region;

124 a: a top portion;

124 b: a bottom portion;

126: a bottom region;

200a, 200b, 200c, 200d, 200e, 200 f: a top view;

300a, 300b, 300c, 400a, 400b, 400c, 500a, 500b, 500c, 600a, 600b, 600c, 700a, 700b, 700c, 800a, 800b, 800c, 900a, 900b, 900c, 1000a, 1000b, 1000c, 1100a, 1100b, 1100c, 1200a, 1200b, 1200c, 1300a, 1300b, 1300c, 1400a, 1400b, 1400c, 1500a, 1500b, 1500c, 1600a, 1600b, 1600c, 1700a, 1700b, 1700c, 1800a, 1800b, 1800c, 1900a, 1900b, 1900c, 2000a, 2000b, 2000c, 2100a, 2100b, 2100c, 2200a, 2200b, 2200c, 3100 a, 2300b, 2300c, 2400a, 2400b, 2500a, 2500b, 2500c, 2600b, 2600c, 2700 a, 2800a, 3500a, 3000b, 3000a, 3000b, 3500a, 3000b, 3000a, 3000b, 3600 c: a cross-sectional view;

502. 902, 1502: a support structure;

702: an upper support structure;

1102: a side support structure;

1302: a first support structure;

1304: a second support structure;

1504. 1904, 2304, 2504: a first side wall;

1506. 1906, 2306, 2506: a second side wall;

1902: a top surface support structure;

2102: a sidewall support structure;

2302: a lower surface support structure;

2502: an upper surface support structure;

2702: a first pair of layers;

2802: a stack of layers;

2804: a first multilayer foil;

2804b, 3002b, 3202 b: a bottom surface;

2902: a first cutting line;

3002: a second multilayer foil;

3002a, 3202 a: a top surface;

3102: a second cut line;

3202: a third multilayer foil;

3302: a top region;

3304: a first sidewall region;

3306: a bottom region;

3308: a second sidewall region;

3310: a third sidewall region;

3312: a fourth sidewall region;

3700. 3800: a block diagram;

3702. 3704, 3706, 3708, 3710a, 3710b, 3712b, 3714b, 3802, 3804a, 3804b, 3806b, 3808: an action;

x, y, z: a shaft;

D_d: a distance;

L₁、L₂: a length;

L_i、T_d、T_m: thickness;

P_x: a vertical line;

P_y: a horizontal line.

Detailed Description

The present disclosure provides many different embodiments, or examples, for implementing different features of the disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first feature is formed in direct contact with the second feature, and may also include embodiments in which additional features may be formed between the first and second features such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Additionally, spatially relative terms, such as "below …," "below," "lower," "above …," "upper," and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures for ease of description. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

A Magnetic Tunnel Junction (MTJ) includes a first ferromagnetic film and a second ferromagnetic film separated by a tunnel barrier layer. One of the ferromagnetic films (often referred to as the "reference layer") has a fixed magnetization direction, while the other ferromagnetic film (often referred to as the "free layer") has a variable magnetization direction. For a magnetoresistive element with positive tunneling (tunn)Boring a magnetresistance; TMR), it is more likely that electrons will tunnel through the tunnel barrier if the magnetization directions of the reference layer and the free layer are in a parallel orientation, so that the MTJ is in a low resistance state. Conversely, if the magnetization directions of the reference and free layers are oriented antiparallel, it is less likely that electrons will tunnel through the tunnel barrier, causing the MTJ to be in a high resistance state. Thus, the MTJ can be switched between two states of resistance, with a first state (R) of low resistance_P: the magnetization directions of the reference layer and the free layer are parallel) and a second state (R) with high resistance_AP: the magnetization directions of the reference layer and the free layer are antiparallel). It should be noted that the MTJ may also have a negative TMR, e.g., a lower resistance for anti-parallel orientation and a higher resistance for parallel orientation.

Due to its binary nature, MTJs are used in memory cells to store digital data, having a low resistance state R corresponding to a first data state (e.g., a logic "0")_PAnd a high resistance state R corresponding to a second data state (e.g., a logic "1")_AP. Thus, some chips include an array of MRAM cells, where each MRAM cell uses an MTJ to store a data state. However, when such a chip is in the presence of an external magnetic field, the external magnetic field may undesirably "flip" the data state stored in the MRAM cell, causing data retention problems. To mitigate the adverse effects of external magnetic fields, the present disclosure contemplates at least partially surrounding the MRAM chip with a magnetic field shielding structure. The magnetic field shielding structure at least partially surrounds the chip and defines a magnetic shielding region surrounding the chip. The magnetic shielding region has a first magnetic field magnitude that is less than a second magnetic field magnitude located directly outside of an outermost surface of the magnetic field shielding structure. Thus, the magnetic field shielding structure reduces the magnetic field experienced by the chip, thereby improving data retention within the MRAM cells of the chip.

Fig. 1A illustrates a perspective view of a memory device 100a with a front portion removed to more clearly depict the interior portions of the memory device, in accordance with some embodiments. The memory device 100a includes a chip 106 and a magnetic field shielding structure 105. Typically, chip 106 includes transistors disposed in a semiconductor substrate, and an array of MRAM cells arranged in an interconnect structure above the semiconductor substrate. The innermost surface of the magnetic field shielding structure 105 at least partially surrounds the chip 106 and establishes a magnetic shielding region proximate the chip 106. Due to the magnetic field shielding structure 105, the magnetic shielding region has a first magnetic field magnitude that is smaller than a second magnetic field magnitude located directly outside of the outermost surface of the magnetic field shielding structure 105. Accordingly, magnetic field shielding structure 105 reduces the magnetic field experienced by chip 106, thereby helping to improve data retention within the MRAM cells on chip 106. In some embodiments, the first magnetic field magnitude is at least 80 percent less than the second magnetic field magnitude that is directly outside of the outermost surface of magnetic field-shielding structure 105. In yet another embodiment, the first magnetic field magnitude is 316 oersteds (Oe) and the second magnetic field magnitude directly outside the outermost surface of magnetic field shielding structure 105 is 2015 oersteds. The magnetic field shielding structure protects the chip 106 from both Direct Current (DC) magnetic fields and Alternating Current (AC) magnetic fields.

Above the upper surface of the chip 106, the top region 122 of the magnetic field shielding structure 105 comprises a first instantiation (instantiation) of the first multi-layer stack 103 a. Below the lower surface of the chip 106, the bottom region 126 of the magnetic field shielding structure 105 comprises a second instantiation of the first multi-layer stack 103a, such that the single layer of the second instantiation is arranged in parallel with the single layer of the first instantiation. A sidewall region 124 defined between the top region 122 of the magnetic field shielding structure 105 and the bottom region 126 of the magnetic field shielding structure 105 comprises a third instantiation of the first multi-layer stack 103 a. The third instantiated single layer of the first multi-layer stack 103 is rotated 90 degrees with respect to the first and second instantiated single layers. The sidewall regions 124 are laterally spaced from the sidewalls of the chip 106.

For each instantiation, the first multi-layer stack 103a includes one or more magnetic layers 102 and one or more dielectric layers 104. The bottom-most layer of the first multi-layer stack 103a includes the magnetic layer 102 and the top-most layer of the first multi-layer stack 103a includes the magnetic layer 102. In some embodiments, the magnetic layer 102 and the dielectric layer 104 are each coated with an insulating adhesive material. In some embodiments, an insulating adhesive layer is placed between each magnetic layer 102 and the dielectric layer 104 in the first multi-layer stack 103 a. The insulating adhesive layer defines a top surface and a bottom surface of the first multi-layer stack 103 a. Thus, in some embodiments, the first instantiation, the second instantiation, and the third instantiation each have the same number of magnetic layers and dielectric layers as each other, wherein for the first instantiation, the second instantiation, and the third instantiation, those respective layers are arranged in the same order, have the same respective compositions, and have the same respective thicknesses. For example, in some embodiments, the first multi-layer stack may include 3 magnetic layers and 2 dielectric layers alternating with each other. In yet another embodiment, the first multi-layer stack may include about 3 to 100 magnetic layers and about 2 to 99 dielectric layers alternating with each other.

In some embodiments, the first multi-layer stack 103a includes one or more insulating adhesive layers respectively overlapping the one or more magnetic layers 102 and one or more dielectric layers 104 respectively overlapping the one or more magnetic layers 102. Magnetic layer 102 is a continuous sheet of magnetic material having a length and width that are greater than the length and width, respectively, of the upper surface of chip 106. The dielectric layer 104 is a thin sheet of continuous dielectric material disposed over the magnetic layer 102. The dielectric layer 104 has a length and a width that are greater than a length and a width, respectively, of the upper surface of the chip 106.

Electrical connections 108 extend through openings in magnetic field shielding structure 105 and are coupled to chip 106, in particular through a third instantiation of first multi-layer stack 103a located in sidewall region 124. The electrical connections 108 extend through openings in the face of the magnetic field shielding structure 105. The magnetic field shielding structure 105 is not electrically coupled to the electrical connection 108.

During operation of the chip 106, read and write operations are performed on the array of MRAM cells. The presence of the magnetic field shielding structure 105 ensures that the power used during a write operation on the array of MRAM-cells is not disconnected by external influences. In effect, the magnetic field shielding structure 105 ensures that the power used during the write operation is contained within the chip 106. In addition, any magnetic fields not associated with chip 106 will be redirected away from regions directly outside the outer surface of chip 106, thereby preventing any undesirable changes in the set or stored data state and increasing data retention of the array of MRAM cells in chip 106.

Referring to fig. 1B, a perspective view 100B of some alternative embodiments of the memory device of fig. 1A is provided in which the top region 122 of the magnetic shield structure 105 includes a first instantiation of the second multi-layer stack 103B. The bottom region 126 of the magnetic field shielding structure 105 comprises a second instantiation of the second multi-layer stack 103 b. A sidewall region 124 defined between the top region 122 of the magnetic field shielding structure 105 and the bottom region 126 of the magnetic field shielding structure 105 includes the magnetic layer 102. In some embodiments, the magnetic layer 102 within the sidewall region 124 is at least partially surrounded by and/or at least partially coated with an insulating adhesive layer, but in the illustrated embodiment, the magnetic layer 102 is a single continuous layer having a thickness greater than or equal to the thickness of the magnetic layer 102 in the second multi-layer stack 103 b. Electrical connections 108 extend through openings in magnetic field shielding structure 105 and couple to chip 106, specifically through magnetic layer 102 within sidewall regions 124.

In each instantiation, the second multi-layer stack 103b includes a plurality of strips of the magnetic layer 102 and a plurality of strips of the dielectric layer 104 separating the plurality of strips of the magnetic layer 102. Each strip of the plurality of strips of magnetic layer 102 has a length that is greater than the length of the upper surface of the chip 106 and a width that is less than the width of the upper surface of the chip 106. Each of the plurality of strips of the dielectric layer 104 has a length greater than a length of the upper surface of the chip 106 and a width less than a width of the upper surface of the chip 106. In some embodiments, a strip of insulating adhesive is placed between each of the plurality of strips of magnetic layers 102 and dielectric layers 104 in the second multi-layer stack 103b, and a layer of insulating adhesive is placed at the top and bottom surfaces of the multi-layer stack 103b, respectively. In some embodiments, the second multi-layer stack 103b includes at least three strips of magnetic layers 102 and at least three strips of dielectric layers 104. The top surface of the multi-layer stack 103b has a length and a width that are greater than a length and a width, respectively, of the upper surface of the chip 106.

Referring to fig. 1C, a perspective view 100C of some alternative embodiments of the memory device of fig. 1A is provided in which the top region 122 of the magnetic shield structure 105 includes a first instantiation of the third multi-layer stack 103C. The bottom region 126 of the magnetic field shielding structure 105 comprises a second instantiation of the third multi-layer stack 103 c. A sidewall region 124 defined between the top region 122 of the magnetic field shielding structure 105 and the bottom region 126 of the magnetic field shielding structure 105 includes the magnetic layer 102. In some embodiments, the magnetic layer 102 within the sidewall region 124 is at least partially surrounded by and/or at least partially coated with an insulating adhesive layer, but in the illustrated embodiment, the magnetic layer 102 is a single continuous layer having a thickness greater than or equal to the thickness of the magnetic layer 102 in the third multi-layer stack 103 c. Electrical connections 108 extend through openings in magnetic field shielding structure 105 and couple to chip 106, specifically through magnetic layer 102 within sidewall regions 124.

The third multi-layer stack 103c includes a grid of a plurality of rectangles of magnetic layers 102 and a plurality of rectangular dielectric layers 104 separating the magnetic layers 102. The plurality of rectangles of magnetic layer 102 are spaced apart from each other in a series of rows and columns. The grid of dielectric layers 104 includes a plurality of linear segments of dielectric layers 104 that intersect perpendicularly with each other. The plurality of rectangles of the magnetic layer 102 are arranged in a grid of the dielectric layer 104 such that adjacent rectangles are separated from each other by at least one linear section of the grid of the dielectric layer 104. In some embodiments, an insulating adhesive strip is placed between each rectangle of the plurality of rectangles of the magnetic layer 102 and each section of the grid of the dielectric layer 104, and insulating adhesive layers are placed at the top and bottom surfaces of the third multi-layer stack 103c, respectively. In some embodiments, the third multi-layer stack 103c includes at least nine rectangles of magnetic layers 102 and at least six linear segments of dielectric layers 104. The grid of dielectric layers 104 has a length and width that are greater than the length and width, respectively, of the upper surface of the chip 106.

The magnetic layer 102 may be or may include, for example, iron (Fe), cobalt (Co), nickel (Ni), some other magnetic material, some other conductive material, or the like. In some embodiments, the magnetic layer 102 may be formed to a thickness of about 10 microns to 1,000 microns, about 10 microns to 500 microns, about 500 microns to 1,000 microns, or some other suitable value. The dielectric layer 104 may be or include, for example, a non-magnetic material, a low-k dielectric, silicon oxide, a high-k dielectric, some other dielectric, or any combination of the preceding. In some embodiments, the dielectric layer 104 may be formed to a thickness of about 10 nanometers to 1,000 micrometers, about 10 nanometers to 500 micrometers, about 500 micrometers to 1,000 micrometers, or some other suitable value. The electrical connections 108 may be or may include, for example, copper, aluminum, tungsten, some other conductive material, or the like. In some embodiments, the magnetic layer 102 comprises a magnetic material and the dielectric layer 104 comprises a non-magnetic material.

Referring to fig. 1D, a perspective view 100D of some alternative embodiments of the chip 106 of fig. 1A is provided, wherein the chip 106 includes a semiconductor substrate 109 and an interconnect structure 111 disposed over the semiconductor substrate 109. Typically, a chip includes a transistor 110 disposed in a semiconductor substrate 109, and an array of MRAM cells (e.g., MRAM cell 112) arranged in an interconnect structure 111. In some embodiments, chip 106 has a first side on which active devices, such as transistors 110 and an array of MRAM cells, are disposed, and a second side adjacent to the first side, the second side defining an upper surface of chip 106.

Referring to fig. 1E, a perspective view 100E of some alternative embodiments of the memory device of fig. 1A is provided in which the chip 106 and the magnetic field shielding structure 105 are encapsulated by an insulating structure 120 (e.g., a molding compound, an epoxy, a resin, a ceramic material, or a combination thereof) to define an encapsulation structure 121. The insulating structure 120 at least partially fills the space between the outer surface of the chip 106 and the inner surface of the magnetic field shielding structure 105. The insulating structure 120 at least partially surrounds the outer surface of the magnetic field shielding structure 105. Electrical connections 108 extend through insulating structure 120 and magnetic field shielding structure 105 to couple to chip 106. The electrical connections 108 include electrically conductive contact leads 108a and electrically conductive wires 108b, respectively. In some embodiments, the conductive contact lead 108a extends through the magnetic field shielding structure 105. In yet another embodiment, the conductive contact lead 108a does not extend through the magnetic field shielding structure 105. The conductive line 108b directly contacts the conductive contact lead 108a and is electrically coupled to the chip 106. The package structure 121 is configured to be mounted on a Printed Circuit Board (PCB), wherein each of the conductive contact leads 108a of the electrical connections 108 is electrically coupled to the PCB.

Referring to FIG. 2A, a top view 200a of the memory device of FIG. 1A is provided, wherein the length L of the chip 106₂And width W₂Are respectively smaller than the length L of the upper surface of the magnetic shielding structure 105₁And width W₁. Length L of chip 106₂In the range of about 0.5 mm to about 20 mm, and the width W of the chip 106₂In the range of about 0.5 mm to about 20 mm. For example, the length L of the upper surface of the magnetic shielding structure 105₁In the range of about 4 mm to about 10 cm, and the width W of the upper surface of the magnetic shield structure 105₁In the range of about 4 millimeters to about 10 centimeters, or some other suitable value. In some embodiments, electrical connections 108 vary in size.

Referring to fig. 2B, a top view 200B of the memory device of fig. 1B is provided, wherein a width of a stripe of the plurality of stripes of the magnetic layer 102 is in a range of about 10 microns to about 1,000 microns, or some other suitable value. The width of a strip of the plurality of strips of the dielectric layer 104 is in a range of about 10 nanometers to about 1,000 micrometers, or some other suitable value.

Referring to FIG. 2C, a top view 200C of the memory device of FIG. 1C is provided, wherein a width of a rectangle of the plurality of rectangles of magnetic layer 102 is in a range of about 10 microns to about 1,000 microns, or some other suitable value. The width of a linear segment of the plurality of linear segments of the grid of dielectric layers 104 is in a range of about 10 nanometers to 1,000 micrometers, or some other suitable value.

Reference to length L for chip 106 described with respect to FIG. 2A above₂And width W₂And the length L of the upper surface of the magnetic shield structure 105₁And width W₁It should be understood that the range of values can be used with embodiments of the memory device in either of fig. 2B and 2C and their respective perspective views fig. 1B and 1C. Referring to FIGS. 2A to 2C, a perpendicular line P along the x-axis_xShowing the location where the cross-sectional view in the z-x plane is taken. Horizontal line P along the y-axis_yShowing the location at which the cross-sectional view in the z-y plane is taken.

Referring to fig. 2D, a top view 200D in the x-y plane is provided of some alternative embodiments of the memory device of fig. 2A, wherein an inner surface of the third instantiation of the first multi-layer stack 103a is in contact with an outer perimeter of the first instantiation of the first multi-layer stack 103 a.

Referring to fig. 2E, a top view 200E in the x-y plane is provided of some alternative embodiments of the memory device of fig. 2B, wherein the inner surface of the magnetic layer 102 is in contact with the outer perimeter of the first instantiation of the second multi-layer stack 103B.

Referring to fig. 2F, a top view 200F in the x-y plane is provided of some alternative embodiments of the memory device of fig. 2C, wherein the inner surface of the magnetic layer 102 is in contact with the outer perimeter of the first instantiation of the third multi-layer stack 103C.

Referring to FIG. 3A, vertical lines P of FIG. 2D are provided_x Cross-sectional view 300a in the z-x plane of some additional embodiments of the memory device of (a), wherein the magnetic shielding structure 105 completely surrounds the chip 106. Electrical connections 108 extend from PCB 101 and extend through magnetic shield structure 105 coupled to chip 106. The insulating structure 120 encapsulates the chip 106. In some embodiments, the outer surface of the insulating structure 120 is separated from the inner surface of the magnetic shielding structure 105 by a non-zero distance, but in other embodiments, the outer surface of the insulating structure 120 may be in direct contact with the inner surface of the magnetic shielding structure 105. A first instantiation of the first multi-layer stack 103a is disposed within the top region 122 above the upper surface of the chip 106. A second instantiation of the first multi-layer stack 103a is disposed within the bottom region 126 below the lower surface of the chip 106. A third instantiation of the first multi-layer stack 103a is disposed within the sidewall region 124, laterally offset from the sidewall of the chip 106.

The vertical distance 105a between the bottom surface of the insulating structure 120 and the top surface of the multi-layer stack 103a in the bottom region 126 is in the range of about 0 millimeters to 1.25 millimeters. A vertical distance 105a is also defined between the top surface of the insulating structure 120 and the bottom surface of the multi-layer stack 103a in the top region 122. The horizontal distance 105b between the sidewalls of the insulating structure 120 and the sidewalls of the multi-layer stack 103a in the sidewall region 124 is in the range of about 0 mm to 1.25 mm. The width 105d of the sidewall region 124 is in the range of about 0.05 microns to 1.25 centimeters. The opening distance 105c is in the range of about 0.05 mm and 2.25 mm. In some embodiments, the insulating structure 120 is not present and thus distances such as the vertical distance 105a and the horizontal distance 105b are relative to the chip 106.

Referring to FIG. 3B, vertical lines P of FIG. 2E are provided_x Cross-sectional view 300b in the z-x plane of some additional embodiments of the memory device of (a), wherein the magnetic shielding structure 105 encapsulates the chip 106. Electrical connections 108 extend from PCB 101 and extend through magnetic shield structure 105 coupled to chip 106. The insulating structure 120 encapsulates the chip 106. In some embodiments, the outer surface of the insulating structure 120 is laterally and vertically separated from the inner surface of the magnetic shielding structure 105 by a non-zero distance, but in other embodiments, the outer surface of the insulating structure 120 may be in direct contact with the inner surface of the magnetic shielding structure 105. A first instantiation of the second multi-layer stack 103b is disposed within the top region 122 above the upper surface of the chip 106. A second instantiation of the second multi-layer stack 103b is disposed within the bottom region 126 below the lower surface of the chip 106. The magnetic layer 102 is disposed within the sidewall region 124, laterally offset from the sidewalls of the chip 106.

Referring to FIG. 3C, vertical line P of FIG. 2F is provided_x Cross-sectional view 300c in the z-x plane of some additional embodiments of the memory device of (a), wherein the magnetic shielding structure 105 encapsulates the chip 106. Electrical connections 108 extend from PCB 101 and extend through magnetic shield structure 105 coupled to chip 106. The insulating structure 120 encapsulates the chip 106. In some embodiments, the outer surface of the insulating structure 120 is laterally and vertically separated from the inner surface of the magnetic shielding structure 105 by a non-zero distance, but in other embodiments, the outer surface of the insulating structure 120 may be in direct contact with the inner surface of the magnetic shielding structure 105. A first instantiation of the third multi-layer stack 103c is disposed within the top region 122 above the upper surface of the chip 106. A second instantiation of the third multi-layer stack 103c is disposed within the bottom region 126 below the lower surface of the chip 106. The magnetic layer 102 is disposed within the sidewall region 124, laterally offset from the sidewalls of the chip 106.

Referring to FIG. 4A, the horizontal line P of FIG. 2D is provided_yMemory ofCross-sectional view 400a in the z-y plane of some additional embodiments of the device, where the magnetic shielding structure 105 completely surrounds the chip 106. Electrical connections 108 extend from PCB 101 and extend through magnetic shield structure 105 coupled to chip 106. The insulating structure 120 encapsulates the chip 106. In some embodiments, the outer surface of the insulating structure 120 is separated from the inner surface of the magnetic shielding structure 105 by a non-zero distance, but in other embodiments, the outer surface of the insulating structure 120 may be in direct contact with the inner surface of the magnetic shielding structure 105. A first instantiation of the first multi-layer stack 103a is disposed within the top region 122 above the upper surface of the chip 106. A second instantiation of the first multi-layer stack 103a is disposed within the bottom region 126 below the lower surface of the chip 106. A third instantiation of the first multi-layer stack 103a is disposed within the sidewall region 124, laterally offset from the sidewall of the chip 106.

Referring to FIG. 4B, the horizontal line P of FIG. 2E is provided_y Cross-sectional view 400b in the z-y plane of some additional embodiments of memory devices at (a), where magnetic shielding structure 105 encapsulates chip 106. Electrical connections 108 extend from PCB 101 and extend through magnetic shield structure 105 coupled to chip 106. The insulating structure 120 encapsulates the chip 106. In some embodiments, the outer surface of the insulating structure 120 is laterally and vertically separated from the inner surface of the magnetic shielding structure 105 by a non-zero distance, but in other embodiments, the outer surface of the insulating structure 120 may be in direct contact with the inner surface of the magnetic shielding structure 105. A first instantiation of the second multi-layer stack 103b is disposed within the top region 122 above the upper surface of the chip 106. A second instantiation of the second multi-layer stack 103b is disposed within the bottom region 126 below the lower surface of the chip 106. The magnetic layer 102 is disposed within the sidewall region 124, laterally offset from the sidewalls of the chip 106.

Referring to FIG. 4C, horizontal line P of FIG. 2F is provided_y Cross-sectional view 400c in the z-y plane of some additional embodiments of memory devices at (a), where magnetic shielding structure 105 encapsulates chip 106. Electrical connections 108 extend from PCB 101 and extend through magnetic shield structure 105 coupled to chip 106. The insulating structure 120 encapsulates the chip 106. In some embodiments, the outer surface of the insulating structure 120 and the inner surface of the magnetic shielding structure 105Laterally and vertically separated by a non-zero distance, but in other embodiments, the outer surface of the insulating structure 120 may be in direct contact with the inner surface of the magnetic shielding structure 105. A first instantiation of the third multi-layer stack 103c is disposed within the top region 122 above the upper surface of the chip 106. A second instantiation of the third multi-layer stack 103c is disposed within the bottom region 126 below the lower surface of the chip 106. The magnetic layer 102 is disposed within the sidewall region 124, laterally offset from the sidewalls of the chip 106.

Referring to the ranges of values for the vertical distance 105a, horizontal distance 105B, opening distance 105C, and width 105d described above with respect to fig. 3A, it should be understood that the ranges of values may be used with embodiments of the memory device in any of the separately labeled distances and/or widths of fig. 3B, 3C, 4A, 4B, and 4C.

Referring to fig. 5A and 6A, cross-sectional view 500a and cross-sectional view 600a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where the lower inner sidewalls of the magnetic shield structure 105 are spaced apart from each other by an air gap within the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the bottom region 126 instead of in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the second instantiation of the first multi-layer stack 103a is not within the bottom region 126.

Referring to fig. 5B and 6B, cross-sectional view 500B and cross-sectional view 600B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3B and 4B, where the lower inner sidewalls of the magnetic shield structures 105 are spaced apart from each other by an air gap within the magnetic shield structures 105. In some embodiments, for example, air gaps are present in the bottom region 126 instead of in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the second instantiation of the second multi-layer stack 103b is not within the bottom region 126.

Referring to fig. 5C and 6C, cross-sectional view 500C and cross-sectional view 600C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3C and 4C, where the lower inner sidewalls of the magnetic shield structure 105 are spaced apart from each other by an air gap within the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the bottom region 126 instead of in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the second instantiation of the third multi-layer stack 103c is not within the bottom region 126.

Referring to fig. 5A-5C and 6A-6C, in some embodiments, a support structure 502 is within the bottom region 126 to provide structural support for the magnetic shield structure 105. The support structure 502 extends continuously between the lower inner sidewalls of the magnetic shield structure 105 in the bottom region 126. The support structure 502 may comprise, for example, a dielectric sheet, an insulator sheet, or a thin metal layer. In some embodiments, there is no support structure 502.

Referring to fig. 7A and 8A, cross-sectional view 700a and cross-sectional view 800a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where the upper inner sidewalls of the magnetic shield structure 105 are spaced apart from each other by an air gap within the magnetic shield structure 105. In some embodiments, for example, an air gap is present in the top region 122 rather than in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the first instantiation of the first multi-layer stack 103a is not within the top zone 122.

Referring to fig. 7B and 8B, cross-sectional view 700B and cross-sectional view 800B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3B and 4B, where the upper inner sidewalls of the magnetic shield structures 105 are spaced apart from each other by an air gap within the magnetic shield structures 105. In some embodiments, for example, an air gap is present in the top region 122 rather than in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the first instantiation of the second multi-layer stack 103b is not within the top zone 122.

Referring to fig. 7C and 8C, cross-sectional view 700C and cross-sectional view 800C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3C and 4C, where the upper inner sidewalls of the magnetic shield structures 105 are spaced apart from each other by an air gap within the magnetic shield structures 105. In some embodiments, for example, an air gap is present in the top region 122 rather than in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the first instantiation of the third multi-layer stack 103c is not within the top zone 122.

Referring to fig. 7A-7C and 8A-8C, in some embodiments, an upper support structure 702 is within the top region 122 to provide structural support for the magnetic shield structure 105. The upper support structure 702 extends continuously between the inner sidewalls of the sidewall regions 124 to define a top surface of the magnetic shield structure 105. The support structure 702 extends continuously between the upper inner sidewalls of the magnetic shield structure 105 in the top region 122. The upper support structure 702 may comprise, for example, a dielectric sheet, an insulator sheet, or a thin metal layer. In some embodiments, there is no upper support structure 702.

Referring to fig. 9A and 10A, cross-sectional view 900A and cross-sectional view 1000A in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where the upper and lower inner surfaces of magnetic shield structure 105 are spaced apart from each other by an air gap within magnetic shield structure 105. In some embodiments, for example, air gaps are present in the top portion 124a of the sidewall region 124 rather than in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, a portion of the third instantiation of the first multi-layer stack 103a is not within the top portion 124a of the sidewall region 124.

Referring to fig. 9B and 10B, cross-sectional view 900B and cross-sectional view 1000B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3B and 4B, where the upper and lower inner surfaces of magnetic shield structure 105 are spaced apart from each other by an air gap within magnetic shield structure 105. In some embodiments, for example, an air gap is present in the top portion 124a of the sidewall region 124 rather than in the magnetic layer 102. Furthermore, in some embodiments, a portion of the magnetic layer 102 is not within the top portion 124a of the sidewall region 124.

Referring to fig. 9C and 10C, cross-sectional view 900C and cross-sectional view 1000C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3C and 4C, where the upper and lower inner surfaces of magnetic shield structure 105 are spaced apart from each other by an air gap within magnetic shield structure 105. In some embodiments, for example, an air gap is present in the top portion 124a of the sidewall region 124 rather than in the magnetic layer 102. Furthermore, in some embodiments, a portion of the magnetic layer 102 is not within the top portion 124a of the sidewall region 124.

Referring to fig. 9A-9C and 10A-10C, in some embodiments, a support structure 902 is within the top portion 124a of the sidewall region 124, providing structural support for the magnetic shield structure 105. The support structure 902 extends continuously between the bottom portion 124b of the sidewall region 124 to the top region 122. The support structure 902 extends continuously between the upper and lower inner surfaces of the magnetic shield structure 105 in the top portion 124a of the sidewall region 124. The support structure 902 may comprise, for example, a dielectric sheet, an insulator sheet, or a thin metal layer. In some embodiments, there is no support structure 902. In some embodiments, the first instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b, and the third multi-layer stack 103c each extend between outer sidewalls of the sidewall region 124. Wherein outer sidewalls of the first instantiation of the respective first multi-layer stack 103a, second multi-layer stack 103b and third multi-layer stack 103c are aligned with outer sidewalls of the bottom surface of the magnetic shielding structure 105. In some embodiments, the first instantiation of the first multi-layer stack 103a, the second multi-layer stack 103b, and the third multi-layer stack 103c are confined within the top region 122 and do not extend to the sidewall region 124, respectively.

Referring to fig. 11A and 12A, cross-sectional view 1100a and cross-sectional view 1200a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where the upper and lower inner surfaces of the magnetic shield structure 105 are spaced apart from each other by an air gap within the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the bottom portion 124b of the sidewall region 124 rather than in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, a portion of the third instantiation of the first multi-layer stack 103a is not within the bottom portion 124b of the sidewall region 124.

Referring to fig. 11B and 12B, cross-sectional view 1100B and cross-sectional view 1200B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3B and 4B, where the upper and lower inner surfaces of the magnetic shield structure 105 are spaced apart from each other by an air gap within the magnetic shield structure 105. In some embodiments, for example, an air gap is present in the bottom portion 124b of the sidewall region 124 rather than in the magnetic layer 102. Furthermore, in some embodiments, a portion of the magnetic layer 102 is not within the bottom portion 124b of the sidewall region 124.

Referring to fig. 11C and 12C, cross-sectional view 1100C and cross-sectional view 1200C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3C and 4C, where the upper and lower inner surfaces of the magnetic shield structure 105 are spaced apart from each other by an air gap within the magnetic shield structure 105. In some embodiments, for example, an air gap is present in the bottom portion 124b of the sidewall region 124 rather than in the magnetic layer 102. Furthermore, in some embodiments, a portion of the magnetic layer 102 is not within the bottom portion 124b of the sidewall region 124.

Referring to fig. 11A-11C and 12A-12C, in some embodiments, side support structures 1102 are within the bottom portion 124b of the sidewall area 124, providing structural support for the magnetic shield structure 105. The side support structures 1102 extend continuously between the top portion 124a and the bottom region 126 of the sidewall region 124. In some embodiments, the side support structures 1102 continuously extend between the upper and lower inner surfaces of the magnetic shield structure 105 in the bottom portion 124b of the sidewall region 124. The side support structures 1102 may include, for example, dielectric sheets, insulator sheets, or thin metal layers. In some embodiments, there is no side support structure 1102. In some embodiments, the second instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c each extend between outer sidewalls of the sidewall region 124. Wherein outer sidewalls of the second instantiation of the respective first multi-layer stack 103a, second multi-layer stack 103b and third multi-layer stack 103c are aligned with outer sidewalls of the top surface of the magnetic shielding structure 105. In some embodiments, the second instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c are confined within the bottom region 126 and do not extend to the sidewall region 124, respectively.

Referring to fig. 13A and 14A, cross-sectional view 1300a and cross-sectional view 1400a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where the upper and lower inner surfaces of magnetic shield structure 105 are spaced apart from each other by a first air gap within magnetic shield structure 105. The inner sidewalls of the magnetic shielding structure 105 are spaced apart from each other by a second air gap within the magnetic shielding structure 105. In some embodiments, for example, a first air gap is present in the top portion 124a of the sidewall region 124 and a second air gap is present in the bottom region 126, instead of in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, a portion of the third instantiation of the first multi-layer stack 103a is not within the top portion 124a of the sidewall region 124, and the second instantiation of the first multi-layer stack 103a is not within the bottom region 126.

Referring to fig. 13B and 14B, cross-sectional view 1300B and cross-sectional view 1400B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3B and 4B, where the upper and lower inner surfaces of magnetic shield structure 105 are spaced apart from each other by a first air gap within magnetic shield structure 105. The inner sidewalls of the magnetic shielding structure 105 are spaced apart from each other by a second air gap within the magnetic shielding structure 105. In some embodiments, for example, a first air gap is present in the top portion 124a of the sidewall region 124 and a second air gap is present in the bottom region 126, rather than in the magnetic layer 102. Moreover, in some embodiments, a portion of the magnetic layer 102 is not within the top portion 124a of the sidewall region 124 and the second instantiation of the second multi-layer stack 103b is not within the bottom region 126.

Referring to fig. 13C and 14C, cross-sectional view 1300C and cross-sectional view 1400C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3C and 4C, where the upper and lower inner surfaces of magnetic shield structure 105 are spaced apart from each other by a first air gap within magnetic shield structure 105. The inner sidewalls of the magnetic shielding structure 105 are spaced apart from each other by a second air gap within the magnetic shielding structure 105. In some embodiments, for example, a first air gap is present in the top portion 124a of the sidewall region 124 and a second air gap is present in the bottom region 126, rather than in the magnetic layer 102. Moreover, in some embodiments, a portion of the magnetic layer 102 is not within the top portion 124a of the sidewall region 124 and the second instantiation of the third multi-layer stack 103c is not within the bottom region 126.

Referring to fig. 13A-13C and 14A-14C, in some embodiments, first support structures 1302 provide structural support for magnetic shield structure 105 within top portion 124A of sidewall region 124. The first support structure 1302 extends continuously between the bottom portion 124b of the sidewall region 124 to the top region 122. A second support structure 1304 is within the bottom region 126 to provide structural support for the magnetic shield structure 105. In some embodiments, first support structure 1302 continuously extends between upper and lower inner surfaces of magnetic shield structure 105 in top portion 124a of sidewall region 124. In some embodiments, the second support structure 1304 extends continuously between the inner sidewalls of the magnetic shield structure 105 in the bottom region 126. The second support structure 1304 extends continuously between the inner sidewalls of the sidewall regions 124. The first and second support structures 1302, 1304 may comprise, for example, a dielectric sheet, an insulator sheet, or a thin metal layer. In some embodiments, there is no first support structure 1302 and/or no second support structure 1304. In some embodiments, the first instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b, and the third multi-layer stack 103c each extend between outer sidewalls of the sidewall region 124. Wherein outer sidewalls of the second instantiation of the respective first multi-layer stack 103a, second multi-layer stack 103b and third multi-layer stack 103c are aligned with outer sidewalls of the bottom surface of the magnetic shielding structure 105. In some embodiments, the first instantiation of the first multi-layer stack 103a, the second multi-layer stack 103b, and the third multi-layer stack 103c are confined within the top region 122 and do not extend to the sidewall region 124, respectively.

Referring to fig. 15A and 16A, cross-sectional view 1500a and cross-sectional view 1600a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where the upper inner surface of the magnetic shield structure 105 is spaced apart from the top surface of the PCB 101 by an air gap. In some embodiments, for example, air gaps are present in the bottom portion 124b and bottom region 126 of the sidewall region 124, rather than in the magnetic layer 102 and dielectric layer 104. Further, in some embodiments, a portion of the third instantiation of the first multi-layer stack 103a is not within the bottom portion 124b of the sidewall region 124, and the second instantiation of the first multi-layer stack 103a is not within the bottom region 126.

Referring to fig. 15B and 16B, cross-sectional view 1500B and cross-sectional view 1600B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3B and 4B, where the upper inner surface of the magnetic shield structure 105 is spaced apart from the top surface of the PCB 101 by an air gap. In some embodiments, for example, air gaps are present in the bottom portion 124b and bottom region 126 of the sidewall region 124, rather than in the magnetic layer 102 and dielectric layer 104. Moreover, in some embodiments, a portion of the magnetic layer 102 is not within the bottom portion 124b of the sidewall region 124 and the second instantiation of the second multi-layer stack 103b is not within the bottom region 126.

Referring to fig. 15C and 16C, cross-sectional view 1500C and cross-sectional view 1600C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3C and 4C, where the upper inner surface of the magnetic shield structure 105 is spaced apart from the top surface of the PCB 101 by an air gap. In some embodiments, for example, air gaps are present in the bottom portion 124b and bottom region 126 of the sidewall region 124, rather than in the magnetic layer 102 and dielectric layer 104. Moreover, in some embodiments, a portion of the magnetic layer 102 is not within the bottom portion 124b of the sidewall region 124 and the second instantiation of the third multi-layer stack 103c is not within the bottom region 126.

Referring to fig. 15A-15C and 16A-16C, in some embodiments, support structures 1502 are within bottom portions 124b and bottom regions 126 of sidewall regions 124, providing structural support for magnetic shield structure 105. The support structure 1502 extends continuously between the outer sidewalls of the top portion 124a of the sidewall region 124. In some embodiments, support structure 1502 extends continuously between bottom portion 124b of sidewall region 124 and first sidewall 1504 of magnetic shield structure 105 and second sidewall 1506 of magnetic shield structure 105 in bottom region 126. Support structure 1502 may comprise, for example, a dielectric sheet, an insulator sheet, or a thin metal layer. In some embodiments, there is no support structure 1502.

Referring to fig. 17A and 18A, cross-sectional view 1700a and cross-sectional view 1800a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where the upper inner surface of the magnetic shield structure 105 is spaced apart from the bottom inner surface of the magnetic shield structure 105 by a first air gap. The upper inside wall of the magnetic shield structure 105 is spaced apart by a second air gap. In some embodiments, for example, a first air gap is present in the bottom portion 124b of the sidewall region 124 and a second air gap is present in the top region 122, instead of in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, a portion of the third instantiation of the first multi-layer stack 103a is not within the bottom portion 124b of the sidewall region 124, and the first instantiation of the first multi-layer stack 103a is not within the top region 122.

Referring to fig. 17B and 18B, cross-sectional view 1700B and cross-sectional view 1800B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3B and 4B, where the upper inner surface of the magnetic shield structure 105 is spaced apart from the bottom inner surface of the magnetic shield structure 105 by a first air gap. The upper inside wall of the magnetic shield structure 105 is spaced apart by a second air gap. In some embodiments, for example, a first air gap is present in the bottom portion 124b of the sidewall region 124 and a second air gap is present in the top region 122, rather than in the magnetic layer 102. Furthermore, in some embodiments, a portion of the magnetic layer 102 is not within the bottom portion 124b of the sidewall region 124 and the first instantiation of the second multi-layer stack 103b is not within the top region 122.

Referring to fig. 17C and 18C, cross-sectional view 1700C and cross-sectional view 1800C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3C and 4C, where the upper inner surface of the magnetic shield structure 105 is spaced apart from the bottom inner surface of the magnetic shield structure 105 by a first air gap. The upper inside wall of the magnetic shield structure 105 is spaced apart by a second air gap. In some embodiments, for example, a first air gap is present in the bottom portion 124b of the sidewall region 124 and a second air gap is present in the top region 122, rather than in the magnetic layer 102. Furthermore, in some embodiments, a portion of the magnetic layer 102 is not within the bottom portion 124b of the sidewall region 124 and the first instantiation of the third multi-layer stack 103c is not within the top region 122.

With reference to fig. 17A-17C and 18A-18C, in some embodiments, an upper support structure 702 is within the top region 122, providing structural support for the magnetic shield structure 105. Side support structures 1102 provide structural support for the magnetic shield structure 105 within the bottom portion 124b of the sidewall region 124. In some embodiments, there is no upper support structure 702 and/or side support structures 1102. In some embodiments, the side support structures 1102 continuously extend between the upper and lower inner surfaces of the magnetic shield structure 105 in the bottom portion 124b of the sidewall region 124. In some embodiments, the upper support structure 702 extends continuously between the inner sidewalls of the magnetic shield structure 105 in the top region 122. In some embodiments, the second instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c each extend between outer sidewalls of the sidewall region 124. Wherein outer sidewalls of the second instantiation of the respective first multi-layer stack 103a, second multi-layer stack 103b and third multi-layer stack 103c are aligned with outer sidewalls of the top surface of the magnetic shielding structure 105. In some embodiments, the second instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c are confined within the bottom region 126 and do not extend to the sidewall region 124, respectively.

Referring to fig. 19A and 20A, cross-sectional views 1900A and 2000A in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where the upper surface of the chip 106 is covered by an air gap and not covered by the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the top portion 124a and the top region 122 of the sidewall region 124, rather than in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, a portion of the third instantiation of the first multi-layer stack 103a is not within the top portion 124a of the sidewall region 124, and the first instantiation of the first multi-layer stack 103a is not within the top region 122.

Referring to fig. 19B and 20B, cross-sectional views 1900B and 2000B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3B and 4B, where the upper surface of the chip 106 is covered by an air gap and not covered by the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the top portion 124a and the top region 122 of the sidewall region 124, rather than in the magnetic layer 102 and the dielectric layer 104. Furthermore, in some embodiments, a portion of the magnetic layer 102 is not within the top portion 124a of the sidewall region 124 and the first instantiation of the second multi-layer stack 103b is not within the top region 122.

Referring to fig. 19C and 20C, cross-sectional views 1900C and 2000C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3C and 4C, where the upper surface of the chip 106 is covered by an air gap and not covered by the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the top portion 124a and the top region 122 of the sidewall region 124, rather than in the magnetic layer 102 and the dielectric layer 104. Furthermore, in some embodiments, a portion of the magnetic layer 102 is not within the top portion 124a of the sidewall region 124 and the first instantiation of the third multi-layer stack 103c is not within the top region 122.

Referring to fig. 19A-19C and 20A-20C, in some embodiments, top surface support structures 1902 are within top portions 124a and top regions 122 of sidewall regions 124, providing structural support for magnetic shield structure 105. The top surface support structures 1902 extend continuously between the outer sidewalls of the bottom portion 124b of the sidewall region 124. In some embodiments, the top surface support structures 1902 extend continuously between the top portion 124a of the sidewall region 124 and the first sidewall 1904 of the magnetic shielding structure 105 and the second sidewall 1906 of the magnetic shielding structure 105 in the top region 122. The top surface support structure 1902 may comprise, for example, a dielectric sheet, an insulator sheet, or a thin metal layer. In some embodiments, there is no top surface to support structure 1902. In some embodiments, the second instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c each extend between outer sidewalls of the sidewall region 124. Wherein outer sidewalls of the second instantiation of the respective first multi-layer stack 103a, second multi-layer stack 103b and third multi-layer stack 103c are aligned with outer sidewalls of the magnetic shielding structure 105. In some embodiments, the second instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c are confined within the bottom region 126 and do not extend to the sidewall region 124, respectively.

Referring to fig. 21A and 22A, cross-sectional view 2100a and cross-sectional view 2200a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory device of fig. 3A and 4A, where an upper inner surface of the magnetic shield structure 105 is separated from a bottom inner surface of the magnetic shield structure 105 by an air gap. In some embodiments, for example, air gaps are present in the sidewall regions 124 rather than in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the third instantiation of the first multi-layer stack 103a is not within the sidewall region 124.

Referring to fig. 21B and 22B, cross-sectional view 2100B and cross-sectional view 2200B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3B and 4B, where the upper inner surface of the magnetic shield structure 105 is separated from the bottom inner surface of the magnetic shield structure 105 by an air gap. In some embodiments, for example, air gaps are present in the sidewall regions 124 rather than in the magnetic layer 102. Furthermore, in some embodiments, the magnetic layer 102 is not within the sidewall region 124.

Referring to fig. 21C and 22C, cross-sectional view 2100C and cross-sectional view 2200C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3C and 4C, where the upper inner surface of the magnetic shield structure 105 is separated from the bottom inner surface of the magnetic shield structure 105 by an air gap. In some embodiments, for example, air gaps are present in the sidewall regions 124 rather than in the magnetic layer 102. Furthermore, in some embodiments, the magnetic layer 102 is not within the sidewall region 124.

With reference to fig. 21A-21C and 22A-22C, in some embodiments, sidewall support structures 2102 are within sidewall regions 124 to provide structural support for magnetic shield structure 105. Sidewall support structure 2102 extends continuously between top region 122 and bottom region 126. In some embodiments, sidewall support structures 2102 continuously extend between a bottom interior surface and an upper interior surface of magnetic shield 105 in sidewall region 124. The sidewall support structure 2102 may include, for example, a dielectric sheet, an insulator sheet, or a thin metal layer. In some embodiments, sidewall support structure 2102 is absent. In some embodiments, the first instantiation and the second instantiation of the first multi-layer stack 103a, the second multi-layer stack 103b, and the third multi-layer stack 103c, respectively, extend between outer sidewalls of the sidewall region 124. Wherein outer sidewalls of the first and second instantiations of the respective first, second and third multi-layer stacks 103a, 103b, 103c are aligned with outer sidewalls of the magnetic shielding structure 105. In some embodiments, the first and second instantiations of the first, second, and third multi-layer stacks 103a, 103b, 103c are confined within the top and bottom regions 122, 126, respectively, and do not extend to the sidewall region 124.

Referring to fig. 23A and 24A, cross-sectional view 2300a and cross-sectional view 2400a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3A and 4A, where the upper inner surface of magnetic shield structure 105 is separated from PCB 101 by an air gap. In some embodiments, for example, air gaps are present in the sidewall regions 124 and the bottom region 126 instead of in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the third instantiation of the first multi-layer stack 103a is not within the sidewall region 124 and the second instantiation of the first multi-layer stack 103a is not within the bottom region 126.

Referring to fig. 23B and 24B, cross-sectional view 2300B and cross-sectional view 2400B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3B and 4B, where the upper inner surface of magnetic shield structure 105 is separated from PCB 101 by an air gap. In some embodiments, for example, air gaps are present in the sidewall regions 124 and the bottom region 126 instead of in the magnetic layer 102 and the dielectric layer 104. Furthermore, in some embodiments, the magnetic layer 102 is not within the sidewall region 124 and the second instantiation of the second multi-layer stack 103b is not within the bottom region 126.

Referring to fig. 23C and 24C, a cross-sectional view 2300C and a cross-sectional view 2400C in the z-x plane and the z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3C and 4C, where the upper inner surface of the magnetic shield structure 105 is separated from the PCB 101 by an air gap. In some embodiments, for example, air gaps are present in the sidewall regions 124 and the bottom region 126 instead of in the magnetic layer 102 and the dielectric layer 104. Furthermore, in some embodiments, the magnetic layer 102 is not within the sidewall region 124 and the second instantiation of the third multi-layer stack 103c is not within the bottom region 126.

Referring to fig. 23A-23C and 24A-24C, in some embodiments, lower surface support structures 2302 are within the sidewall regions 124 and the bottom region 126 to provide structural support for the magnetic shielding structure 105. The lower surface support structure 2302 continuously extends between the outer sidewalls of the top section 122. In some embodiments, the lower surface support structures 2302 continuously extend between the first sidewalls 2304 of the magnetic shielding structures 105 and the second sidewalls 2306 of the magnetic shielding structures 105 in the sidewall regions 124 and the bottom region 126. The lower surface support structure 2302 may comprise a dielectric sheet, an insulator sheet, or a thin metal layer, for example. In some embodiments, there is no lower surface support structure 2302. In some embodiments, the first instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b, and the third multi-layer stack 103c each extend between outer sidewalls of the sidewall region 124. Wherein outer sidewalls of the first instantiation of the respective first multi-layer stack 103a, second multi-layer stack 103b and third multi-layer stack 103c are aligned with outer sidewalls of the magnetic shielding structure 105. In some embodiments, the first instantiation of the first multi-layer stack 103a, the second multi-layer stack 103b, and the third multi-layer stack 103c are confined within the top region 122 and do not extend to the sidewall region 124, respectively.

Referring to fig. 25A and 26A, cross-sectional views 2500a and 2500a in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3A and 4A, where the upper surface of the chip 106 is covered by an air gap and not covered by the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the sidewall regions 124 and the top region 122 instead of in the magnetic layer 102 and the dielectric layer 104. Further, in some embodiments, the third instantiation of the first multi-layer stack 103a is not within the sidewall region 124 and the first instantiation of the first multi-layer stack 103a is not within the top region 122.

Referring to fig. 25B and 26B, cross-sectional view 2500B and cross-sectional view 2600B in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3B and 4B, where the upper surface of the chip 106 is covered by the air gap and not covered by the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the sidewall regions 124 and the top region 122 instead of in the magnetic layer 102 and the dielectric layer 104. Furthermore, in some embodiments, the magnetic layer 102 is not within the sidewall region 124 and the first instantiation of the second multi-layer stack 103b is not within the top region 122.

Referring to fig. 25C and 26C, cross-sectional views 2500C and 2600C in the z-x plane and z-y plane, respectively, are provided for some alternative embodiments of the memory devices of fig. 3C and 4C, where the upper surface of the chip 106 is covered by the air gap and not covered by the magnetic shield structure 105. In some embodiments, for example, air gaps are present in the sidewall regions 124 and the top region 122 instead of in the magnetic layer 102 and the dielectric layer 104. Furthermore, in some embodiments, the magnetic layer 102 is not within the sidewall region 124 and the first instantiation of the third multi-layer stack 103c is not within the top region 122.

Referring to fig. 25A-25C and 26A-26C, in some embodiments, upper surface support structures 2502 are within sidewall regions 124 and top region 122 to provide structural support for magnetic shield structure 105. Upper surface support structure 2502 extends continuously between the outer sidewalls of bottom region 126. In some embodiments, the upper surface support structure 2502 extends continuously between the first sidewall 2504 of the magnetic shielding structure 105 and the second sidewall 2506 of the magnetic shielding structure 105 in the sidewall region 124 and the top region 122. The upper surface support structure 2502 may comprise, for example, a dielectric sheet, an insulator sheet, or a thin metal layer. In some embodiments, there is no upper surface support structure 2502. In some embodiments, the second instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c each extend between outer sidewalls of the sidewall region 124. Wherein outer sidewalls of the second instantiation of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c are aligned with outer sidewalls of the magnetic shielding structure 105. In some embodiments, the second instantiations of the first multi-layer stack 103a, the second multi-layer stack 103b and the third multi-layer stack 103c are confined within the bottom region 126 and do not extend to the sidewall region 124, respectively.

Referring to any of the embodiments of fig. 3A-3C and 4A-4C, and 3A-3C and 4A-4C, it can be appreciated that any air gap (e.g., air gap, first air gap, second air gap, etc.) can include air and/or material from the insulating structure 120.

Referring to fig. 27, 28A, 28B, 29, 30A, 30B, 31, 32A, and 32B, cross-sectional view 2700, cross-sectional view 2800A, cross-sectional view 2800B, cross-sectional view 2900, cross-sectional view 3000A, cross-sectional view 3100, cross-sectional view 3200A, and cross-sectional view 3200B of various embodiments of a method for forming a cross-section of a magnetic field shielding structure are provided. The method is illustrated using the embodiments of the memory device in fig. 3A-3B and fig. 4A-4B. Nonetheless, the method may be used to form an embodiment of the memory device in any of fig. 5A-5C, 6A-6C, 7A-7C, 8A-8C, 9A-9C, 10A-10C, 11A-11C, 12A-12C, 13A-13C, 14A-14C, 15A-15C, 16A-16C, 17A-17C, 18A-18C, 19A-19C, 20A-20C, 21A-21C, 22A-22C, 23A-23C, 24A-24C, 25A-25C, and 26A-26C. In addition, as seen below, fig. 27, 28A, and 28B correspond to a method for forming the first multi-layer stack 103 a. Fig. 27, 28A, 28B, 29, 30A and 30B correspond to a method for forming the second multi-layer stack 103B. Fig. 27, 28A, 28B, 29, 30A, 30B, 31, 32A and 32B correspond to a method for forming the third multi-layer stack 103 c.

Although the cross-sectional view 2700, cross-sectional view 2800A, cross-sectional view 2800B, cross-sectional view 2900, cross-sectional view 3000A, cross-sectional view 3000B, cross-sectional view 3100, cross-sectional view 3200A and cross-sectional view 3200B illustrated in fig. 27, 28A, 28B, 29, 30A and 32B are described with reference to a method, it should be understood that the structure illustrated in fig. 27, 28A, 28B, 29, 30A, 30B, 31, 32A and 32B is not limited to, but may be independent of, the method. While figures 27, 28A, 28B, 29, 30A, 30B, 31, 32A, and 32B are described as a series of acts, it is to be understood that these acts are not limited, as the order of acts may be varied in other embodiments and that the disclosed methods are applicable to other structures as well. In other embodiments, some acts shown and/or described may be omitted, in whole or in part.

As shown by the perspective view, the cross-sectional view 2700 of fig. 27 with the front portion removed, the magnetic layer 102 (in some embodiments, a foil/tape or plate) and the dielectric layer 104 (in some embodiments, a foil/tape or plate) are laminated/coated with an adhesive layer (not shown). In some embodiments, the adhesive layer is a foil, strip, or plate overlying the magnetic layer 102 and the dielectric layer 104, respectively. In still other embodiments, a substantially thin layer of adhesive layer completely encapsulates the magnetic layer 102 and the dielectric layer 104, respectively. In some embodiments, the adhesive layer is an insulating adhesive layer. The first pair of layers 2702 is defined by the single magnetic layer 102 and the single dielectric layer 104.

As shown by the perspective view, with the front portion removed, cross-sectional view 2800a of fig. 28A, at least one or more pairs of magnetic layers 102 of the adhesive stack and dielectric layers 104 of the adhesive stack are formed over the first pair of layers 2702. The magnetic layer 102 of the last adhesive stack is formed over at least one or more pairs of magnetic layers 102 of the adhesive stack and dielectric layers 104 of the adhesive stack. The stack of layers 2802 is defined by the magnetic layer 102 of the last adhesive stack overlapping at least one or more pairs of magnetic layers 102 of the adhesive stack and dielectric layers 104 of the adhesive stack.

As shown by the perspective view, the cross-sectional view of fig. 28B with the front portion removed2800b, the stack of layers (stack 2802 of layers of fig. 28A) adheres to the first pair of layers (first pair of layers 2702 of fig. 28A) to define a first multilayer foil 2804. The top surface 2804a of the first multilayer sheet 2804 is defined by the top surface of the magnetic layer 102 of the last adhesive stack (of fig. 28A). The bottom surface 2804b of the first multilayer sheet 2804 is defined by the bottom surfaces of the magnetic layers 102 of the first pair of layers (the first pair of layers 2702 of fig. 28A). For example, the length L of the first multi-layer sheet 2804₁In the range of about 4 mm to about 10 cm, and the width W of the first multilayer foil 2804₁In the range of about 4 millimeters to about 10 centimeters, or some other suitable value. In some embodiments, the length L of the first multilayer foil 2804₁And width W₁Are respectively formed to a value suitable for the first multi-layer stack 103 a. In still other embodiments, the length L of the first multi-layer sheet 2804₁And width W₁Are respectively formed to a value substantially greater than the first multi-layer stack 103 a. In some embodiments, the first multilayer sheet 2804 includes at least three or more magnetic layers 102 and three or more dielectric layers 104.

Thickness T_mThe thickness of each magnetic layer 102 in the first multilayer foil 2804 is defined. Thickness T_mIn the range of about 10 microns to about 1,000 microns, or some other suitable value. In some embodiments, the thickness T of each magnetic layer 102 in the first multilayer sheet 2804_mThe same is true. In some embodiments, the thickness T of the first plurality of magnetic layers 102 in the first multi-layer sheet 2804_mThe same, and the thicknesses of the second plurality of magnetic layers 102 in the first multilayer sheet 2804 are different. In yet another embodiment, the magnetic layer 102 of the first pair of layers (the first pair of layers 2702 of FIG. 28A) is substantially thicker than the thickness of the magnetic layer 102 in the stack of layers (the stack 2802 of layers of FIG. 28A). The magnetic layer 102 may be or may include, for example, iron (Fe), cobalt (Co), nickel (Ni), some other magnetic material, some other conductive material, or the like.

Thickness T_dThe thickness of each dielectric layer 104 in the first multilayer foil 2804 is defined. Thickness T_dIn the range of about 10 nanometers to about 1,000 micrometers, or some other suitable value. In some implementationsIn an example, the thickness T of each dielectric layer 104 in the first multilayer foil 2804_dThe same is true. In some embodiments, the thickness T of the first plurality of dielectric layers 104 in the first multilayer foil 2804_dThe same, and the thickness of the second plurality of dielectric layers 104 in the first multilayer sheet 2804 is different. In yet another embodiment, the dielectric layer 104 of the first pair of layers (the first pair of layers 2702 of fig. 28A) is substantially thicker than the thickness of the dielectric layer 104 in the stack of layers (the stack 2802 of layers of fig. 28A). The dielectric layer 104 may be or may include, for example, a low-k dielectric, silicon oxide, a high-k dielectric, some other dielectric, or any combination of the preceding.

As shown by the perspective view, the cross-sectional view 2900 of fig. 29, with the front portion removed, sets a distance D from an outer edge of the first multi-layer sheet 2804_dTo define a first cut line 2902. Distance D_dIn the range of about 1 micron to 10,000 microns, about 1 micron to 5,000 microns, about 5,000 microns to 10,000 microns, or some other suitable value.

As shown by the perspective view, with the front portion removed, the cross-sectional view 3000A of fig. 30A cuts (or cuts) the first multi-layer sheet (the first multi-layer sheet 2804 of fig. 29) along a first cut line (the first cut line 2902 of fig. 29) to define the second multi-layer sheet 3002. Distance D_dDefining the width of the second multilayer foil 3002.

As shown by the perspective view, with the front portion removed, cross-sectional view 3000B of fig. 30B, second multilayer sheet 3002 (of fig. 30A) is rotated 90 degrees. The top surface 3002a of the second multilayer sheet 3002 comprises the top surfaces of the plurality of strips of magnetic layer 102 and dielectric layer 104. Bottom surface 3002b of second multilayer sheet 3002 comprises the bottom surfaces of the plurality of strips of magnetic layer 102 and dielectric layer 104. In some embodiments, second multilayer sheet 3002 includes at least three or more magnetic strips 102 and two or more dielectric strips 104. In some embodiments, second multilayer sheet 3002 defines a second multilayer stack 103 b.

As shown by the perspective view, the cross-sectional view 3100 of fig. 31, a plurality M, with the front portion removedA number (greater than 2) of first multilayer sheets (first multilayer sheets 2804 of fig. 29) are disposed between the dielectric layers 104 of the M-1 adhesive stacks. A plurality M of first multi-layer sheets 2804 are adhered (or glued) to the dielectric layers 104 of the respective M-1 adhesive stacks. In some embodiments, M is a number equal to or greater than 4. Setting a distance D from outer edges of the plurality of M first multilayer sheets 2804_dTo define a second cut line 3102. Distance D_dIn the range of about 10 microns to about 10,000 microns, or some other suitable value. Thickness L of each of the dielectric layers 104 of the M-1 adhesive stack_iIn the range of about 10 nanometers to about 1,000 micrometers, respectively, or some other suitable value.

As shown by the perspective view, with the front portion removed, the cross-sectional view 3200a of fig. 32A cuts (or cuts) the plurality M of first multilayer sheets 2804 and M-1 dielectric layers 104 of the adhesive stack along a second cut line (the second cut line 3102 of fig. 31) to define a third multilayer sheet 3202. Distance D_dThe width of the third multilayered sheet 3202 is defined.

As shown by the perspective view, with the front portion removed, the cross-sectional view 3200B of fig. 32B, rotates the third multilayered sheet 3202 (of fig. 32A) by 90 degrees. The top surface 3202a of the third multilayered sheet 3202 includes top surfaces of the plurality of rectangles of magnetic layers 102 and dielectric layers 104 and the plurality of strips of dielectric layers 104. The bottom surface 3202b of the third multilayered sheet 3202 includes bottom surfaces of the plurality of rectangles of magnetic layers 102 and dielectric layers 104 and the plurality of strips of dielectric layers 104. In some embodiments, the plurality of rectangles of magnetic layer 102 and dielectric layer 104 each include at least nine rectangles. In some embodiments, the plurality of strips of dielectric layer 104 includes at least three strips. In some embodiments, the third multi-layer sheet 3202 defines a third multi-layer stack 103 c.

Referring to fig. 33, 34, 35A-35C, and 36A-36C, a cross-sectional view 3300, a cross-sectional view 3400, a cross-sectional view 3500a, a cross-sectional view 3500b, a cross-sectional view 3500C, a cross-sectional view 3600a, a cross-sectional view 3600b, and a cross-sectional view 3600C of various embodiments of methods for forming magnetic field shielding structures are provided. The method is illustrated using the embodiments of the memory device in fig. 3A-3B and fig. 4A-4B. Nonetheless, the method may be used to form an embodiment of the memory device in any of fig. 5A-5C, 6A-6C, 7A-7C, 8A-8C, 9A-9C, 10A-10C, 11A-11C, 12A-12C, 13A-13C, 14A-14C, 15A-15C, 16A-16C, 17A-17C, 18A-18C, 19A-19C, 20A-20C, 21A-21C, 22A-22C, 23A-23C, 24A-24C, 25A-25C, and 26A-26C. In addition, as seen below, fig. 33, 34, 35A to 35C, and 36A to 36C correspond to a method for forming the magnetic-field-shielding structure 105 including the first multi-layer stack 103a, the second multi-layer stack 103b, or the third multi-layer stack 130C.

Although the cross-sectional view 3300, cross-sectional view 3400, cross-sectional view 3500a, cross-sectional view 3500b, cross-sectional view 3500C, cross-sectional view 3600a, cross-sectional view 3600b, and cross-sectional view 3600C depicted in fig. 33, 34, 35A-35C, and 36A-36C are described with reference to a method, it should be understood that the structures depicted in fig. 33, 34, 35A-35C, and 36A-36C are not limited to, but may be independent of, the method. While fig. 33, 34, 35A-35C, and 36A-36C are described as a series of acts, it will be appreciated that these acts are not limited as the order of acts may be varied in other embodiments and that the disclosed methods are applicable to other structures as well. In other embodiments, some acts shown and/or described may be omitted, in whole or in part.

As shown by the cross-sectional view 3300 of fig. 33 in the z-x plane, the chip 106 is encapsulated by the insulating structure 120. A plurality of holes are defined in the insulating structure 120 outside the sidewall regions of the die 106. The electrical connections 108 extend through the plurality of apertures. A top region 3302 is defined above the top surface of the chip 106. A bottom region 3306 is defined above the bottom surface of the chip 106. A first sidewall region 3304 and a second sidewall region 3308 are defined laterally displaced from the sidewall regions of the chip 106. A plurality of first, second or third multi-layer stacks 103a, 103b, 103c are formed, respectively. A top multi-layer stack of the plurality of first, second or third multi-layer stacks 103a, 103b, 103c is cut to conform to the dimensions of the top surface of the chip 106 and/or the insulating structure 120 and placed in the top region 3302. A bottom multi-layer stack of the plurality of first, second, or third multi-layer stacks 103a, 103b, 103c is cut to conform to the dimensions of the bottom surface of the chip 106 and/or the insulating structure 120 and placed in the bottom region 3306. The first multilayer stack 103a or the first sidewall stack of magnetic layers 102 is cut to conform to the dimensions of the first sidewalls of the chip 106 and/or insulating structure 120 and placed in the first sidewall area 3304. The first multi-layer stack 103a or the second sidewall stack of the magnetic layer 102 is cut to conform to the dimensions of the second sidewall of the chip 106 and/or the insulating structure 120 and placed in the second sidewall region 3308.

Referring to fig. 34, a cross-sectional view 3400 of some embodiments of the memory device of fig. 33 in the z-y plane in which third sidewall regions 3310 and fourth sidewall regions 3312 are defined laterally displaced from the sidewall regions of the chip 106. The first multi-layer stack 103a or the third sidewall stack of the magnetic layer 102 is cut to conform to the dimensions of the third sidewall of the chip 106 and/or the insulating structure 120 and placed in the third sidewall region 3310. The fourth sidewall stack of the first multi-layer stack 103a or the magnetic layer 102 is cut to conform to the dimensions of the fourth sidewall of the chip 106 and/or the insulating structure 120 and placed in the fourth sidewall area 3312. The stacks respectively located in the top region 3302, the bottom region 3306, the first sidewall region 3304, the second sidewall region 3308, the third sidewall region 3310, and the fourth sidewall region 3312 are adhered to respective surfaces of the chip 106 or the insulating structure 120. In some embodiments, the first sidewall stack, the second sidewall stack, the third sidewall stack, and the fourth sidewall stack each include a plurality of holes or openings cut to the electrical connections 108.

As illustrated by cross-sectional views 3500 a-3500C of fig. 35A-35C in the z-x plane, the top, bottom, first, second, third, and fourth sidewall stacks are glued/adhered to the top, bottom, first, second, third, and fourth sidewalls, respectively, of the insulating structure 120 to define the magnetic shield structure 105.

As shown by cross-sectional view 3600a through cross-sectional view 3600C of fig. 36A through 36C in the z-x plane, insulating structure 120 is formed around the outer surface of magnetic shield structure 105 to define encapsulation structure 121.

Referring to fig. 37, a block diagram 3700 of some embodiments of a method 3700 directed to the methods of fig. 27, 28A, 28B, 29, 30A, 30B, 31, 32A, and 32B is provided.

At action 3702, a first magnetic foil/strip/plate is laminated with an adhesive. Fig. 27 shows a cross-sectional view 2700 of some embodiments corresponding to act 3702.

At act 3704, a dielectric foil/tape/plate forming a first adhesive stack is over the first magnetic foil/tape/plate. Fig. 27 shows a cross-sectional view 2700 of some embodiments corresponding to act 3704.

At action 3706, N number pairs of magnetic and dielectric foils/strips/plates of the adhesive stack are formed over the first adhesive dielectric foil/strip/plate (N is an integer greater than or equal to 1). Fig. 28A and 28B illustrate cross-sectional view 2800a and cross-sectional view 2800B for some embodiments of action 3706.

At act 3708, a magnetic foil/strip/sheet of a second glue stack is formed over the N number pairs of magnetic and dielectric foils/strips/sheets of the adhesive stack to define a first multi-layer stack. Fig. 28A and 28B illustrate cross-sectional view 2800a and cross-sectional view 2800B for some embodiments of action 3708.

At act 3710a, the first multi-layer stack is cut or diced to a thickness less than a thickness of the first multi-layer stack to define a second multi-layer stack. Fig. 29, 30A, and 30B illustrate cross-sectional view 2900, cross-sectional view 3000A, and cross-sectional view 3000B of some embodiments corresponding to act 3710A.

At act 3710b, a first multi-layer stack is formed M times. Fig. 31 illustrates a cross-sectional view 3100 of some embodiments, corresponding to act 3710 b.

At act 3712b, a multi-layer structure is formed by gluing M-1 dielectric foils/strips/plates, respectively, between M first multi-layer stacks. Fig. 31 illustrates a cross-sectional view 3100 of some embodiments corresponding to act 3712 b.

At act 3714b, the multi-layer structure is cut or diced to a thickness less than the thickness of the multi-layer structure to define a third multi-layer stack. Fig. 32A and 32B illustrate cross-sectional view 3200a and cross-sectional view 3200B of some embodiments corresponding to act 3714B.

Referring to fig. 38, a block diagram 3800 of some embodiments of a method 3800 for the methods of fig. 33, 34, 35A-35C, and 36A-36C is provided.

At act 3802, a first multi-layer stack, a second multi-layer stack, or a third multi-layer stack is formed. Fig. 33 illustrates a cross-sectional view 3300 of some embodiments that corresponds to act 3802.

At act 3804a, the first multi-layer stack is trimmed or cut to conform to dimensions of a package top area, a package bottom area, and a package sidewall area. Fig. 33 and 34 illustrate a cross-sectional view 3300 and a cross-sectional view 3400 of some embodiments corresponding to act 3804 a.

At act 3804b, the second or third multi-layer stack is cut or diced to conform to dimensions of a package top area and a package bottom area. Fig. 33 and 34 illustrate cross-sectional view 3300 and cross-sectional view 3400 of some embodiments corresponding to act 3804 b.

At act 3806b, the adhesive coated magnetic foil/tape/board is cut or diced to conform to the dimensions of the package sidewall area. Fig. 33 and 34 illustrate cross-sectional view 3300 and cross-sectional view 3400 of some embodiments corresponding to act 3806 b.

At act 3808, the cut first, second, or third multi-layer stack is adhered to the package top surface and the package bottom surface, and the cut adhesive coated magnetic foil/tape/sheet or the first multi-layer stack is adhered to the package sidewall surface. Fig. 33 and 34 illustrate cross-sectional view 3300 and cross-sectional view 3400 of some embodiments that correspond to act 3808.

Accordingly, in some embodiments, the present application relates to a magnetic field shielding structure comprising a magnetic layer and a dielectric layer at least partially surrounding a chip.

In some embodiments, the present application provides a memory device comprising: a chip including Magnetoresistive Random Access Memory (MRAM) cells; and a magnetic field shielding structure at least partially surrounding the chip and including a magnetic layer and a dielectric layer. In some embodiments, the magnetic field shielding structure comprises a top region above an upper surface of the chip, a bottom region below a lower surface of the chip, a sidewall region extending between the top region and the bottom region, wherein electrical connections extend through the sidewall region and are coupled to the chip. In some embodiments, the magnetic field shielding structure comprises: a first multi-layer stack disposed at a first distance above an upper surface of the chip; and a second multi-layer stack disposed at the first distance below a lower surface of the chip, wherein the second multi-layer stack is the same as the first multi-layer stack. In some embodiments, the magnetic field shielding structure further comprises a sidewall region made of a magnetic material extending between the first and second multi-layer stacks, wherein the sidewall region is disposed at the first distance from a sidewall of the chip. In some embodiments, the memory device further comprises an insulating adhesive disposed over the magnetic layer and the dielectric layer; wherein the magnetic layer is a continuous sheet of magnetic material disposed over the chip, the continuous sheet of magnetic material having a length and a width that are greater than a length and a width, respectively, of a top surface of the chip; and wherein the dielectric layer is a continuous sheet of dielectric material disposed over the continuous sheet of magnetic material, the continuous sheet of dielectric material having a length and a width that are greater than the length and the width, respectively, of the top surface of the chip. In some embodiments, the magnetic field shielding structure comprises a plurality of strips of magnetic material arranged in a plane above an upper surface of the chip, each strip of magnetic material having a length greater than a length of a top surface of the chip and having a width less than a width of the top surface of the chip; and a plurality of strips of dielectric material arranged in the plane and separating the plurality of strips of magnetic material from each other, each strip of dielectric material having a length greater than the length of the top surface of the chip and a width less than the width of the top surface of the chip. In some embodiments, the magnetic layer comprises a plurality of magnetic regions spaced apart from one another in a series of rows and columns over an upper surface of the chip, and wherein the dielectric layer comprises a plurality of linear sections of dielectric material that intersect perpendicularly to one another to form a grid, wherein the magnetic regions are arranged within the grid such that adjacent magnetic regions are separated from one another by at least one linear section of dielectric material, the dielectric layer having a length and a width that are greater than a length and a width, respectively, of the upper surface of the chip. In some embodiments, the memory device further comprises an insulating material encapsulating the chip to define a package structure, wherein there is a non-zero distance between an outer surface of the package structure and an inner surface of the magnetic field shielding structure, wherein the magnetic field shielding structure at least partially surrounds the package structure. In some embodiments, the memory device further comprises an insulating material encapsulating the chip and the magnetic field shielding structure, wherein the insulating material is disposed between an outer surface of the chip and an inner surface of the magnetic field shielding structure, wherein the outer surface of the insulating material is outside of the outer surface of the magnetic field shielding structure; and an electrical connector extending through the insulating material to electrically couple the die to a lead frame configured to be mounted to a Printed Circuit Board (PCB). In some embodiments, the chip is rectangular, the rectangle comprising a top region, a bottom region, and a sidewall region comprising four regions, the sidewall region extending between the top region and the bottom region, wherein the magnetic field shielding structure covers a first pair of the four regions, the top region, and the bottom region of the sidewall region, wherein the magnetic field shielding structure leaves a remaining pair of the four regions of the sidewall region exposed to a magnetic field, wherein the magnetic field shielding structure shields the first pair of the four regions, the top region, and the bottom region of the sidewall region from the magnetic field. In some embodiments, the chip comprises six surfaces, wherein the magnetic field shielding structure covers at least a first set of two of the six surfaces and leaves a second set of two of the six surfaces exposed to a magnetic field, the first set of two of the six surfaces being parallel, wherein the magnetic field shielding structure shields the first set of two of the six surfaces from magnetic fields.

In some embodiments, the present application provides a memory device comprising: a chip including Magnetoresistive Random Access Memory (MRAM) cells, the chip including an upper face, a bottom face, and sidewalls extending between the upper face and the bottom face; a magnetic field shielding structure at least partially surrounding the chip, comprising a multilayer stack comprised of magnetic layers and dielectric layers, the magnetic field shielding structure comprising a top region above an upper face of the chip, a bottom region below the bottom face of the chip, and sidewall regions laterally surrounding sidewalls of the chip, the sidewall regions of the magnetic field shielding structure present in an opening, an electrical connection extending through the opening and coupled to the chip, a first magnetic region located inside an inner surface of the magnetic field shielding structure and a second magnetic region located directly outside an outer surface of the magnetic field shielding structure, and a magnetic field in the first magnetic region being smaller than a magnetic field in the second magnetic region. In some embodiments, the magnetic field in the second magnetic region is 80% greater than the magnetic field in the first magnetic region. In some embodiments, a pair of layers includes the magnetic layer disposed over the dielectric layer, the multilayer stack being comprised of one or more of the pair of layers disposed over the magnetic layer and an insulating adhesive, wherein a length and width of the magnetic layer is greater than a length and width of the upper face of the chip. In some embodiments, the top region, bottom region, and sidewall region comprise the multilayer stack. In some embodiments, a pair of layers includes the magnetic layer disposed laterally adjacent the dielectric layer, the multilayer stack being comprised of three or more of the pair of layers, wherein a length of the magnetic layer is greater than a length of the upper face of the chip, wherein a width of the magnetic layer is less than a width of the upper face of the chip, wherein a length and a width of the multilayer stack are greater than the length and a width of the upper face of the chip. In some embodiments, the top region and the bottom region comprise the multilayer stack, wherein the sidewall region comprises the magnetic layer. In some embodiments, the multilayer stack is comprised of a plurality of rectangles of the magnetic layer, each of the rectangles separated by the dielectric layer, wherein a length and width of the multilayer stack is greater than the length and width of the upper face of the chip. In some embodiments, the top region and the bottom region comprise the multilayer stack, wherein the sidewall region comprises the magnetic layer.

In some embodiments, the present application provides a method of manufacturing a memory device, the method comprising: forming one or more multi-layer stacks, the multi-layer stacks comprising a magnetic layer and a dielectric layer; forming one or more magnetic layers; cutting the one or more multilayer stacks and the one or more magnetic layers to conform to dimensions of a package structure, the package structure comprising a chip including Magnetoresistive Random Access Memory (MRAM) cells and an insulating material encapsulating the chip, an outer surface of the package structure comprising the insulating material; and adhering the cut one or more multi-layer stacks and the cut one or more magnetic layers to an outer surface of the package structure.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.