阅读说明：本技术 一种多中介层互联的集成电路 (Integrated circuit with multiple interconnected intermediate layers ) 是由 陶军磊 赵南 张晓东 王晨 于 2019-01-18 设计创作，主要内容包括：一种多中介层互联的集成电路,涉及电子技术领域,用于提高不同硅中介层互联时,传输的信号质量。所述多中介层互联的集成电路包括：采用低损耗连接器(304)将第一半导体中介层(301)和第二半导体中介层(302)中的互联电路形成电连接以实现不同半导体中介层之间的互联,由于低损耗连接器(304)的损耗较小,从而使得不同半导体中介层上设置的裸片之间的信号传输路径上的传输损耗较小,进而提高了该传输路径上的信号质量。(An integrated circuit with interconnection of multiple interposers relates to the technical field of electronics, and is used for improving the quality of signals transmitted when different silicon interposers are interconnected. The multi-interposer interconnected integrated circuit comprises: the interconnection circuits in the first semiconductor interposer (301) and the second semiconductor interposer (302) are electrically connected by adopting the low-loss connector (304) to realize interconnection between different semiconductor interposers, and because the loss of the low-loss connector (304) is smaller, the transmission loss on a signal transmission path between dies arranged on different semiconductor interposers is smaller, and the signal quality on the transmission path is further improved.)