阅读说明：本技术 一种数据处理装置及方法 (Data processing device and method ) 是由 檀珠峰 李宗岩 于 2020-02-28 设计创作，主要内容包括：本申请实施例公开了一种数据处理装置及相关方法,其中,一种数据处理装置,可包括堆叠封装的第一芯片和第二芯片；所述第一芯片包括通用处理器、总线和至少一个第一专用处理单元DPU,所述通用处理器和所述至少一个第一专用处理单元连接至所述总线,所述通用处理器用于产生数据处理任务；所述第二芯片包括第二专用处理单元,所述至少一个第一专用处理单元中的一个或多个第一专用处理单元和所述第二专用处理单元中的至少一个能够基于所述计算功能处理所述数据处理任务的至少一部分；其中,所述第一芯片和所述第二芯片通过芯片间互连线相互连接。该数据处理装置可以在不增加产品体积的情况下,满足用户越来越高的功耗和运算需求。(The embodiment of the application discloses a data processing device and a related method, wherein the data processing device can comprise a first chip and a second chip which are packaged in a stacked mode; the first chip comprises a general-purpose processor, a bus and at least one first special-purpose processing unit (DPU), wherein the general-purpose processor and the at least one first DPU are connected to the bus, and the general-purpose processor is used for generating data processing tasks; the second chip comprises second dedicated processing units, at least one of the second dedicated processing units and one or more of the at least one first dedicated processing units being capable of processing at least a portion of the data processing tasks based on the computational functionality; wherein the first chip and the second chip are connected to each other by an inter-chip interconnect. The data processing device can meet the higher and higher power consumption and operation requirements of users under the condition of not increasing the product volume.)