阅读说明：本技术 半导体装置 (Semiconductor device with a plurality of semiconductor chips ) 是由 段志刚 陈京好 于 2021-05-31 设计创作，主要内容包括：本发明公开一种半导体装置,包括：基板；以及至少一个电容器元件,在该基板上,其中,该至少一个电容器元件包括：第一电极,具有第一焊盘和连接至该第一焊盘的第一端子,其中,该第一端子远离该基板延伸；以及第二电极,具有第二焊盘和连接至该第二焊盘的第二端子,其中,该第二端子向该基板延伸,其中,该第一端子和该第二端子由层间介电层错开并隔开。本发明的具有的电容器有更大的电容值,可以满足对较大电容值的需求,例如滤除噪声、存储更多的电荷等等。(The invention discloses a semiconductor device, comprising: a substrate; and at least one capacitor element on the substrate, wherein the at least one capacitor element comprises: a first electrode having a first pad and a first terminal connected to the first pad, wherein the first terminal extends away from the substrate; and a second electrode having a second pad and a second terminal connected to the second pad, wherein the second terminal extends toward the substrate, wherein the first terminal and the second terminal are staggered and separated by an interlayer dielectric layer. The capacitor provided by the invention has larger capacitance value, and can meet the requirement of larger capacitance value, such as noise filtering, more charge storage and the like.)

1. A semiconductor device, comprising:

a substrate; and

at least one capacitor element on the substrate, wherein the at least one capacitor element comprises: a first electrode having a first pad and a first terminal connected to the first pad, wherein the first terminal extends away from the substrate; and a second electrode having a second pad and a second terminal connected to the second pad, wherein the second terminal extends toward the substrate, wherein the first terminal and the second terminal are staggered and separated by an interlayer dielectric layer.

2. The semiconductor device of claim 1, further comprising a dielectric layer between the substrate and the at least one capacitor element.

3. The semiconductor device according to claim 1, wherein the at least one capacitor element comprises a plurality of capacitor elements sequentially stacked on the substrate.

4. The semiconductor device according to claim 3, wherein the first pad of a next one of the capacitor elements is connected to the second pad of a previous one of the capacitor elements.

5. The semiconductor device according to claim 4, wherein the second pad of a next one of the capacitor elements is connected to the first pad of a previous one of the capacitor elements.

6. The semiconductor device according to claim 5, wherein a dielectric layer and a conductive layer in the dielectric layer are provided between a next one of the capacitor elements and a previous one of the capacitor elements.

7. The semiconductor device of claim 1, further comprising a first integrated circuit element on the substrate, the first integrated circuit element being substantially level with the at least one capacitor element.

8. The semiconductor device according to claim 7, further comprising: a second integrated circuit element over and connected to the first integrated circuit element; and a third integrated circuit element over the at least one capacitor element.

9. A semiconductor device, comprising:

a substrate; and

at least one capacitor element on each of the opposing surfaces of the substrate, wherein the at least one capacitor element comprises: a first electrode having a first pad and a first terminal connected to the first pad, wherein the first terminal extends away from the substrate; and a second electrode having a second pad and a second terminal connected to the second pad, wherein the second terminal extends toward the substrate, wherein the first terminal and the second terminal are staggered and separated by an interlayer dielectric layer.

10. The semiconductor device according to claim 9, wherein the at least one capacitor element comprises a plurality of capacitor elements stacked in sequence on each of the opposite surfaces of the substrate.

11. The semiconductor device according to claim 10, wherein the first pad of a next one of the capacitor elements is connected to the second pad of a previous one of the capacitor elements.

12. The semiconductor device according to claim 11, wherein the second pad of a next one of the capacitor elements is connected to the first pad of a previous one of the capacitor elements.

13. The semiconductor device according to claim 9, wherein a sum of thicknesses of each of the capacitor elements is less than 100 μm.

14. The semiconductor device according to claim 9, further comprising: a first integrated circuit element disposed above the at least one capacitor element on the upper surface of the substrate, and/or a second integrated circuit element disposed below the at least one capacitor element below the lower surface of the substrate.

15. The semiconductor device according to claim 14, further comprising: a third integrated circuit element arranged over the upper surface of the substrate; and/or a fourth integrated circuit element disposed below the lower surface of the substrate; wherein the third integrated circuit element is connected to the first integrated circuit element and the fourth integrated circuit element is connected to the second integrated circuit element.

16. A semiconductor device, comprising:

a substrate; and

at least one capacitor element on the substrate, wherein the at least one capacitor element comprises: a first electrode having a first pad and a first terminal connected to the first pad, wherein the first terminal extends away from the substrate; and a second electrode having a second pad and a second terminal connected to the second pad, wherein the second terminal extends toward the substrate, wherein the first terminal and the second terminal are staggered and separated by an interlayer dielectric layer;

a first integrated circuit element on the substrate;

and a connecting member penetrating through the substrate.

17. The semiconductor device according to claim 16, further comprising a dielectric layer over the at least one capacitor element.

18. The semiconductor device of claim 17, wherein the connecting member penetrates the dielectric layer and the substrate and extends below a bottom surface of the substrate.

19. The semiconductor device according to claim 18, further comprising a second integrated circuit element over the dielectric layer, wherein the connection member is connected to the second integrated circuit element.

20. The semiconductor device according to claim 18, wherein the connection member is connected to the first pad.

Technical Field

The invention relates to the technical field of semiconductors, in particular to a semiconductor device.

Background

The semiconductor device may be applied to various fields such as a smart tv, a Voice Assistant Device (VAD), a tablet computer, a feature phone, a smart phone, an optical and blu-ray DVD player, and the like. Semiconductor devices are typically manufactured in the following manner: layers of insulating or dielectric, conductive and semiconductor materials are sequentially deposited on a semiconductor substrate, and various material layers are patterned (patterrn) by using photolithography and etching techniques to form circuit components and elements on top of those layers.

To continue the scaling down process of semiconductor devices, the functional density (i.e., the number of interconnected devices per chip area) has generally increased, while the geometry (i.e., the smallest component (or line) that can be created using the fabrication process) has decreased. Such scaled-down processes generally provide benefits by increasing the production efficiency and performance of semiconductor devices and reducing the associated costs. This shrinkage is accompanied by an increase in complexity in the design and manufacture of semiconductor devices. Parallel developments in manufacturing (parallel advances) have enabled increasingly complex designs to be accurately and reliably manufactured.

However, many challenges arise in efforts to continue to shrink the size of semiconductor devices. For example, fluctuations (or noise) in the power supply (otherwise known as power supply noise) can adversely affect the performance of the semiconductor device. In order to reduce power supply noise, a decoupling capacitor may be integrated into a semiconductor device and used as a charge reservoir to prevent power supply from accidentally dropping or rising. Existing decoupling capacitors for semiconductor devices have been generally adequate for their intended purposes, but they have not been entirely satisfactory in all respects.

Disclosure of Invention

Accordingly, the present invention is directed to a semiconductor device to solve the above-mentioned problems.

According to a first aspect of the present invention, there is disclosed a semiconductor device comprising:

a substrate; and

at least one capacitor element on the substrate, wherein the at least one capacitor element comprises: a first electrode having a first pad and a first terminal connected to the first pad, wherein the first terminal extends away from the substrate; and a second electrode having a second pad and a second terminal connected to the second pad, wherein the second terminal extends toward the substrate, wherein the first terminal and the second terminal are staggered and separated by an interlayer dielectric layer.

According to a second aspect of the present invention, there is disclosed a semiconductor device comprising:

a substrate; and

at least one capacitor element on each of the opposing surfaces of the substrate, wherein the at least one capacitor element comprises: a first electrode having a first pad and a first terminal connected to the first pad, wherein the first terminal extends away from the substrate; and a second electrode having a second pad and a second terminal connected to the second pad, wherein the second terminal extends toward the substrate, wherein the first terminal and the second terminal are staggered and separated by an interlayer dielectric layer.

According to a third aspect of the present invention, there is disclosed a semiconductor device comprising:

a substrate; and

at least one capacitor element on the substrate, wherein the at least one capacitor element comprises: a first electrode having a first pad and a first terminal connected to the first pad, wherein the first terminal extends away from the substrate; and a second electrode having a second pad and a second terminal connected to the second pad, wherein the second terminal extends toward the substrate, wherein the first terminal and the second terminal are staggered and separated by an interlayer dielectric layer;

a first integrated circuit element on the substrate;

and a connecting member penetrating through the substrate.

The semiconductor device of the present invention includes: a substrate; and at least one capacitor element on the substrate, wherein the at least one capacitor element comprises: a first electrode having a first pad and a first terminal connected to the first pad, wherein the first terminal extends away from the substrate; and a second electrode having a second pad and a second terminal connected to the second pad, wherein the second terminal extends toward the substrate, wherein the first terminal and the second terminal are staggered and separated by an interlayer dielectric layer. The capacitor is arranged on the substrate, so that the capacitor has larger arrangement space, and a plurality of capacitors can be formed to increase the number of the capacitors; and a plurality of capacitors may be stacked to reduce area occupation. Thus, the capacitor of the present invention has a larger capacitance value, which can meet the requirement of larger capacitance value, such as noise filtering, more charge storage, etc.

Drawings

Fig. 1-3 illustrate schematic cross-sectional views of semiconductor devices according to some embodiments of the invention.

Fig. 4-6 show schematic cross-sectional views of semiconductor devices according to other embodiments of the present invention.

Detailed Description

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the description below, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

In addition, in some embodiments of the present invention, terms such as "connected" and "interconnected" with respect to attachment, coupling, and the like, refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through one another. Intermediate structures and movable or rigid attachments or relationships, unless expressly stated otherwise. Additionally, the term "coupled" includes any method of direct and indirect electrical connection.

Furthermore, spatially relative terms such as "below," "under," "above," "over," and the like may be used herein for ease of description to facilitate describing the relationship of an element or feature. Another element or feature is shown. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terms "about," "approximately," and "about" generally mean within a range of ± 20% of a stated value, or ± 10% of the stated value, or ± 5% of the stated value, or ± 3% of the stated value, or ± 2% of the stated value, or ± 1% of the stated value, or ± 0.5% of the stated value. The specified values of the present invention are approximate values. Where not specifically stated, the stated values include the meanings of "about", "approximately" and "approximately". The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular terms "a", "an" and "the" are also intended to include the plural forms as well, unless the context clearly indicates otherwise.

Some embodiments of the invention are described below. Additional operations may be provided before, during and/or after the stages described in these embodiments. Certain stages described may be replaced or eliminated with respect to different embodiments. Additional features may be added to the semiconductor device structure. Some of the features described below may be replaced or eliminated with respect to different embodiments. Although some embodiments are discussed with operations performed in a particular order, the operations may be performed in another logical order.

As the performance of semiconductor devices increases, these high performance semiconductor devices require greater current at higher frequencies but with lower power supplies. In such cases, the design of power supply systems becomes increasingly challenging. For example, the effect of power supply noise on the performance of semiconductor devices is critical and should be addressed. The present invention provides a semiconductor device having at least one capacitor element as a decoupling capacitor to prevent power supply noise (e.g., unwanted power supply rise or fall) in the semiconductor device. In some embodiments, high density capacitor elements are provided to achieve higher capacitance for decoupling capacitors (decoupling capacitors) and higher compactness of semiconductor devices.

Fig. 1-3 illustrate schematic cross-sectional views of semiconductor devices according to some embodiments of the invention. Referring to fig. 1, a semiconductor device 10 includes a substrate 100 and at least one capacitor element 104 on the substrate 100. The substrate 100 may include a single crystal (single element) semiconductor, such as silicon or germanium having a crystal structure; compound semiconductors such as silicon carbide (SiC), gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), indium arsenide (InAs), and/or indium antimonide (InSb); alloy semiconductors such as SiGe, GeC, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP; non-semiconductor materials such as soda lime glass, fused silica, and/or calcium fluoride (CaF 2); and/or combinations thereof. For example, the material of the single crystal semiconductor may include single crystal silicon (Si), polycrystalline silicon (poly-Si), amorphous silicon (a-Si), germanium (Ge), and/or carbon (C) (e.g., diamond).

The capacitor element 104 includes a first electrode 111 and a second electrode 112. In some embodiments, the first and second electrodes 111 and 112 are formed in a first comb-shaped structure and a second comb-shaped structure, respectively. The first electrode 111 is configured to have a first pad 111P and a plurality of first terminals 111T connected to the first pad 111P. The first terminal 111T extends away from the substrate 100 (the first terminal 111T extends from the upper surface of the first pad 111P in a direction away from the substrate 100). The second electrode 112 is configured to have a second pad 112P and a second terminal 112T connected to the second pad 112P. The second terminal 112T extends toward the substrate 100 (the second terminal 112T extends from the lower surface of the first pad 112P in the direction toward the substrate 100). In some embodiments, the extending directions of the first terminal 111T and the second terminal 112T are parallel. As shown in fig. 1, the first terminal 111T and the second terminal 112T are interleaved and separated by the interlayer dielectric layer 106. In some embodiments, the terminals 111T and the second terminals 112T are alternately arranged in a horizontal direction parallel to the surface of the substrate. The substrate 100 extends between the first pad 111P and the second pad 112P in a direction perpendicular with respect to the surface of the substrate 100. In some embodiments, the capacitor element 104 may be included in a memory module, such as a DRAM cell, but is not limited thereto.

In some embodiments, the method of forming the capacitor element 104 includes (but is not limited to) depositing and patterning a material layer for the first pad 111P, depositing and patterning a material layer for the first terminal 111T on the first pad 111P (thereby forming the first electrode 111 of the capacitor element 104), depositing a material layer for the interlayer dielectric layer 106, patterning the material layer for the interlayer dielectric layer 106 to form an opening, depositing a material layer for the second terminal 112T in the opening, depositing and patterning a material layer for the second pad 112P on the second terminal 112T (thereby forming the second electrode 112 of the capacitor element 104). In some embodiments, patterning the material layer for the interlayer dielectric layer 106 to form the opening may include etching (e.g., dry etching, wet etching, Reactive Ion Etching (RIE)) the material layer to form the opening. In some embodiments, after depositing the material layer for the second terminal 112T in the opening, a planarization process such as a Chemical Mechanical Polishing (CMP) process may be performed to remove the excess material layer for the second terminal 112T.

The material of the first pad 111P and the second pad 112P may include a conductive material, such as a metal, a metal nitride, a metal oxide, a metal alloy, doped polysilicon, or another suitable conductive material, or a combination of these. For example, the metal may include Au, Ni, Pt, Pd, Ir, Ti, Cr, W, Al, Cu, or another suitable material; the metal nitride may include MoN, WN, TiN, TaN, TaSiN, TaCN, TiAlN, or other suitable material. In some embodiments, the first pad 111P and the second pad 112P may include the same material. In other embodimentsThe first pad 111P and the second pad 112P may include different materials. The material layers for the first and second pads 111P and 112P may be deposited by a Chemical Vapor Deposition (CVD) process, a Physical Vapor Deposition (PVD) process, an Atomic Layer Deposition (ALD) process, or the like. The material of the first terminal 111T and the second terminal 112T may be a high-k material including, for example, a metal oxide or a metal nitride. In some embodiments, the high-k material may include HfO₂HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, zirconia, alumina, hafnia-alumina (HfO)₂-Al₂O₃) Alloys, other suitable high-k dielectric materials, and/or combinations thereof. The material layers for the first terminal 111T and the second terminal 112T may be deposited by any suitable method, such as a CVD process, a plasma-enhanced CVD (PECVD) process, a spin-on-glass process, combinations thereof, and the like. In some embodiments, the first terminal 111T and the second terminal 112T may include the same material. In other embodiments, the first terminal 111T and the second terminal 112T may include different materials. According to some embodiments of the present invention, the first pad 111P and the second pad 112P may each include Cu, W, or SiGe, and the first terminal 111T and the second terminal 112T may each include TiN or TaN.

The inter-metal dielectric (IMD) layer 106 (or IMD) may include a dielectric material (e.g., a semiconductor oxide, a semiconductor nitride, a semiconductor oxynitride, a semiconductor carbide, etc.), SOG, fluoride-doped silicate glass (FSG), phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), xerogel, aerogel, amorphous carbon fluoride, parylene, benzocyclobutene (BCB), and/or combinations thereof. the inter-metal dielectric layer 106 may be formed by a CVD process, an ALD process, a PECVD process, a high density CVD process, a PVD process, one or more other suitable processes, or combinations thereof.

In some embodiments, the semiconductor device 10 includes a dielectric layer 101 disposed between the substrate 100 and the capacitor element 104. The dielectric layer 101 may be a single layer or a multi-layer structure including a dielectric material formed of a semiconductor oxide, a semiconductor nitride, a semiconductor oxynitride, a semiconductor carbide, or a combination thereof. The dielectric layer 101 may be formed by a CVD process, an ALD process, a PVD process, one or more other suitable processes, or a combination thereof.

According to some embodiments of the present invention, the semiconductor device 10 includes a plurality of capacitor elements 104 sequentially stacked on the substrate 100. In some embodiments, the capacitor elements 104 are sequentially stacked on the dielectric layer 101. The capacitor element 104 having the first electrode 111 and the second electrode 112 can form a more compact capacitor and can be used as a decoupling capacitor to provide a higher capacitance than a conventional decoupling capacitor. The capacitance provided by the capacitor element 104 of some embodiments of the present invention may be greater than 2.5 times the capacitance provided by conventional decoupling capacitors. For example, a conventional decoupling capacitor (e.g., a cylindrical or plate-shaped decoupling capacitor) having a thickness of 100 μm may provide approximately 600-1300nF/mm²(capacitance/area) value, while a capacitor element 104 (including the first electrode 111 and the second electrode 112) having a thickness of less than 100 μm may provide a capacitance of more than 1200-²Value of (capacitance/area). The capacitor element 104 of some embodiments of the present invention has a higher value of capacitance/area and a smaller thickness, and may be used as a decoupling capacitor for the semiconductor device 10. Therefore, power supply noise in the semiconductor device 10 can be prevented from this situation due to the higher value of capacitance/area provided by the capacitor element 104. In addition, since the thickness of the semiconductor device 10 having the decoupling capacitor (i.e., the capacitor element 104) is reduced, parasitic inductance and resistance will be reduced.

In some embodiments, the semiconductor device 10 may include one or more dielectric layers 102 between the next one of the capacitor elements 104 and the previous one of the capacitor elements 104 (i.e., adjacent capacitor elements 104 are spaced apart using the dielectric layers 102). As shown in FIG. 1, conductive layers Mla/Mlb, M2a/M2b, and M3a/M3b are disposed in respective dielectric layers 102, and vias V1a/V1b, V2a/V2b, and V3a/V3b are disposed in respective interlayer dielectric layers 106. In some embodiments, the first pad 111P of the next one of the capacitor elements 104 is connected to the second pad 112P of the previous one of the capacitor elements 104 through, for example, the via Vlb, the conductive layer Mlb, and the via V2b, and the second pad 112P of the next one of the capacitor elements 104 is connected to the first pad 111P of the previous one of the capacitor elements 104 through, for example, the via V1a and the conductive layer M1 a. The number of capacitor elements 104 successively stacked on the substrate 100 is not particularly limited. The number may be two, six, twenty-one, or fifty or more. In some embodiments, the overall thickness of the semiconductor device 10 with the capacitor element 104 is less than 150 μm. The capacitor elements 104 stacked in succession may form a high density of decoupling capacitors in the semiconductor device 10 and provide a greater capacitance than conventional decoupling capacitors. In addition, the thickness of the decoupling capacitor formed by the capacitor element 104 is smaller than that of the conventional decoupling capacitor. Therefore, the resulting semiconductor device having the capacitor element 104 is thinner than a semiconductor device having a conventional decoupling capacitor, and better heat dissipation of the resulting semiconductor device can be achieved. In addition, in the prior art, capacitors may be disposed in the substrate 100, so that the size and number of the capacitors are limited, and thus the capacitance value is small, and the increasing demand for the capacitance cannot be met. The capacitor is disposed above the substrate 100 in the present invention, and thus has a larger arrangement space, and a plurality of capacitors can be formed to increase the number of capacitors; and a plurality of capacitors may be stacked to reduce area occupation. Thus, the capacitor of the present invention has a larger capacitance value, which can meet the requirement of larger capacitance value, such as noise filtering, more charge storage, etc.

Referring to fig. 2, the capacitor element 104 and an IC (Integrated Circuit) element 108 may be Integrated on the same substrate 100. For simplicity, like features in fig. 2 and 1 are denoted by like reference numerals, and some descriptions are not repeated. Separation S indicates that one or more elements may be disposed between capacitor element 104 and IC element 108, or, in some embodiments, capacitor element 104 is adjacent to IC element 108 and no other elements are disposed therebetween. The IC element 108 may include a memory device, a Graphics Processing Unit (GPU), a Central Processing Unit (CPU), or any other processing unit or control unit. In some embodiments, the IC elements 108 may be connected to the capacitor elements 104 via interconnects (not shown) to prevent noise from the power sources of the IC elements 108, e.g., the capacitor elements 104 may filter out noise from the power sources of the IC elements 108. It should be noted that the IC component 108 disposed between the dielectric layers 101 and 102 is merely exemplary. In some embodiments, the IC component 108 may be disposed on the dielectric layer 102 and substantially at the same level as the capacitor component 104. In some embodiments, the IC element 108 may be connected to another element through the via V1c, the conductive layer M1c, the via V2c, and the conductive layer M2 c.

Referring to fig. 3, semiconductor device 10 includes a primary logic die including IC components 110 and 114 attached to dielectric layer 102, in accordance with some embodiments of the present invention. For simplicity, like features in fig. 3 and fig. 1 and 2 are denoted by like reference numerals, and some descriptions are not repeated. The IC components 110 and 114 may include memory, a Graphics Processing Unit (GPU), a Central Processing Unit (CPU), or a combination thereof. The semiconductor device 10 may include connection members C1 and C2 penetrating the substrate 100. In further embodiments, the connection features C1 and C2 penetrate through the dielectric layer 102, the interlayer dielectric layer 106, the dielectric layer 101, and the substrate 100 and extend below the bottom surface of the substrate 100. In some embodiments, the connection members C1 and C2 may be connected to respective solder bumps under the substrate 100. In some embodiments, connection components C1 and C2 may be connected to IC components 114 and 110, respectively. In some embodiments, the connection components C1 and C2 may be bonded to, for example, a printed Circuit Board (CB). In some embodiments, the second pad 111P of one of the capacitor elements 104 may be connected to the connection part C1. In some embodiments, the connection parts C1 and C2 may be formed by a method including Through Silicon Via (TSV) technology. Wherein the connecting member C1 may also be connected with the second one of the capacitor elements 104The first pad 111P of the one electrode 111 is connected (also connected to the second pad 112P of the second electrode 112 of the next capacitor element 104 through the conductive layer M1a, the via hole V1 a), and therefore the connection member C1 can be connected not only to the IC element 114 but also to the electrode of the capacitor element, and therefore the connection member C1 can shorten the connection path while improving the integration of wiring. In addition, the connecting member C2 may be connected to other wirings or elements as necessary. The integration of the main logic die (including IC components 110 and 114), capacitor component 104, and IC component 108 on the same substrate 100. Such integration may be referred to as heterogeneous integration, which represents the integration of system on a chip (SoC), memory, power management, and/or other components. In some embodiments, the semiconductor device 10 may include a plurality of sets of capacitor elements 104 disposed on the substrate 100, and each of the plurality of sets of capacitor elements may be respectively connected to components heterointegrated in the semiconductor device 10. The multiple sets of capacitor elements 104 may be used as decoupling capacitors to provide higher capacitance for the assembly. Further, the thickness of the semiconductor device 10 having a plurality of sets of capacitor elements (serving as decoupling capacitors) is smaller than that of a semiconductor device having a conventional decoupling capacitor. For example, one embodiment of the present invention may provide a thickness equal to or less than 100 μm and a value greater than 2600nF/mm²(capacitance/area) decoupling capacitors, whereas the thickness of conventional decoupling capacitors may need to be greater than 260 μm, so that greater than 2600nF/mm can be achieved²Value of (capacitance/area). Thus, according to some embodiments of the present invention, parasitic inductance and resistance of heterogeneous integration with a decoupling capacitor may be reduced by providing a thinner decoupling capacitor. In some embodiments, IC component 108 may include a memory and IC component 110 may include a CPU. In such an embodiment, by connecting the IC component 108 and the IC component 110 through the via V1c, the via V2c, and the like, the performance of the semiconductor device can be improved due to the shorter physical path for data communication between the CPU and the memory.

Fig. 4-6 show schematic cross-sectional views of semiconductor devices according to other embodiments of the present invention. Referring to fig. 4, the semiconductor device 20 includes a substrate 100 and at least one capacitor element 104 on each of opposite surfaces of the substrate 100. For simplicity, like features in the semiconductor device 20 and the semiconductor device 10 are denoted by like reference numerals, and some descriptions are not repeated. The capacitor element 104 of the semiconductor device 20 includes a first electrode 111 and a second electrode 112. The first electrode 111 is configured to have a first pad 111P and a first terminal 111T connected to the first pad 111P. The first terminal 111T extends away from the substrate 100. The second electrode 112 is configured to have a second pad 112P and a second terminal 112T connected to the second pad 112P. The second terminal 112T extends toward the substrate 100. As shown in fig. 4, the first terminal 111T and the second terminal 112T are interleaved and separated by the interlayer dielectric layer 106. The materials of the first and second pads 111P and 112P may include: a conductive material, such as a metal, a metal nitride, a metal oxide, a metal alloy, another suitable conductive material, and combinations thereof. The material of the first terminal 111T and the second terminal 112T may be a high-k material including, for example, a metal oxide or a metal nitride. The method of forming the capacitor element 104 of the semiconductor device 20 is similar to that described above with respect to the semiconductor device 10 in fig. 1. In the present embodiment, the capacitor elements and/or the stack of the capacitor elements are formed on the opposite sides of the substrate 100, so that the integration degree is higher, and the integrated semiconductor device 20 can be inserted between the components such as the die, and the flexibility of use is higher, and the capacitor elements on the two sides can be connected or not connected to each other, and have better design flexibility. Wherein the capacitor elements on both sides are connected to each other by connecting the electrodes of the capacitor, for example by means of vias.

In some embodiments, the capacitor element 104 includes a plurality of capacitor elements 104 stacked or laminated successively on each of the opposing surfaces of the substrate 100. In some embodiments, the sum of the thicknesses of each capacitor element 104 is less than 100 microns-in some embodiments, the thickness of each capacitor element 104 is about 2 μm. In some embodiments, the thickness of the semiconductor device 20 with the capacitor element 104 is less than 150 μm. The successively stacked capacitor elements 104 may form a high density capacitor on the opposite surface of the substrate 100 and may serve as a decoupling capacitor to provide a higher capacitance than conventional decoupling capacitors. Therefore, power supply noise in the semiconductor device 20 can be more effectively prevented compared to the conventional decoupling capacitor.

In some embodiments, the semiconductor device 20 may include one or more dielectric layers 102 between the next one of the capacitor elements 104 and the previous one of the capacitor elements 104. As shown in fig. 4, conductive layers Mla/Mlb and conductive layers M2a/M2b are disposed in respective dielectric layers 102, and vias V1b, V2b, V3b, and V4b are disposed in respective interlayer dielectric layers 106. In some embodiments, for the capacitor element 104 below the lower surface of the semiconductor device 20, the first pad 111P of the next one of the capacitor elements 104 is connected to the second pad 112P of the previous one of the capacitor elements 104 through, for example, the via hole Vlb, the conductive layer M1b, and the via hole V2b, and the second pad 112P of the next one of the capacitor elements 104 is connected to the first pad 111P of the previous one of the capacitor elements 104 through, for example, the conductive layer M1 a. Similarly, in some embodiments, with respect to the capacitor elements 104 on the upper surface of the semiconductor device 20, the first pad 111P of the next one of the capacitor elements 104 is connected to the second pad 112P of the previous one of the capacitor elements 104 through, for example, the via V3b, the conductive layer M2b, and the via V4b, and the second pad 112P of the next one of the capacitor elements 104 is connected to the first pad 111P of the previous one of the capacitor elements 104 through, for example, the conductive layer M2 a. The number of capacitor elements 104 successively stacked on the opposite surfaces of the substrate 100 is not particularly limited. The number may be 1, 11, 30 or 50 or more.

Referring to fig. 5, an embodiment describing a hybrid structure formed by at least two die bonding techniques, according to other embodiments of the present invention, the semiconductor device 20 includes a primary logic die comprising an IC component 116 attached to a dielectric layer 102. For simplicity, like features in fig. 5 and 4 are denoted by like reference numerals, and some descriptions are not repeated. The IC components 116 may include memory, a Graphics Processing Unit (GPU), a Central Processing Unit (CPU), or a combination thereof. The semiconductor device 20 may include connection parts C3, C4, and C5 that may be bonded to, for example, a Printed Circuit Board (PCB). In some embodiments, the connection features C3, C4, and C5 may be formed by methods including Through Silicon Via (TSV) technology. As shown in fig. 5, in some embodiments, the second pad 112P of the next one of the capacitor elements 104 is connected to the first pad 111P of the previous one of the capacitor elements 104 through the connection member C4. In which the connection member C4 can also be connected to the first pad 111P of the first electrode 111 of the capacitor element 104, so the connection member C4 can be connected not only to the IC element 116 but also to the electrode of the capacitor element, and therefore the connection member C4 can shorten the connection path while improving the integration of the wiring. The connecting members C3 and C5 may be connected to other wires or elements as necessary.

Referring to fig. 6, which depicts a hybrid structure formed by at least three die bonding techniques, semiconductor device 20 includes a primary logic die containing an IC element 117 attached to an IC 117, the IC element 117 attached to an interlayer dielectric layer 106. According to other embodiments of the present invention, the substrate 100 and another primary logic die containing the IC component 118 are attached to the interlayer dielectric layer 106 below the lower surface of the substrate 100. In some embodiments, a main logic chip containing IC element 117 is attached to interlayer dielectric layer 106 of topmost capacitor element 104, and a main logic chip containing IC element 118 is attached to interlayer dielectric layer 106 below bottommost capacitor element 104. For simplicity, like features in fig. 6 and 4 are denoted by like reference numerals, and some descriptions are not repeated. In some embodiments, semiconductor device 20 may include IC component 120 connected to IC component 117 through via V3c and IC component 122 connected to IC component 118 through via V1 c. Fig. 6 illustrates another example of heterogeneous integration, in which two primary logic dies are attached to respective interlayer dielectric layers 106 above and/or below at least one capacitor element on opposing surfaces of the substrate 100, respectively, according to some embodiments of the invention. Where IC component 117 and IC component 118 may be present in only one or both. In such embodiments of heterogeneous integration, the semiconductor device 20 may be thinner and more compact since devices are integrated on opposite sides of the same substrate 100, and communication between components is more efficient since shorter physical paths between components are provided.

Embodiments of the present invention provide a number of benefits for semiconductor devices. For example, power supply noise in the semiconductor device can be more effectively prevented by the capacitor element, and a stable power supply can be obtained. The capacitor element can form a decoupling capacitor with high density to provide a thinner decoupling capacitor for the semiconductor device. In addition, this can improve heat dissipation in the semiconductor device having the decoupling capacitor.

Those skilled in the art will readily observe that numerous modifications and variations of the apparatus and method may be made while maintaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.