阅读说明：本技术 封装环结构 (Packaging ring structure ) 是由 姚海标 邢溯 廖晋宇 马瑞吉 于 2020-06-01 设计创作，主要内容包括：本发明公开一种封装环(seal ring)结构,包含一基底,以及一封装环,位于该基底上其中该封装环包含一内部封装环,包含多个内部封装元件(inner seal unit),其中各该内部封装元件彼此之间相互间隔排列,一外部封装环,包含多个外部封装元件(outer seal unit),排列于内部封装环外围,其中各该外部封装元件彼此之间相互间隔排列,以及多组栅栏状封装元件(fence-shaped seal structures),其中至少一组栅栏状封装元件位于其中一个该内部封装元件与另一相邻的该外部封装元件之间。(The invention discloses a packaging ring (seal ring) structure, comprising a substrate and a packaging ring, wherein the packaging ring is positioned on the substrate, the packaging ring comprises an inner packaging ring comprising a plurality of inner packaging elements (inner seal units), the inner packaging elements are arranged at intervals, an outer packaging ring comprises a plurality of outer packaging elements (outer seal units) arranged at the periphery of the inner packaging ring, the outer packaging elements are arranged at intervals, and a plurality of groups of fence-shaped packaging elements (fence-shaped packaging elements), at least one group of fence-shaped packaging elements are positioned between one inner packaging element and the other adjacent outer packaging element.)

1. A package ring structure, comprising:

a substrate; and

a package ring on the substrate, wherein the package ring comprises:

an inner containment ring comprising a plurality of inner containment elements (inner seal units), wherein the inner containment elements are spaced apart from one another;

an outer package ring including a plurality of outer package elements (outer seal units) arranged at a periphery of the inner package ring, wherein the outer package elements are arranged at intervals; and

a plurality of sets of fence-like encapsulation elements (fe-shaped metal structures), wherein at least one set of fence-like encapsulation elements is located between one of the inner encapsulation elements and another adjacent outer encapsulation element.

2. The package ring structure of claim 1, wherein each group of fence-like package elements comprises a plurality of first fence-like package elements and a plurality of second fence-like package elements.

3. The package ring structure of claim 2 wherein each of said first palisade encapsulation elements does not directly contact each of said second palisade encapsulation elements.

4. The package ring structure of claim 2, wherein a portion of the inner package elements and a portion of the outer package elements are arranged in a first direction, each of the first fence-like package elements and each of the second fence-like package elements are arranged in a second direction, wherein the first direction and the second direction are perpendicular to each other.

5. The package ring structure of claim 2, wherein the shortest distance between the first fence-like package element and the adjacent second fence-like package element is W1, the shortest distance between any one of the inner package elements and the adjacent outer package element is defined as W2, wherein W2/W1> 10.

6. The package ring structure of claim 2, wherein a minimum width of any of said first fence-like package elements is W3, and a minimum width of any of said inner package elements is W4, wherein W4/W3> 20.

7. The package ring structure of claim 4 wherein said inner package ring and said outer package ring are aligned at a corner portion toward a third direction, wherein said third direction is different from said first direction and said second direction.

8. The package ring structure of claim 7 wherein said inner package ring and said outer package ring have a beveled edge at said corner portion.

9. The package ring structure of claim 1, further comprising a plurality of openings between any two adjacent inner package components, wherein each outer package component is arranged corresponding to the plurality of openings.

10. The package ring structure of claim 1 wherein each of the inner package elements or each of the outer package elements comprises a plurality of vertically stacked contact pillars and conductive layers.

11. The package ring structure of claim 10 wherein at least one contact post is electrically connected to the substrate.

12. The package ring structure of claim 11 wherein said contact post, which contacts said substrate, is located at a corner portion of said inner package ring.

13. The package ring structure of claim 1 further comprising circuit components on said substrate.

14. The package ring structure of claim 13 wherein the package ring surrounds the circuit element.

15. The package ring structure of claim 13 wherein the circuit element comprises a radio frequency circuit (RF circuit).

Technical Field

The invention relates to the field of semiconductors, in particular to a packaging ring structure.

Background

As Integrated Circuit (IC) speeds have increased, seal rings (seal rings) have been incorporated into device packages to reduce Radio Frequency (RF) interference and signal cross-coupling. The seal ring may be grounded or connected to a ground signal, such as a dc voltage supply line, to reduce interference. In some cases, the sealing ring may be part of the packaging of the device, where the conductive lid is typically connected to the sealing ring. The seal ring may be incorporated into IC fabrication and may include a conductive cap layer on the substrate.

Existing seal rings are typically composed of one or more interconnected conductive metal layers. From a top view, a closed shape, containing RF circuitry or other pads, which may be connected to input or output signals, in the enclosed area of the seal ring. However, this structure causes a problem in that signals of the pads are coupled to the seal rings, causing signal interference, and the seal rings also block signal transmission of the RF circuits since the RF circuits are used for signal transmission.

Disclosure of Invention

The invention provides a package ring (seal ring) structure, comprising a substrate, and a package ring located on the substrate, wherein the package ring comprises an inner package ring comprising a plurality of inner package elements (inner seal elements), wherein the inner package elements are arranged at intervals, an outer package ring comprising a plurality of outer package elements (outer seal elements) arranged at the periphery of the inner package ring, wherein the outer package elements are arranged at intervals, and a plurality of groups of fence-shaped package elements (fence-shaped package elements), wherein at least one group of fence-shaped package elements is located between one inner package element and another adjacent outer package element.

The invention is characterized in that the fence-shaped packaging structure is arranged between the inner packaging ring and the outer packaging ring, so that the width of a gap between the inner packaging ring and the outer packaging ring is greatly reduced, and moisture can be effectively prevented from entering the circuit element from the gap between the inner packaging ring and the outer packaging ring. It should be noted that, in the embodiment, after the fence-like package structure is disposed, the inner package ring and the outer package ring are not completely contacted to form a closed structure, i.e., a curved path is still left. The signal transmission effect on the circuit elements is also less affected. Therefore, it is able to prevent moisture from entering the low dielectric constant material and the circuit device, and maintain the performance of the circuit device. In addition, the packaging ring is designed into a bevel edge at the corner, so that the packaging ring at the corner is far away from the junction of the cutting channels, and the effect of protecting the central circuit element can be achieved.

Drawings

FIG. 1 is a schematic top view of a semiconductor structure according to a first preferred embodiment of the present invention;

FIG. 2 is a cross-sectional view of the semiconductor structure of FIG. 1 along line A-A';

FIG. 3 is an enlarged view of a portion of the package ring of FIG. 2;

FIG. 4 is a schematic top view of a semiconductor structure according to a second preferred embodiment of the present invention;

FIG. 5 is an enlarged view of a portion of the package ring of FIG. 4;

FIG. 6 is a cross-sectional view of the semiconductor structure of FIG. 5 along line B-B';

FIG. 7 is a cross-sectional view of the semiconductor structure of FIG. 5 along line D-D';

fig. 8 is a schematic top view of the conductive layer and the conductive pillar connecting the first fence-like package structure;

fig. 9 is a partially enlarged view of the corner of the packing ring in this embodiment.

Description of the symbols

10: substrate

12: oxide layer

13: semiconductor layer

14: dielectric layer

20: circuit element

30: packaging ring

31: inner packaging ring

31-1: internal packaging element

32: outer package ring

32-1: external packaging element

33: opening of the container

34: opening of the container

35: voids

36: conductive pole

37: conductive layer

38: contact structure

40: fence-shaped packaging structure

41: first fence-shaped packaging structure

42: second fence-shaped packaging structure

45: curved path

60: cutting path

61: junction point

C: corner

W1: width of

W2: width of

W3: width of

W4: width of

W5: width of

Detailed Description

In order to make the present invention more comprehensible to those skilled in the art, preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings.

For convenience of explanation, the drawings are only schematic to facilitate understanding of the present invention, and the detailed proportions thereof may be adjusted according to design requirements. The relative positions of elements in the figures described herein are understood by those skilled in the art to refer to relative positions of objects and thus all parts may be turned over to present the same elements, all falling within the scope of the present disclosure and all described herein.

Referring to fig. 1 to 3, fig. 1 is a top view of a semiconductor structure according to a first preferred embodiment of the present invention, fig. 2 is a cross-sectional view of the semiconductor structure of fig. 1 along a sectional line a-a', and fig. 3 is a partial enlarged view of a package ring of fig. 2. The semiconductor structure of the present invention includes a substrate 10, on which an oxide layer 12, a semiconductor layer 13 and a dielectric layer 14 are formed. The substrate 10 is, for example, but not limited to, a silicon substrate, a silicon germanium substrate, a silicon carbide substrate, or a substrate made of other semiconductor materials. The oxide layer 12 is, for example, silicon oxide, the semiconductor layer 13 is, for example, silicon layer, and the dielectric layer 14 is preferably a low dielectric constant (low-k) material, and the dielectric constant (k) is preferably less than 3, but not limited thereto. Above the substrate 10, a circuit device 20 and a package ring 30 located at the periphery of the circuit device are included. In the present embodiment, the circuit element 20 is, for example, an RF (radio frequency) circuit element, and besides an RF circuit, other electronic elements may be included, but for simplicity of the drawing, only the RF circuit element is taken as an example. The RF circuit in the present embodiment is mainly applicable to wireless communication, but is not limited thereto.

The encapsulation ring 30 surrounds the circuit component 20, and as mentioned in the prior art, the encapsulation ring is a complete enclosed pattern, which may shield the signal emitted by the circuit component and reduce the sensitivity of the circuit component. Therefore, in the present embodiment, the package ring 30 is divided into two parts, i.e. an inner package ring 31 and an outer package ring 32, wherein the inner package ring 31 comprises a plurality of inner package components 31-1, the inner package components 31-1 are spaced apart from each other and surround the circuit component 20, and an opening 33 is left between every two adjacent inner package components 31-1. That is, the plurality of inner packing elements 31-1 collectively constitute the inner packing ring 31. Similarly, the outer package ring 32 includes a plurality of outer package components 32-1, each outer package component 32-1 is spaced apart from each other and surrounds the circuit component 20, and an opening 34 is left between each two adjacent outer package components 32-1. That is, the plurality of outer package elements 32-1 collectively make up the outer package ring 32. Further, the outer packing ring 32 is arranged around the outside of the inner packing ring 31.

Referring to fig. 2, in the present embodiment, the inner package ring 31 or the outer package ring 32 includes a plurality of conductive pillars 36 and conductive layers 37 stacked alternately, and a contact structure 38 is further included at the bottom of each package ring, wherein the contact structure 38 is used to connect the package ring and the substrate 10, and can ground the package ring. The conductive pillars 36, the conductive layer 37 and the contact structure may include conductive materials such as metal, for example, tungsten, gold, copper, aluminum, etc., but not limited thereto.

Referring to fig. 3, it is noted that each of the outer package elements 32-1 is preferably arranged at a position corresponding to the opening 33 between two adjacent inner package elements 31-1. For example, in FIG. 3, two adjacent inner package components 31-1 are arranged in a first direction (e.g., X-axis), and the outer package component 32-1 is arranged in a second direction (e.g., Y-axis) corresponding to the position of the opening 33. In addition, along a second direction (e.g., Y-axis), a portion of the outer enclosure component 32-1 overlaps the first enclosure component 31-1 (e.g., left and right sides of the outer enclosure component 32-1 in fig. 3). In addition, the inner encapsulating ring 31 and the outer encapsulating ring 32 are not completely closed, leaving a part of the gap 35 between the two encapsulating rings. The advantage of this ring structure is that the inner and outer encapsulating rings 31, 32 surround the circuit element 20, but some gaps 35 are left between the two encapsulating rings, so that the signal transmission effect on the circuit element 20 is small. For example, if the circuit element 20 is an RF circuit, wireless transmission is required, because the two package rings are not completely closed, wireless signals are less susceptible to interference shielding, and because the RF circuit is still surrounded by the package rings, the RF circuit can be protected.

The following description will be directed to different embodiments of the package ring of the present invention, and for simplicity, the following description will mainly be made for the different embodiments, and will not be repeated for the same parts. In addition, the same elements in the embodiments of the present invention are denoted by the same reference numerals to facilitate the comparison between the embodiments.

The package ring of the first embodiment has some disadvantages that the wafer (substrate 10) may be cooled by water when the wafer is subjected to the dicing step, but the water may flow along the gap 35 and reach the circuit element 20 through the low-k material (dielectric layer 14), thereby affecting the quality of the circuit element 20. In addition, certain low dielectric constant materials are susceptible to reaction with water, such as Fluorinated Silicate Glass (FSG) which, when exposed to water, will produce hydrogen fluoride, thereby corroding metals, such as circuit components 20.

Referring to fig. 4 × 7, fig. 4 is a schematic top view of a semiconductor structure according to a second preferred embodiment of the present invention, fig. 5 is a partially enlarged view of a package ring shown in fig. 4, fig. 6 is a schematic cross-sectional view of the semiconductor structure shown in fig. 5 along a section line B-B ', and fig. 7 is a schematic cross-sectional view of the semiconductor structure shown in fig. 5 along a section line D-D'. As shown in fig. 4, the package ring 30 of the present embodiment also includes an inner package ring 31 and an outer package ring 32, the inner package ring 31 includes a plurality of inner package components 31-1 arranged at intervals, and the outer package ring 32 includes a plurality of outer package components 32-1 arranged at intervals, similar to the first preferred embodiment.

The present invention is different from the first preferred embodiment in that a plurality of sets of fence-like encapsulation structures 40 are further formed at each of the gaps 35 of the inner encapsulation element 31-1 and the outer encapsulation element 32-1, wherein the arrangement direction of the fence-like encapsulation structures 40 is perpendicular to the inner encapsulation element 31-1 and the outer encapsulation element 32-1, for example, in fig. 5, the fence-like encapsulation structures 40 are arranged toward the Y-axis direction, and the inner encapsulation element 31-1 and the outer encapsulation element 32-1 are arranged toward the X-axis direction.

Referring to fig. 5, the fence-shaped package structures 40 include a plurality of first fence-shaped package structures 41 and a plurality of second fence-shaped package structures 42 alternately arranged. Wherein each first fence-like encapsulation structure 41 contacts the inner encapsulation element 31-1, each second fence-like encapsulation structure 42 contacts the outer encapsulation element 32-1, but each first fence-like encapsulation structure 41 and each second fence-like encapsulation structure 42 do not contact each other. Therefore, a curved path 45 still remains between each first fence-like encapsulation structure 41 and each second fence-like encapsulation structure 42, and it should be noted that the width of the curved path 45 in this embodiment is much smaller than the gap 35 (refer to fig. 3) in the above-mentioned first embodiment, preferably, the width W1 of the curved path 45 (i.e. the shortest distance between the first fence-like encapsulation structure 41 and the adjacent second fence-like encapsulation structure 42) is much smaller than the spacing width W2 between two encapsulation rings (also corresponding to the gap 35 in the first embodiment), and in some embodiments, W2/W1>10, but is not limited thereto.

In addition, the width of each first fence encapsulation structure 41 or each second fence encapsulation structure 42 is much smaller than the width of the inner encapsulation element 31-1 and the outer encapsulation element 32-1. For example, referring to fig. 5, the width of the inner package element 31-1 and the width of the first fence-like package structure 41 are defined as W3, and the width of the inner package element 31-1 is defined as W4, wherein W4/W3>20 is preferred, but the invention is not limited thereto.

In addition, the distance or width (along the Y-axis direction, for example) of the first fence-like encapsulation structure 41 from the outer encapsulation element 32-1 is defined as W5, and in the embodiment, it is preferable that W2/W5>3, but is not limited thereto.

The proportion of the width W1-W5 is adjusted, which is helpful to prevent moisture from entering the packaging ring through the gap between the packaging elements, thereby achieving the effect of protecting the internal circuit elements.

In this embodiment, the first fence-shaped package structure 41 and the second fence-shaped package structure 42 can be formed simultaneously with the inner package ring 31 or the outer package ring 32, in some embodiments, the first fence-shaped package structure 41 and the inner package ring 31 can be an integrally formed structure, and similarly, the second fence-shaped package structure 42 and the outer package ring 32 can be an integrally formed structure. Referring to fig. 6, 7 and 8, fig. 6 is a cross-sectional view of the semiconductor structure of fig. 5 along a section line B-B ', fig. 7 is a cross-sectional view of the semiconductor structure of fig. 5 along a section line D-D', and fig. 8 is a top view of the conductive layer and the conductive pillar connected to the first fence-shaped package structure. The first fence-shaped package structure 41 can be directly connected to the conductive pillars 36 and/or the conductive layer 37 of the inner package ring 31, and the second fence-shaped package structure 42 can be directly connected to the conductive pillars 36 and/or the conductive layer 36 of the outer package ring 32. As shown in fig. 8, the left side of fig. 8 shows a schematic diagram of the conductive layer 37 of the first package element 31 being connected to the first fence-shaped package structure 41, and the right side of fig. 8 shows a schematic diagram of the conductive pillar 36 of the first package element 31 being connected to the first fence-shaped package structure 41. Note that, for convenience of illustration, the conductive layer 37 and the conductive pillar 36 are shown on two sides in fig. 8, but the conductive layer 37 and the conductive pillar 36 should actually overlap. In addition, the top view structure of the outer package ring 32 connected to the second fence-shaped package structure 42 is similar to the connection method of the inner package ring 31 and the first fence-shaped package structure 41 illustrated in fig. 8, and therefore, the description thereof is omitted.

In addition, in other embodiments, the fence-like encapsulation structure 40 may be formed only beside the conductive layer 37 and not beside the conductive pillars 36, that is, the first fence-like encapsulation structure 41 may be formed beside the conductive layer 37 of the inner encapsulation ring 31 and connected to the conductive layer 37 but not beside the conductive pillars 36 of the inner encapsulation ring 31; the second fence-like package structure 42 may be formed beside the conductive layer 37 of the outer package ring 32 and connected to the conductive layer 37, but not formed beside the conductive pillars 36 of the outer package ring 32, and also falls within the scope of the present invention.

In addition, please refer to fig. 9, which illustrates a partially enlarged view of the corner of the package ring according to the present embodiment. In the present embodiment, the inner package ring 31 and the outer package ring 32 surround the middle circuit element 20, and at the corners of the package ring (e.g., the corners C in fig. 4), the package ring may be designed in a shape of a bevel. For example, in the present embodiment, the package rings surrounding the circuit element 20 are mainly arranged in a first direction (e.g., X direction) or a second direction (e.g., Y direction), and the inner package ring 31 and the outer package ring 32 at the corners are both designed as oblique sides and arranged in a third direction (e.g., D3 direction, wherein D3 is, for example, a 45 degree angle, but not limited thereto). Since the boundary of the scribe line 60 is more likely to generate larger stress and may damage the surrounding package ring in the subsequent wafer dicing process, the package ring at the corner can be far away from the boundary of the scribe line 60 (e.g., the boundary 61 in fig. 9) by this design, and damage to the package ring during the dicing process can be reduced.

Furthermore, in the present invention, the contact structure 38 is not required to be formed under each of the inner package element or the outer package element, but the contact structure may be formed under only a portion of the inner package element or the outer package element to connect the substrates. For example, contact structures may be formed near the four corners of the package ring for grounding, and the rest of the contact structures may be omitted. The above-mentioned structure also falls into the scope of the present invention.

The present invention is characterized in that the fence-like package structure 40 is disposed between the inner package ring 31 and the outer package ring 32, so that the width of the gap 35 between the inner package ring 31 and the outer package ring 32 is greatly reduced, and thus, moisture can be effectively prevented from entering the circuit device 20 from the gap between the inner package ring 31 and the outer package ring 32. It should be noted that, in the present embodiment, after the fence-like encapsulating structure 40 is disposed, the inner encapsulating ring 31 and the outer encapsulating ring 32 are not completely contacted to form a closed structure, that is, the curved path 45 is still left. The signal transmission effect on the circuit element 20 is also less affected. Therefore, moisture is prevented from entering the low-k material 14 and the circuit device 20, and the performance of the circuit device 20 is maintained. In addition, the packaging ring is designed into a bevel edge at the corner, so that the packaging ring at the corner is far away from the junction of the cutting channels, and the effect of protecting the central circuit element can be achieved.

The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in the claims of the present invention should be covered by the present invention.